The XCVU095-3FFVA2104E is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU095-3FFVA2104E features advanced 20nm technology with impressive specifications tailored for complex digital signal processing and high-speed data applications:
Core Specifications:
- Logic Cells: 1,143,000 system logic cells providing extensive programmable logic resources
- CLB Flip-Flops: 2,286,000 configurable logic block flip-flops for high-density designs
- Block RAM: 75.9 Mb total block RAM memory for efficient data storage and buffering
- UltraRAM: 360 Mb of UltraRAM providing large on-chip memory capacity
- DSP Slices: 768 DSP58 slices optimized for high-performance digital signal processing
Package Details:
- Package Type: FFVA2104 – Fine-pitch Ball Grid Array
- Pin Count: 2104 pins in a compact form factor
- Speed Grade: -3 (highest performance grade)
- Temperature Range: Extended commercial temperature range
- Power Supply: Multiple voltage domains supporting various I/O standards
Performance Features:
- Transceivers: Up to 80 GTY transceivers supporting data rates up to 32.75 Gbps
- PCIe Support: PCIe Gen4 x16 connectivity for high-bandwidth applications
- Memory Controllers: DDR4-3200 memory interface support
- Processing System: Integrated ARM Cortex-A53 processing capabilities
Price
The XCVU095-3FFVA2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and high-performance specifications. Contact authorized Xilinx distributors for current pricing information, as costs may vary based on:
- Order quantity and volume discounts
- Regional market conditions
- Delivery timeline requirements
- Additional support services
For budget planning, enterprise customers typically evaluate the XCVU095-3FFVA2104E against total system cost benefits, including reduced development time, lower power consumption, and enhanced performance compared to alternative solutions.
Documents & Media
Comprehensive technical documentation and resources are available for the XCVU095-3FFVA2104E:
Technical Documentation:
- Product specification datasheet with detailed electrical characteristics
- Pin-out and package information guides
- Power consumption and thermal analysis reports
- Design methodology and implementation guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core integration documentation
- Timing and constraint guidance
Support Materials:
- Product selection guides comparing Virtex UltraScale+ family options
- Migration guides from previous FPGA generations
- Evaluation board documentation and schematics
- Video tutorials and webinar recordings
Related Resources
The XCVU095-3FFVA2104E integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- Vitis unified software platform for embedded and acceleration development
- IP Integrator for system-level design integration
- Hardware debugging and analysis tools
Complementary Products:
- Zynq UltraScale+ MPSoCs for processing-intensive applications
- Artix and Kintex UltraScale+ FPGAs for cost-optimized solutions
- Versal ACAP devices for AI and DSP acceleration
Ecosystem Partners:
- Board-level product partners offering XCVU095-3FFVA2104E-based solutions
- IP vendors providing optimized cores and accelerators
- System integrators specializing in FPGA-based designs
- Cloud service providers offering FPGA acceleration services
Environmental & Export Classifications
The XCVU095-3FFVA2104E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant manufacturing
- REACH regulation compliance for European markets
- Conflict minerals reporting in accordance with SEC requirements
- Green packaging initiatives reducing environmental impact
Export Control Classifications:
- Export Control Classification Number (ECCN) as designated by US Commerce Department
- International Traffic in Arms Regulations (ITAR) compliance status
- Wassenaar Arrangement considerations for dual-use technology
- Country-specific import/export documentation requirements
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive-grade reliability testing (where applicable)
- Industrial temperature range validation
- Long-term supply chain commitment and lifecycle management
Sustainability Initiatives:
- Energy-efficient design reducing overall system power consumption
- Recyclable packaging materials and responsible disposal guidance
- Carbon footprint reduction through optimized manufacturing processes
- Supply chain transparency and responsible sourcing practices
The XCVU095-3FFVA2104E represents Xilinx’s commitment to delivering high-performance, environmentally responsible FPGA solutions that enable next-generation applications across multiple industries while maintaining compliance with global regulatory standards.
