Overview
The XCVU095-3FFVD1924E is a premium Field Programmable Gate Array (FPGA) from AMD’s acclaimed Virtex UltraScale family, engineered to deliver exceptional performance and integration capabilities for demanding applications. This advanced FPGA combines cutting-edge 20nm technology with superior processing power, making it the ideal choice for high-performance computing, data center acceleration, and complex digital signal processing applications.
1. Product Specifications
Core Architecture
- FPGA Family: AMD Virtex UltraScale Series
- Part Number: XCVU095-3FFVD1924E
- Process Technology: Advanced 20nm FinFET
- System Logic Cells: 1,176,000 (1.176M)
- Logic Array Blocks/CLBs: 67,200 LABs
- Total RAM Bits: 62,259,200 (60.8 Mb)
- DSP Slices: 768 high-performance DSP blocks
Package & Interface Specifications
- Package Type: 1924-pin FFVD (Flip Chip Fine-Pitch Ball Grid Array)
- Package Dimensions: Advanced flip-chip BGA configuration
- Speed Grade: -3 (High Performance)
- Operating Voltage: 0.95V core voltage
- I/O Pins: Up to 832 user I/O pins
- Operating Temperature Range: 0ยฐC to 100ยฐC (TJ)
High-Speed Connectivity
- GTH Transceivers: 32 x 16.3 Gb/s transceivers
- GTY Transceivers: 32 x 30.5 Gb/s transceivers
- Serial I/O Bandwidth: Industry-leading performance
- PCIe Support: PCIe Gen3 x8 capable
- Ethernet Support: 100G Ethernet, 150G Interlaken
Memory & Performance Features
- Block RAM: Extensive distributed memory resources
- UltraRAM: Advanced on-chip memory architecture
- DSP Performance: Up to 21.2 TeraMACs processing capability
- Configuration: JTAG, SPI, and other standard interfaces
2. Pricing Information
Contact for Current Pricing
The XCVU095-3FFVD1924E pricing varies based on:
- Order quantity and volume discounts
- Current market conditions
- Distribution channel
- Geographic location
- Lead time requirements
Typical Price Range: Contact authorized distributors for competitive quotes. Bulk pricing available for production quantities.
Availability: Available through authorized AMD distributors worldwide with standard lead times of 12-16 weeks for production quantities.
3. Documents & Media
Technical Documentation
- Product Brief: UltraScale FPGA overview and key features
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines
- Configuration Guide: Programming and configuration procedures
- Packaging Information: Mechanical drawings and thermal data
Design Resources
- Reference Designs: Pre-verified IP and design examples
- Application Notes: Implementation best practices
- White Papers: Technical deep-dives and performance analysis
- CAD Models: 3D models for mechanical design integration
- Pinout Files: Complete pin assignment documentation
Software Tools
- Vivado Design Suite: Complete design flow and implementation tools
- IP Catalog: Extensive library of verified IP cores
- Hardware Manager: Programming and debugging utilities
- SDK: Software development kit for embedded applications
Video Resources
- Product Demonstrations: Performance showcases and feature highlights
- Training Videos: Design methodology and tool usage tutorials
- Webinar Recordings: Technical presentations and Q&A sessions
4. Related Resources
Development Platforms
- VCU108 Evaluation Kit: Complete development environment featuring XCVU095-2FFVA2104E
- VCU110 Development Kit: Alternative platform for UltraScale evaluation
- Custom Carrier Boards: Third-party development solutions
Compatible IP Cores
- 100G Ethernet MAC: High-speed networking solutions
- Video Processing IP: Codecs and image processing engines
- DSP Libraries: Optimized signal processing functions
- Memory Controllers: DDR4, HBM, and other memory interfaces
Support Ecosystem
- AMD Partner Network: Certified design service providers
- Training Courses: Hands-on design methodology workshops
- Community Forums: Peer-to-peer technical discussions
- Technical Support: Direct access to AMD engineering experts
Application Areas
- Data Center Acceleration: AI/ML inference and training acceleration
- 5G Infrastructure: Baseband processing and radio access networks
- Video Processing: Real-time encoding, transcoding, and streaming
- High-Frequency Trading: Ultra-low latency financial applications
- Aerospace & Defense: Radar, SIGINT, and secure communications
- Test & Measurement: Protocol analyzers and signal generators
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation standards
- Lead-Free: Advanced lead-free solder ball technology
- Halogen-Free: Environmentally responsible manufacturing
Quality & Reliability Standards
- ISO 14001: Environmental management system certification
- ISO 9001: Quality management system compliance
- IATF 16949: Automotive quality standard adherence
- AEC-Q100: Automotive electronics reliability qualification
Export Control Information
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US and international export regulations
Packaging & Shipping
- MSL Rating: Moisture Sensitivity Level 3
- Storage Conditions: -55ยฐC to +150ยฐC storage temperature
- Packaging Options: Tape and reel, tray packaging available
- ESD Protection: Industry-standard electrostatic discharge protection
Lifecycle Management
- Product Longevity: Minimum 15-year product lifecycle commitment
- Change Notifications: 90-day advance notice for product changes
- Last Time Buy: Minimum 12-month final order period
- Migration Path: Clear upgrade path to next-generation devices
Ready to accelerate your next-generation designs? Contact our technical sales team for detailed specifications, pricing, and development support for the XCVU095-3FFVD1924E FPGA solution.
