The XCVU125-2FLVC2104E is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU125-2FLVC2104E features advanced 20nm technology with impressive specifications that make it ideal for complex digital signal processing and high-speed computing applications. This FPGA includes 1,728,000 system logic cells with 2,520 DSP slices for intensive mathematical operations. The device offers substantial memory resources with 46.5 Mb of block RAM and 360 Mb of UltraRAM, providing ample storage for data-intensive applications.
Built on the UltraScale+ architecture, the XCVU125-2FLVC2104E supports DDR4 memory interfaces and high-speed transceivers capable of operating at speeds up to 32.75 Gbps. The device operates with a core voltage of 0.85V and supports multiple I/O standards including LVDS, LVTTL, and high-speed differential signaling. With its FLVC2104 package, this FPGA provides 832 user I/O pins in a flip-chip land grid array format.
The speed grade -2 designation indicates this device offers balanced performance and power consumption, making it suitable for applications requiring reliable operation across various environmental conditions. The device supports advanced clocking resources with up to 24 clock management tiles (CMTs) and multiple phase-locked loops (PLLs) for precise timing control.
Price
Pricing for the XCVU125-2FLVC2104E varies based on order quantity, delivery requirements, and market conditions. This high-performance FPGA typically falls within the premium pricing tier due to its advanced capabilities and extensive resources. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Educational institutions and research organizations may be eligible for special pricing programs.
Factors affecting the XCVU125-2FLVC2104E price include global semiconductor market conditions, manufacturing capacity, and regional availability. Long-term supply agreements and scheduled deliveries often provide more favorable pricing structures for high-volume applications.
Documents & Media
Comprehensive documentation for the XCVU125-2FLVC2104E includes detailed datasheets, user guides, and application notes available through Xilinx’s official website. The primary datasheet provides electrical specifications, timing parameters, and package information essential for design implementation.
Development resources include reference designs, IP core libraries, and example projects that demonstrate the capabilities of the XCVU125-2FLVC2104E. Vivado Design Suite provides the primary development environment with integrated synthesis, implementation, and debugging tools specifically optimized for this device.
Video tutorials and webinars covering advanced design techniques, optimization strategies, and best practices for the XCVU125-2FLVC2104E are available through Xilinx’s training portal. Technical support documentation includes troubleshooting guides, errata notices, and compatibility matrices for various development tools and IP cores.
Related Resources
The XCVU125-2FLVC2104E ecosystem includes evaluation boards, development kits, and reference platforms that accelerate prototyping and development cycles. Popular evaluation platforms provide pre-configured hardware with comprehensive software support and example designs.
Third-party IP cores and design services complement the XCVU125-2FLVC2104E capabilities, offering specialized functions for communications, signal processing, and embedded processing applications. Partner solutions include high-speed memory controllers, networking protocol stacks, and domain-specific accelerators.
Software tools beyond Vivado include ModelSim for simulation, ChipScope for in-system debugging, and various synthesis tools that support the XCVU125-2FLVC2104E architecture. Open-source alternatives and academic tools provide additional development options for research and educational applications.
Environmental & Export Classifications
The XCVU125-2FLVC2104E meets stringent environmental standards with operating temperature ranges from 0ยฐC to 85ยฐC for commercial applications. The device complies with RoHS directives and conflict minerals regulations, ensuring responsible sourcing and environmental sustainability.
Export classification for the XCVU125-2FLVC2104E falls under specific ECCN (Export Control Classification Number) categories that may require licensing for certain international shipments. End-users should consult current export regulations and obtain appropriate licenses when shipping to restricted countries or for dual-use applications.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade options for safety-critical applications. The device undergoes extensive testing including burn-in, thermal cycling, and reliability stress testing to ensure consistent performance across its operational lifetime.
Environmental compliance includes lead-free packaging options and adherence to international environmental regulations. The XCVU125-2FLVC2104E supports green design initiatives through power-efficient operation and recyclable packaging materials.
The XCVU125-2FLVC2104E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support for next-generation applications requiring advanced programmable logic capabilities.
