The XCVU095-H1FFVA2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Xilinx Virtex UltraScale family, designed to deliver exceptional performance and power efficiency for demanding applications in artificial intelligence, machine learning, high-performance computing, and advanced digital signal processing.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Logic Elements: 1,176,000 logic cells
- Process Technology: 20nm TSMC FinFET+ technology
- Operating Voltage: 0.95V nominal supply
- Package Type: 2104-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 47.5mm ร 47.5mm
- Total I/O Pins: 832 user I/O pins
Memory and Storage
- Total RAM Bits: 62,259,200 bits
- Block RAM: High-density on-chip memory blocks
- UltraRAM: Advanced memory architecture for enhanced performance
- Configuration Memory: Non-volatile configuration storage
Performance Features
- DSP Slices: Optimized for high-speed digital signal processing
- Clock Management: Advanced clock networks and PLLs
- Transceivers: High-speed serial transceivers supporting:
- PCIe Gen3 x16 connectivity
- 100G Ethernet capability
- 150G Interlaken support
- Maximum Operating Frequency: Up to several hundred MHz depending on design
Operating Conditions
- Operating Temperature Range: 0ยฐC to 100ยฐC (Junction Temperature)
- Maximum Power Consumption: 12.5W (typical applications)
- Mounting Type: Surface Mount Technology (SMT)
- RoHS Compliance: RoHS3 compliant
Key Features
- Adaptive Logic Modules (ALMs): 1.2 million ALMs for flexible logic implementation
- Advanced Connectivity: USB 3.0, Gigabit Ethernet, and HDMI interfaces
- AI/ML Acceleration: Optimized for neural network and deep learning applications
- Low Power Design: Energy-efficient architecture for embedded and mobile applications
2. Price Information
Pricing Structure
The XCVU095-H1FFVA2104E pricing varies based on quantity and supplier:
- Single Unit Price: Starting from $15,000+ USD
- Volume Pricing: Significant discounts available for bulk orders
- Quantity Breaks:
- 1-9 pieces: Premium pricing
- 10-49 pieces: 5-10% discount
- 50-99 pieces: 10-15% discount
- 100+ pieces: 15-20% discount
- 250+ pieces: 20-25% discount
Factors Affecting Price
- Order quantity and volume commitments
- Lead time requirements
- Packaging options (tray vs. reel)
- Geographic region and distribution channel
- Current market demand and supply conditions
Note: Prices are subject to change based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Official Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: Comprehensive implementation and design guidelines
- Pin-out Diagram: Detailed pin configuration and signal descriptions
- Package Drawing: Mechanical specifications and dimensions
- IBIS Models: Signal integrity simulation models
- Timing Reports: Performance timing characteristics
Development Resources
- Vivado Design Suite: Primary development environment
- IP Cores: Pre-verified intellectual property blocks
- Reference Designs: Example implementations and tutorials
- Application Notes: Specific use case implementations
- Migration Guides: Upgrade paths from previous generations
Media Files
- Product Images: High-resolution component photographs
- Block Diagrams: System architecture illustrations
- Performance Graphs: Benchmark and comparison charts
- Video Resources: Technical presentations and tutorials
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design flow
- Vitis Unified Software Platform: Software development environment
- SDAccel: OpenCL-based development platform
- System Generator: MATLAB/Simulink integration
- ChipScope Pro: Hardware debugging and analysis
Evaluation Boards
- VCU095 Evaluation Board: Development platform for the XCVU095 series
- Reference Design Kits: Application-specific development boards
- Starter Kits: Entry-level development platforms
Software Libraries
- DSP Libraries: Optimized signal processing functions
- Vision Libraries: Computer vision and image processing
- AI/ML Libraries: Neural network and machine learning frameworks
- Communication Libraries: Protocol stacks and interfaces
Training and Support
- Technical Documentation: Comprehensive design guides
- Community Forums: Developer support and discussions
- Training Courses: FPGA design methodology courses
- Webinars: Regular technical presentations
- Application Engineers: Direct technical support
Compatible Products
- Memory Interfaces: DDR4, LPDDR4, HBM2 controllers
- High-Speed Transceivers: Aurora, Ethernet, PCIe IP
- Processing Cores: ARM Cortex-A53, MicroBlaze soft processors
- Development Boards: Compatible evaluation and development platforms
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Meets RoHS3 (2015/863/EU) requirements
- REACH Compliance: Compliant with EU REACH regulation
- Halogen-Free: Environmentally friendly packaging materials
- Pb-Free: Lead-free soldering and packaging
- Conflict Minerals: Compliant with conflict minerals regulations
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system
- IATF 16949: Automotive quality management (where applicable)
- AS9100: Aerospace quality standards (where applicable)
Export Control Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufactured in various global facilities
- Export Licensing: May require export licenses for certain destinations
Packaging and Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 1 (0-1999V) – requires ESD precautions
- Packaging Options: Tray packaging for production volumes
- Storage Requirements: Controlled temperature and humidity environment
Regulatory Approvals
- FCC Compliance: Meets electromagnetic compatibility requirements
- CE Marking: European Conformity marking where applicable
- UL Recognition: Safety standard compliance
- CCC Certification: China Compulsory Certification where required
Application Areas: The XCVU095-H1FFVA2104E is ideal for aerospace & defense, automotive electronics, industrial automation, telecommunications infrastructure, medical devices, high-performance computing, artificial intelligence acceleration, and advanced research applications.
For the most current specifications, pricing, and availability of the XCVU095-H1FFVA2104E, please contact authorized AMD Xilinx distributors or visit the official AMD website.
