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XCVU125-1FLVB1760C: High-Performance Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

The XCVU125-1FLVB1760C is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and flexibility. This advanced FPGA delivers superior performance for data center acceleration, wireless infrastructure, and high-performance computing applications.

Product Specifications

The XCVU125-1FLVB1760C features impressive technical specifications that make it ideal for complex digital signal processing and acceleration tasks:

Core Architecture:

  • Logic Cells: 1,221,600 logic cells providing extensive programmable logic resources
  • CLB Flip-Flops: 1,955,200 configurable logic block flip-flops for sequential logic implementation
  • CLB LUTs: 610,800 look-up tables enabling flexible combinational logic functions
  • Block RAM: 38.4 Mb total block RAM for on-chip memory storage
  • UltraRAM: 270 Mb UltraRAM blocks for large memory arrays

DSP and Processing:

  • DSP Slices: 1,728 DSP48E2 slices for high-speed arithmetic operations
  • Processing Speed: -1 speed grade ensuring reliable performance across operating conditions
  • Package Type: FLVB1760 package providing 1760 pins for extensive I/O connectivity

Advanced Features:

  • Built on 20nm FinFET+ technology for optimal power efficiency
  • Supports PCIe Gen3 x16 and 100G Ethernet connectivity
  • Integrated ARM Cortex-A53 quad-core processor capabilities
  • Advanced security features including AES-256 encryption

Price

The XCVU125-1FLVB1760C is positioned as a premium FPGA solution reflecting its advanced capabilities and performance specifications. Pricing for the XCVU125-1FLVB1760C varies based on:

  • Quantity: Volume discounts available for orders of 100+ units
  • Distribution Channel: Authorized distributors may offer competitive pricing
  • Lead Time: Standard lead times typically range from 12-16 weeks
  • Packaging Options: Available in tape and reel for automated assembly

Contact authorized Xilinx distributors for current XCVU125-1FLVB1760C pricing and availability. Educational and development pricing may be available for qualifying institutions and projects.

Documents & Media

Comprehensive documentation and resources are available for the XCVU125-1FLVB1760C:

Technical Documentation:

  • Product datasheet with complete electrical and mechanical specifications
  • Package and pinout documentation for the FLVB1760 package
  • Thermal and power management guidelines
  • Application notes for specific use cases

Design Resources:

  • Vivado Design Suite compatibility information
  • Reference designs and example projects
  • IP core integration guides
  • Timing and constraint files

Development Tools:

  • Evaluation boards and development kits
  • Software development kit (SDK) documentation
  • Hardware description language (HDL) examples
  • Simulation models and testbenches

Related Resources

The XCVU125-1FLVB1760C integrates seamlessly with Xilinx’s comprehensive ecosystem:

Development Platforms:

  • Vivado Design Suite for synthesis and implementation
  • Vitis unified software platform for acceleration development
  • PetaLinux tools for embedded Linux development
  • Model Composer for algorithm development

IP Portfolio:

  • Xilinx LogiCORE IP for common functions
  • Video and imaging IP cores
  • Signal processing IP libraries
  • Connectivity and interface IP solutions

Community Support:

  • Xilinx developer forums and community
  • Technical support and documentation portal
  • Training courses and certification programs
  • Partner ecosystem for specialized solutions

Environmental & Export Classifications

The XCVU125-1FLVB1760C meets stringent environmental and regulatory requirements:

Environmental Compliance:

  • RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
  • REACH Compliant: Complies with European chemical regulation standards
  • Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
  • Storage Temperature: -65ยฐC to +150ยฐC range

Export Classifications:

  • ECCN: Export Control Classification Number available upon request
  • HTS Code: Harmonized Tariff Schedule classification for international trade
  • Country of Origin: Manufactured in compliance with international trade regulations
  • Conflict Minerals: Complies with conflict minerals reporting requirements

Quality Standards:

  • Manufactured in ISO 9001 certified facilities
  • Automotive quality (AEC-Q100) versions available
  • Military and aerospace grade options for specialized applications
  • Comprehensive reliability testing and qualification data

The XCVU125-1FLVB1760C represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. Whether you’re developing next-generation data center accelerators, advanced wireless infrastructure, or high-performance computing solutions, this FPGA provides the flexibility and power needed for today’s most demanding applications.