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XCVU095-3FFVD1517E High-Performance FPGA – Virtex UltraScale Family

Original price was: $20.00.Current price is: $19.00.

The XCVU095-3FFVD1517E is a cutting-edge field-programmable gate array (FPGA) from AMD/Xilinx’s premier Virtex UltraScale family, designed to deliver exceptional performance and integration capabilities for demanding applications. This advanced FPGA combines superior processing power with energy efficiency, making it ideal for applications requiring high-speed computation, signal processing, and complex logic integration.

1. Product Specifications

Key Technical Features

  • Part Number: XCVU095-3FFVD1517E
  • Manufacturer: AMD (formerly Xilinx)
  • FPGA Family: Virtex UltraScale
  • Logic Cells: 940,800 cells
  • Process Technology: 20nm advanced silicon technology
  • Operating Voltage: 1V core voltage
  • Package Type: 1517-Pin FCBGA (Flip Chip Ball Grid Array)
  • I/O Count: 338 user I/O pins
  • Speed Grade: -3 (high-performance grade)

Architecture and Performance

The XCVU095-3FFVD1517E leverages AMD’s revolutionary UltraScale architecture, which provides unprecedented power savings, processing capabilities, and programmable acceleration. Built on 20nm technology, this FPGA offers an optimal balance between performance and power consumption.

Key Performance Characteristics:

  • High-density logic integration with 940,800 logic cells
  • Advanced DSP capabilities for signal processing applications
  • High-speed transceivers supporting PCIe, 100G Ethernet, and 150G Interlaken
  • Optimized for heterogeneous processing requirements
  • Next-generation stacked silicon interconnect (SSI) technology support

Memory and Storage

  • Total RAM Bits: Substantial on-chip memory resources
  • Block RAM: High-capacity block RAM for data buffering
  • UltraRAM: Enhanced memory architecture for reduced BOM costs
  • Configuration Memory: Non-volatile configuration storage

Operating Conditions

  • Temperature Range: Industrial temperature range support
  • Package Dimensions: Compact 1517-pin FCBGA form factor
  • Power Consumption: Optimized for low power operation
  • Reliability: High-reliability design for mission-critical applications

2. Price

Pricing Structure

The XCVU095-3FFVD1517E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance characteristics. Pricing varies based on order quantity, distribution channel, and specific market conditions.

Typical Price Ranges:

  • Single unit quantities: Contact for current pricing
  • Volume discounts available for quantities of 10+ units
  • Significant price reductions for quantities of 100+ units
  • Enterprise pricing available for large-scale deployments

Pricing Factors:

  • Current market demand and supply conditions
  • Geographic region and local distributor pricing
  • Customer volume commitments and long-term agreements
  • Technical support and service requirements

For the most current pricing information, customers should contact authorized distributors or submit a quote request through official channels.

3. Documents & Media

Technical Documentation

Official Datasheets:

  • XCVU095-3FFVD1517E Product Brief
  • Virtex UltraScale Family Data Sheet
  • Package and Pinout Specifications (1517-FCBGA)
  • Thermal and Power Management Guidelines

Design Resources:

  • Vivado Design Suite compatibility documentation
  • Reference designs and application notes
  • Pin mapping and constraint files
  • Timing and performance specifications

Software Tools:

  • Vivado Design Suite (recommended development environment)
  • ISE Design Tools (legacy support)
  • IP core libraries and reference implementations
  • Debugging and verification tools

Development Resources

Evaluation Platforms:

  • Compatible development boards and evaluation kits
  • Starter kits for rapid prototyping
  • Reference designs for common applications
  • Community forums and technical support

Training Materials:

  • Online training courses and tutorials
  • Technical webinars and workshops
  • Application notes and design guides
  • Best practices documentation

4. Related Resources

Compatible Development Boards

While FPGAkey does not directly provide development boards, commonly used platforms include:

  • ZedBoard: Popular development platform
  • Basys 3 Board: Educational and prototyping platform
  • TinyFPGA BX: Compact development solution
  • Nexys4-DDR: Advanced development board
  • Terasic DE10-Nano: SoC development platform
  • Digilent Arty S7: Accessible FPGA platform

Software Development Tools

Primary Development Environment:

  • Vivado Design Suite: Advanced synthesis and implementation tool
  • User-friendly interface with superior synthesis capabilities
  • Comprehensive debugging and verification features
  • Integrated IP catalog and reference designs

Alternative Tools:

  • Legacy ISE Design Tools (for specific applications)
  • Third-party synthesis and verification tools
  • Custom IP development frameworks

Technical Support Resources

Documentation Channels:

  • Official AMD/Xilinx documentation portal
  • FPGA resource channels and forums
  • Community-driven knowledge base
  • Technical application notes

Support Services:

  • Technical engineering support
  • Pinout and replacement guidance
  • Programming tools and starter kits
  • Application-specific design assistance

Application Areas

The XCVU095-3FFVD1517E is ideal for:

  • High-Performance Computing: Accelerated computing applications
  • Signal Processing: Advanced DSP implementations
  • Communications: High-speed networking equipment
  • Aerospace & Defense: Mission-critical systems
  • Data Centers: Hardware acceleration solutions
  • Industrial Automation: Real-time control systems

5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

  • Fully compliant with RoHS (Restriction of Hazardous Substances) regulations
  • Lead-free manufacturing processes
  • Environmentally responsible packaging materials
  • Recyclable components and materials

Environmental Standards:

  • ISO 14001 environmental management compliance
  • REACH regulation compliance for chemical substances
  • Conflict minerals compliance reporting
  • Green packaging initiatives

Export Control Classifications

U.S. Export Administration Regulations (EAR):

  • Subject to U.S. Export Administration Regulations
  • Export Control Classification Number (ECCN): 3A001.a.7.b
  • Requires export license for certain destinations
  • Restricted distribution to embargoed countries

International Trade Classifications:

  • USHTS Code: 8542390001
  • TARIC Code: 8542399000
  • Export Compliance: Subject to verification requirements

Restricted Destinations:

  • U.S. embargoed destinations and entities
  • Individuals on Entity List, Denied Persons List, and Specially Designated Nationals List
  • Countries categorized in Country Group D or E
  • Unauthorized resellers and partners

Compliance Requirements:

  • Prior written authorization required for restricted exports
  • Export compliance verification for all accounts
  • Enhanced due diligence for high-risk transactions
  • Ongoing monitoring of end-user compliance

Regulatory Certifications

Safety and Quality:

  • UL certification for safety compliance
  • CE marking for European market compliance
  • FCC certification for electromagnetic compatibility
  • ISO 9001 quality management system compliance

Industry Standards:

  • JEDEC standards compliance for semiconductor devices
  • IPC standards for electronic assemblies
  • Military specifications (MIL-STD) compatibility where applicable
  • Automotive qualification standards (AEC-Q100) for automotive applications

The XCVU095-3FFVD1517E represents the pinnacle of FPGA technology, combining advanced architecture, superior performance, and comprehensive support resources to enable next-generation electronic system development. Its robust feature set and extensive documentation make it an ideal choice for demanding applications requiring high-speed computation, signal processing, and complex logic integration.