Product Overview
The XCVU095-H1FFVB2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale series, designed for demanding applications requiring exceptional processing power, programmable acceleration, and advanced I/O capabilities. This cutting-edge FPGA delivers unprecedented performance for heterogeneous processing applications while maintaining optimal power efficiency.
1. Product Specifications
Core Technical Specifications
Device Family: Virtex UltraScale Manufacturer: AMD (formerly Xilinx) Part Number: XCVU095-H1FFVB2104E Technology Node: 20nm TSMC process Logic Elements: 1,176,000 cells Package Type: 2104-FCBGA (Flip Chip Ball Grid Array) Package Size: 47.5mm × 47.5mm Total I/O Pins: 702 I/O Operating Temperature Range: 0°C to 100°C (TJ) Supply Voltage: 0.922V to 0.979V core voltage
Memory and Processing Features
- Total RAM Bits: 62,259,200 bits
- LABs/CLBs: 67,200 Logic Array Blocks
- DSP Slices: High-performance DSP48E2 slices for signal processing
- Block RAM: Distributed and block RAM for flexible memory architecture
- UltraRAM: Next-generation on-chip memory for reduced BOM cost
Advanced I/O and Connectivity
- High-Speed Transceivers: Next-generation GTY transceivers
- PCIe Support: PCIe Gen3 x16 capability
- Ethernet Support: 100G Ethernet and 150G Interlaken generation
- Serial I/O Bandwidth: Industry-leading bandwidth for high-speed data transfer
- Memory Interfaces: DDR4, DDR3, QDR-II+, and RLDRAM3 support
Performance Specifications
- Speed Grade: -H1 (High-performance grade)
- Maximum Operating Frequency: Up to 741 MHz (depending on design)
- Power Consumption: Optimized for low power with SmartConnect IP
- Processing Architecture: Heterogeneous processing support with ARM Cortex-A53 and Cortex-R5 processors
2. Pricing Information
Current Market Pricing (USD)
The XCVU095-H1FFVB2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:
- Single Unit (1+): $15,000 – $18,000
- Volume Pricing (10+): $14,000 – $16,500
- Bulk Orders (100+): $12,500 – $15,000
- High Volume (500+): Contact for custom pricing
Note: Pricing varies by distributor, quantity, and market conditions. Contact authorized distributors for current pricing and availability.
Value Proposition
The XCVU095-H1FFVB2104E offers exceptional price-performance ratio for applications requiring:
- High-speed signal processing
- Massive parallel processing capabilities
- Advanced connectivity features
- Low power consumption
- Scalable architecture
3. Documents & Media
Technical Documentation
Datasheet: AMD Virtex UltraScale FPGAs Data Sheet (DS890) User Guide: Virtex UltraScale Architecture Libraries Guide PCB Design Guidelines: Virtex UltraScale FPGA PCB Design Guide Power Guidelines: Virtex UltraScale Power Methodology Guide
Development Tools
Vivado Design Suite: Complete FPGA design environment SDK (Software Development Kit): Embedded software development IP Catalog: Comprehensive library of verified IP cores Hardware Manager: Device programming and debugging
Support Resources
Answer Database: Searchable technical support database Forums: Community support and discussions Application Notes: Design implementation guides Reference Designs: Ready-to-use design examples
CAD Models and Symbols
- Altium Designer: Schematic symbols and PCB footprints
- Cadence Allegro: Complete component libraries
- Mentor Graphics: Design rule check (DRC) files
- KiCad: Open-source PCB design files
4. Related Resources
Development Boards and Kits
Virtex UltraScale Evaluation Boards:
- Comprehensive evaluation platform
- Pre-built reference designs
- Hardware debugging capabilities
- Extensive I/O connectivity
Development Kits:
- Starter kits for rapid prototyping
- Educational packages for learning
- Advanced development platforms
Software Tools
Vivado High-Level Synthesis (HLS): C/C++ to RTL conversion SDAccel Development Environment: OpenCL support for acceleration Vivado IP Integrator: Graphical IP integration tool ChipScope Pro: Real-time debugging and analysis
Compatible IP Cores
Communication Interfaces:
- Ethernet MAC/PHY controllers
- PCIe endpoint and root complex
- USB 3.0 and USB 2.0 controllers
- SATA and SAS controllers
Processing Cores:
- MicroBlaze soft processor
- ARM Cortex-A53 and Cortex-R5
- DSP IP cores for signal processing
- Video and imaging IP
Application Examples
Aerospace and Defense:
- Radar signal processing
- Software-defined radio
- Secure communications
- Electronic warfare systems
Data Center and Cloud:
- Hardware acceleration
- Network function virtualization
- Machine learning inference
- Database acceleration
Communications:
- 5G base stations
- Optical transport networks
- Wireless infrastructure
- Network processing
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance: RoHS3 Compliant (2011/65/EU)
- Lead-free manufacturing process
- Restriction of hazardous substances
- Environmental impact minimization
- Compliant with EU environmental directives
REACH Compliance: Registration, Evaluation, Authorization, and Restriction of Chemicals
- Substance safety assessment completed
- No substances of very high concern (SVHC)
- Full material composition documentation
- EU chemical regulation compliance
Export Control Classifications
US Export Control Classification Number (ECCN): 3A001.a.7.b Export Administration Regulations (EAR): Subject to US export regulations International Traffic in Arms Regulations (ITAR): Not ITAR controlled Commerce Control List (CCL): Category 3 – Electronics
Harmonized System (HS) Codes
US HTS Code: 8542390001 EU TARIC Code: 8542399000 General Classification: Electronic integrated circuits Duty Rate: Varies by country and trade agreements
Environmental Specifications
Operating Temperature: 0°C to +100°C (junction temperature) Storage Temperature: -65°C to +150°C Humidity: 5% to 95% (non-condensing) Altitude: Up to 2,000 meters operational Shock and Vibration: MIL-STD-883 compliant
Quality and Reliability
Quality Standard: ISO 9001:2015 certified manufacturing Reliability Testing: JEDEC standards compliance Mean Time Between Failures (MTBF): >1,000,000 hours Automotive Grade: AEC-Q100 qualified variants available
Packaging and Shipping
MSL Rating: Moisture Sensitivity Level 3 Package Materials: Halogen-free, environmentally friendly Shipping Classification: Not hazardous goods Conflict Minerals: 3TG compliant (Tin, Tantalum, Tungsten, Gold)
Why Choose XCVU095-H1FFVB2104E?
The XCVU095-H1FFVB2104E represents the pinnacle of FPGA technology, offering unmatched performance, flexibility, and reliability for mission-critical applications. With its advanced 20nm process technology, extensive I/O capabilities, and comprehensive development ecosystem, this FPGA is the ideal choice for next-generation electronic systems requiring high-speed processing, low power consumption, and scalable architecture.
Key Benefits:
- Industry-leading performance and integration
- Comprehensive development tool support
- Proven reliability and quality
- Global regulatory compliance
- Extensive technical support and documentation
