Product Overview
The XCVU095-H1FFVC2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, engineered for demanding applications requiring exceptional processing power, memory bandwidth, and I/O capabilities. This advanced 20nm technology device delivers unprecedented performance for next-generation systems in aerospace, defense, communications, and high-performance computing applications.
1. Product Specifications
Core Architecture
- Device Family: Virtex UltraScale
- Logic Elements: 1,176,000 cells
- Technology Node: 20nm FinFET
- Supply Voltage: 0.922V – 0.979V (0.95V nominal)
- Speed Grade: H1 (specialized variant)
Memory Resources
- Total RAM: 62,259,200 bits
- Block RAM: High-density distributed memory
- UltraRAM: On-chip memory for reduced BOM cost
- Configuration Memory: Advanced security features
I/O and Connectivity
- User I/Os: 416 differential pairs
- Package: 2104-pin FCBGA (Flip-Chip Ball Grid Array)
- Package Dimensions: 47.5mm ร 47.5mm
- Mounting: Surface Mount Technology (SMT)
- Pin Pitch: 1.0mm
Processing Capabilities
- DSP Slices: High-performance 27ร18 multipliers
- Clock Management: Advanced clocking resources
- Logic Array Blocks (LABs): 67,200 CLBs
- Transceivers: Next-generation high-speed serial I/O
Operating Conditions
- Junction Temperature: Varies by speed grade
- Operating Temperature: Commercial to Industrial range
- Power Consumption: Optimized for power efficiency
- Thermal Design: Advanced thermal management
2. Price Information
Market Positioning
The XCVU095-H1FFVC2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and specialized H1 variant features.
Pricing Structure
- Unit Price: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities of 25+ units
- Lead Time: Typically 30 weeks from major distributors
- Minimum Order: 1 unit (bulk packaging)
Cost Considerations
- Total Cost of Ownership: Reduced through integrated features
- Development Cost: Supported by comprehensive toolchain
- Long-term Availability: Supported through 2045 lifecycle
3. Documents & Media
Technical Documentation
- Product Datasheet: DS890 – UltraScale Architecture Overview
- User Guides:
- UG575: Packaging and Pinout User Guide
- UG571: SelectIO Resources User Guide
- UG572: Clocking Resources User Guide
- UG573: Memory Resources User Guide
Design Resources
- Reference Designs: Available through AMD Developer Zone
- Application Notes: Specific to target applications
- CAD Models: Free downloadable models for PCB design
- Pinout Files: Complete pin assignment documentation
Development Tools
- Vivado Design Suite: Complete FPGA design environment
- SDK: Software development kit for embedded processing
- IP Catalog: Extensive library of verified IP cores
- Simulation Models: Comprehensive simulation support
Training Materials
- Video Tutorials: Product-specific training content
- Technical Webinars: Live and recorded sessions
- Documentation Library: Comprehensive technical resources
- Community Forums: Developer support and discussions
4. Related Resources
Evaluation Platforms
- VCU108 Evaluation Kit: Ideal for prototyping and development
- Custom Development Boards: Third-party solutions available
- Reference Designs: Proven implementations for key applications
Compatible Products
- Kintex UltraScale: Footprint-compatible alternatives
- Virtex UltraScale+: Migration path for enhanced performance
- System-on-Module: Pre-designed modules for rapid deployment
Application Areas
- 5G Infrastructure: Baseband processing and beamforming
- Aerospace & Defense: Radar and signal processing
- High-Performance Computing: Acceleration and co-processing
- Data Centers: Network processing and acceleration
- Test & Measurement: High-speed signal processing
Design Services
- Certified Partners: Verified design service providers
- Premier Partners: Advanced design and consulting services
- Training Programs: Comprehensive education offerings
- Support Services: Technical support and consultation
5. Environmental & Export Classifications
RoHS Compliance
- Status: RoHS3 Compliant
- Lead Content: <0.1% lead by weight
- Environmental Certification: Meets EU RoHS directive requirements
- Packaging: Environmentally friendly materials
Quality Standards
- ISO Certification: ISO 9001, ISO 14001 compliant manufacturing
- Reliability Testing: Extensive qualification and testing
- Quality Assurance: Rigorous quality control processes
- Traceability: Full supply chain visibility
Export Control
- ECCN Classification: Subject to U.S. export regulations
- Export License: May require license for certain destinations
- Dual-Use Technology: Controlled technology classification
- Compliance: Adherence to international trade regulations
Environmental Impact
- Manufacturing: Sustainable manufacturing processes
- End-of-Life: Recycling programs available
- Carbon Footprint: Reduced through design optimization
- Conflict Minerals: Conflict-free sourcing certified
Regulatory Approvals
- CE Marking: European conformity marking
- FCC: Federal Communications Commission compliance
- Safety Standards: UL, CSA, and international safety approvals
- Automotive: Suitable for automotive applications (where applicable)
Key Benefits
Performance Advantages
- Highest Logic Density: 1.176 million logic elements for complex designs
- Advanced Process: 20nm technology for superior performance per watt
- High-Speed I/O: 416 differential pairs for maximum connectivity
- Flexible Architecture: Reconfigurable for diverse applications
Design Flexibility
- Partial Reconfiguration: Dynamic hardware updates
- Mixed-Signal Capability: Integrated analog and digital processing
- Security Features: Advanced encryption and authentication
- Scalability: Footprint compatibility for easy migration
Market Leadership
- Proven Technology: Deployed in thousands of designs worldwide
- Ecosystem Support: Comprehensive tools and IP portfolio
- Long-Term Support: Extended lifecycle through 2045
- Innovation Platform: Foundation for next-generation systems
For the most current specifications, pricing, and availability of the XCVU095-H1FFVC2104E, contact your local AMD authorized distributor or visit the AMD Developer Zone.
