Overview
The XCVU125-2FLVB1760E is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale family. This advanced programmable logic device delivers exceptional processing power and flexibility for demanding applications requiring high-speed data processing, embedded systems, and custom digital signal processing solutions.
Product Specifications
Key Technical Specifications
- Manufacturer: Xilinx Inc. (now AMD)
- Product Family: Virtex UltraScale
- Part Number: XCVU125-2FLVB1760E
- Package Type: 1760-pin FCBGA (Flip Chip Ball Grid Array)
- Technology Node: 20nm
- Speed Grade: -2 (Commercial temperature range)
- Supply Voltage: 0.95V – 1.03V
Logic Resources
- Logic Cells: 1,253,280 cells
- CLB Count: 89,520 Configurable Logic Blocks
- Total System Gates: 125K equivalent gates
- I/O Count: 702 user I/O pins
- Memory: 90.7 Mb total block RAM
- DSP Slices: 2,520 DSP48E2 slices
Performance Features
- Maximum Operating Frequency: Up to 741 MHz
- High-Speed Transceivers: GTH transceivers up to 16.3 Gb/s
- Memory Interface: Support for DDR4, DDR3, LPDDR4
- PCIe Support: PCIe Gen3 x16 interface
- Processing System: Dedicated ARM processing capabilities
Package Details
- Package Size: 42.5mm ร 42.5mm
- Pin Count: 1760 pins
- Mounting: Surface Mount Technology (SMT)
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial)
- Storage Temperature: -65ยฐC to +150ยฐC
Price Information
Pricing Structure
- Unit Price: Request for Quote (RFQ)
- Minimum Order Quantity: 1 piece
- Volume Pricing: Available for quantities >100 units
- Lead Time: 2-4 weeks for standard quantities
- Availability: In stock at authorized distributors
Cost Considerations
- Competitive pricing for high-performance FPGA solutions
- Volume discounts available for production quantities
- Engineering samples available for qualified customers
- Long-term supply agreements supported
Documents & Media
Technical Documentation
- Official Datasheet: Available from Xilinx/AMD support portal
- User Guide: UG575 – UltraScale Architecture Package and Pinout
- Development Tools: Vivado Design Suite compatibility
- Application Notes: Signal integrity and PCB design guidelines
Design Resources
- Reference Designs: Available through Xilinx design hub
- IP Core Library: Extensive IP portfolio compatibility
- Development Boards: Compatible with UltraScale evaluation platforms
- Pin Mapping Files: CSV and TXT format pinout files
Software Support
- Vivado Design Suite: Complete development environment
- SDK/Vitis: Embedded software development platform
- ChipScope Pro: Advanced debugging capabilities
- ModelSim: Simulation and verification tools
Related Resources
Development Ecosystem
- Evaluation Boards: VCU125 evaluation kit recommended
- Reference Designs: High-speed connectivity solutions
- IP Cores: DSP, networking, and video processing IP
- Training Resources: Xilinx online learning platform
Application Areas
- Data Centers: Server acceleration and networking
- Telecommunications: 5G infrastructure and base stations
- Industrial Automation: Real-time control systems
- Aerospace & Defense: Signal processing and radar systems
- Medical Devices: High-speed imaging and diagnostics
Compatible Products
- Power Solutions: Compatible with Xilinx power estimator
- Memory Interfaces: DDR4/DDR3 memory controllers
- Connectivity: PCIe, Ethernet, and custom protocols
- Development Tools: Complete Xilinx toolchain support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS compliant per EU Directive 2015/863
- REACH Compliance: Meets REACH regulation requirements
- Pb-Free: Lead-free package and assembly
- Halogen-Free: Available in halogen-free package options
Quality Standards
- ISO Certification: Manufactured under ISO 9001:2015
- Quality Grade: Commercial (C) temperature range
- Reliability: High-reliability screening available
- Traceability: Full manufacturing traceability
Export Control Information
- ECCN Classification: Export control classification varies by configuration
- Country Restrictions: May require export licenses for certain destinations
- ITAR Status: Commercial grade – not ITAR controlled
- Dual Use: Subject to dual-use export regulations
Environmental Specifications
- Operating Temperature: 0ยฐC to +85ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000m operational
Why Choose XCVU125-2FLVB1760E?
Performance Advantages
- Unprecedented power savings with high-performance processing
- Advanced 20nm technology for optimal power efficiency
- High-speed transceivers for demanding connectivity requirements
- Extensive DSP capabilities for signal processing applications
Design Flexibility
- Massive logic capacity for complex implementations
- Flexible I/O standards support
- Comprehensive IP ecosystem
- Future-proof architecture for evolving requirements
Industry Support
- Backed by AMD’s comprehensive support network
- Extensive documentation and design resources
- Active community and professional support
- Long-term product availability commitment
The XCVU125-2FLVB1760E represents the pinnacle of FPGA technology, combining high performance, low power consumption, and extensive connectivity options in a single device. Whether you’re designing next-generation data center accelerators, 5G infrastructure, or advanced industrial control systems, this FPGA provides the performance and flexibility needed for success.
For technical support, pricing, and availability, contact your local Xilinx/AMD representative or authorized distributor.
