The XCVU095-3FFVC2104E is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, networking, and high-performance computing environments.
Product Specification
The XCVU095-3FFVC2104E features advanced architecture built on TSMC’s 20nm planar process technology. This powerful FPGA incorporates 537,600 logic cells with 1,182,240 system logic cells, providing extensive programmable resources for complex digital designs. The device includes 4,560 DSP slices optimized for high-speed signal processing applications and 67.6 Mb of block RAM for efficient data storage and manipulation.
Key specifications of the XCVU095-3FFVC2104E include a maximum operating frequency that supports high-speed designs, with the -3 speed grade indicating superior performance characteristics. The device operates across commercial temperature ranges and supports multiple I/O standards for versatile system integration. The FFVC2104 package provides 2,104 flip-chip fine-pitch BGA connections, ensuring robust connectivity for complex board designs.
The XCVU095-3FFVC2104E integrates advanced features including PCIe Gen3 hard IP blocks, 100G Ethernet MAC, and high-speed transceivers capable of operating at speeds up to 32.75 Gbps. These integrated functions reduce design complexity while improving overall system performance and power efficiency.
Price
Pricing for the XCVU095-3FFVC2104E varies based on quantity, supplier, and market conditions. As a high-end FPGA solution, this device typically commands premium pricing reflective of its advanced capabilities and extensive resources. Contact authorized distributors for current pricing information and volume discounts. Factors affecting price include order quantity, delivery requirements, and specific packaging options.
Documents & Media
Comprehensive documentation supports the XCVU095-3FFVC2104E implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and pinout information essential for board design. Product briefs offer overview information highlighting key features and target applications.
Design methodology guides assist engineers in optimizing designs for the XCVU095-3FFVC2104E architecture. Migration guides facilitate upgrades from previous FPGA generations, while application notes demonstrate specific implementation techniques for common use cases. PCB design guidelines ensure proper board layout practices for optimal signal integrity and thermal management.
Development tools documentation covers Vivado Design Suite usage, including synthesis, implementation, and debugging procedures specific to the XCVU095-3FFVC2104E. Video tutorials and webinars provide additional learning resources for designers working with this advanced FPGA platform.
Related Resources
The XCVU095-3FFVC2104E ecosystem includes comprehensive development tools and support resources. Xilinx Vivado Design Suite provides the primary development environment, offering advanced synthesis, place-and-route, and timing analysis capabilities optimized for UltraScale+ architecture.
Evaluation boards and development kits enable rapid prototyping and proof-of-concept development. These platforms include the XCVU095-3FFVC2104E along with supporting circuitry, connectors, and reference designs. IP cores and libraries accelerate development by providing pre-verified functions for common applications including signal processing, networking, and memory interfaces.
Technical support resources include community forums, application engineering assistance, and training programs. Partner ecosystem solutions provide additional tools, IP, and consulting services specifically tailored for XCVU095-3FFVC2104E implementations.
Environmental & Export Classifications
The XCVU095-3FFVC2104E meets stringent environmental and reliability standards required for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing processes. Lead-free construction supports modern assembly requirements while maintaining high reliability standards.
Export classification for the XCVU095-3FFVC2104E follows applicable international trade regulations. The device may be subject to export control restrictions depending on end-use applications and destination countries. Customers must verify compliance with relevant export regulations including EAR (Export Administration Regulations) and ITAR (International Traffic in Arms Regulations) requirements.
Operating temperature specifications support commercial applications with appropriate thermal management. The device includes built-in temperature monitoring and protection features to ensure reliable operation across specified environmental conditions. Qualification testing validates performance under various stress conditions including temperature cycling, humidity, and mechanical shock.
The XCVU095-3FFVC2104E represents the pinnacle of FPGA technology, combining massive programmable resources with advanced features to enable next-generation applications in high-performance computing, networking, and data acceleration markets.
