Product Specifications
The XCVU095-3FFVB2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, engineered to deliver exceptional performance and integration capabilities for demanding applications.
Key Technical Specifications
- Logic Elements/Cells: 1,176,000 logic elements providing massive computational capacity
- LABs/CLBs: 67,200 Logic Array Blocks/Configurable Logic Blocks
- Total RAM: 62,259,200 bits (62.3 MB) of on-chip memory
- I/O Count: 832 I/Os for comprehensive connectivity options
- Process Technology: Advanced 20nm manufacturing technology
- Supply Voltage: 0.922V – 0.979V (0.95V nominal)
- Package: 2104-BBGA, FCBGA (47.5mm ร 47.5mm)
- Operating Temperature: 0ยฐC to 100ยฐC (TJ)
- Mounting Type: Surface Mount Technology (SMT)
Performance Characteristics
The XCVU095-3FFVB2104E features AMD’s UltraScale architecture, which combines high-performance FPGA capabilities with innovative power management technologies. This device supports:
- High-Speed Transceivers: Next-generation PCIe, 100G Ethernet, and 150G Interlaken transceivers
- DSP Processing: Massive signal processing bandwidth for compute-intensive applications
- Memory Bandwidth: Unprecedented I/O and memory bandwidth for heterogeneous processing
- Programmable Acceleration: Ideal for applications requiring flexible, high-performance computing
Applications
The XCVU095-3FFVB2104E is designed for applications requiring:
- Artificial Intelligence and Machine Learning acceleration
- High-performance computing systems
- Network and protocol analysis
- Video and image processing
- Wired communication test equipment
- Signal generators and analyzers
Price Information
Pricing for XCVU095-3FFVB2104E varies by quantity and supplier:
- Availability: Active product status with global distribution
- Lead Time: Typically 30 weeks from manufacturer
- Packaging: Bulk packaging for high-volume production
- Quantity Pricing: Volume discounts available through authorized distributors
For current pricing and availability, contact authorized distributors such as:
- Digi-Key Electronics
- Mouser Electronics
- Newark/Farnell
- Microchip USA
- Authorized AMD distributors
Note: Prices fluctuate based on market conditions and are updated regularly by distributors. Request quotes for specific quantity requirements and current lead times.
Documents & Media
Official Documentation
- Datasheet: Virtex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics
- Product Brief: Virtex UltraScale+ FPGA Product Overview
- User Guide: UltraScale Architecture and Product Data Sheet Overview
- Application Notes: Available through AMD Developer Zone
Development Resources
- Vivado Design Suite: Complete design environment for FPGA development
- IP Catalog: Comprehensive library of verified IP cores
- Reference Designs: Pre-validated designs for common applications
- Development Kits: Evaluation boards and starter kits available
Technical Support
- CAD Models: 3D models and footprints for PCB design
- IBIS Models: Signal integrity simulation models
- Pin-out Documentation: Comprehensive pin mapping and ball-out information
- Thermal Models: Junction-to-ambient thermal characteristics
Related Resources
Compatible Products
- Virtex UltraScale+ Series: Next-generation devices with enhanced performance
- Kintex UltraScale Series: Cost-optimized alternatives for mid-range applications
- Zynq UltraScale+ MPSoCs: ARM-based SoC variants with integrated processing
Development Tools
- Vivado Design Suite: Primary development environment
- Vitis Unified Platform: High-level synthesis and acceleration
- Hardware Manager: Device programming and debug tools
- System Generator: Model-based design for DSP applications
Ecosystem Support
- AMD Developer Zone: Technical resources and community support
- Training Programs: Hands-on FPGA design courses
- Partner Program: Certified design service providers
- University Program: Educational resources and support
Evaluation Platforms
- VCU118 Evaluation Kit: Comprehensive development platform
- Custom Carrier Boards: Available from ecosystem partners
- System-on-Module (SOM): Pre-validated hardware modules
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: ROHS3 Compliant
- WEEE Compliance: Meets European waste electrical requirements
- REACH Regulation: Compliant with EU chemical safety standards
- Conflict Minerals: Compliant with conflict-free sourcing requirements
Export Control Information
- ECCN: 3A001.a.7.b (Export Control Classification Number)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (European tariff classification)
- Country of Origin: Manufactured in various AMD-approved facilities
Quality Standards
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management system compliant
- IATF 16949: Automotive quality standard (where applicable)
- AS9100: Aerospace quality standard (where applicable)
Lifecycle Support
- Product Longevity: Extended support through 2045 for UltraScale+ family
- Obsolescence Management: Minimum 15-year product lifecycle
- Migration Path: Clear upgrade path to newer device families
- Technical Support: Comprehensive support throughout product lifecycle
The XCVU095-3FFVB2104E represents AMD’s commitment to delivering high-performance, reliable FPGA solutions that meet the evolving needs of today’s most demanding applications while maintaining strict environmental and quality standards
