The XCVU125-2FLVB1760I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in aerospace, defense, telecommunications, and high-performance computing.
Product Specifications
Core Architecture
The XCVU125-2FLVB1760I features advanced 20nm technology with impressive processing capabilities:
- Logic Cells: 1,278,000 system logic cells
- CLB Flip-Flops: 2,556,000 CLB flip-flops
- CLB LUTs: 1,278,000 CLB look-up tables
- Block RAM: 67.6 Mb total block RAM
- UltraRAM: 132.8 Mb UltraRAM memory
- DSP Slices: 2,880 DSP48E2 slices
Package and Interface Details
- Package Type: FLVB1760 (Flip Chip Ball Grid Array)
- Pin Count: 1,760 pins
- Speed Grade: -2 (industrial temperature range)
- Temperature Range: -40ยฐC to +100ยฐC (I-grade)
- I/O Standards: Support for multiple high-speed I/O standards
- Transceivers: High-speed serial transceivers up to 32.75 Gbps
Performance Characteristics
The XCVU125-2FLVB1760I delivers exceptional performance metrics:
- Maximum Operating Frequency: Up to 891 MHz
- Power Efficiency: Optimized for low power consumption
- Memory Bandwidth: High-bandwidth memory interface support
- Processing Power: Multi-gigabit signal processing capability
Price Information
Pricing for the XCVU125-2FLVB1760I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities.
Pricing Factors:
- Order quantity (unit vs. volume pricing)
- Lead time requirements
- Geographic region
- Distributor markup
- Market demand fluctuations
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and performance characteristics
- User Guide: Comprehensive implementation and configuration guide
- Application Notes: Design best practices and implementation examples
- Errata: Known issues and workarounds
- Package and Pinout Information: Detailed pinout diagrams and package specifications
Development Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified IP cores and reference designs
- Evaluation Boards: Development and prototyping platforms
- Design Examples: Sample projects and tutorials
Multimedia Resources
- Product Videos: Feature overviews and application demonstrations
- Webinars: Technical training and best practices
- White Papers: In-depth technical analysis and case studies
Related Resources
Development Tools
- Vivado Design Suite: Integrated development environment
- Vitis Unified Software Platform: Software development platform
- ChipScope Pro: Real-time verification and debugging
- PlanAhead: Design planning and floorplanning tool
Evaluation Platforms
- VCU125 Evaluation Kit: Development board for XCVU125-2FLVB1760I
- Verification IP: Protocol verification solutions
- Reference Designs: Proven implementation examples
Support Resources
- Xilinx Forums: Community support and discussion
- Technical Support: Professional engineering assistance
- Training Courses: Hands-on learning opportunities
- Design Services: Professional design and consultation services
Compatible IP and Solutions
- Video Processing: 4K/8K video codec solutions
- Digital Signal Processing: Advanced DSP IP cores
- Networking: High-speed Ethernet and protocol stacks
- AI/ML Acceleration: Machine learning inference engines
Environmental & Export Classifications
Environmental Compliance
The XCVU125-2FLVB1760I meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliant: European chemical regulation compliance
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system compliance
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Manufactured in various locations
- Export Restrictions: Subject to US export administration regulations
Quality and Reliability Standards
- Operating Temperature: -40ยฐC to +100ยฐC (I-grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 95% relative humidity (non-condensing)
- Altitude: Up to 2,000 meters operational
- Vibration: MIL-STD-883 compliant
- Shock: MIL-STD-883 compliant
Regulatory Certifications
- FCC: Federal Communications Commission approval
- CE: European Conformity marking
- UL: Underwriters Laboratories safety certification
- CSA: Canadian Standards Association approval
The XCVU125-2FLVB1760I represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support and regulatory compliance for mission-critical applications across multiple industries.
