The XCVU095-2FFVC1517E is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, communications, and high-performance computing environments.
Product Specification
The XCVU095-2FFVC1517E features advanced 20nm technology with impressive specifications that make it ideal for complex processing tasks:
Core Features:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,286,000
- CLB LUTs: 1,143,000
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb of UltraRAM capacity
- DSP Slices: 768 DSP48E2 slices for high-speed signal processing
Memory and Connectivity:
- DDR4 memory interface support up to 2,666 Mbps
- 96 GTY transceivers supporting up to 32.75 Gbps
- PCIe Gen4 x16 endpoint and root port capability
- 100G Ethernet MAC support
Package Details:
- Package Type: FFVC1517 (Fine-pitch Flip Chip Very Dense BGA)
- Pin Count: 1,517 pins
- Speed Grade: -2 (high performance)
- Temperature Grade: Extended commercial (0ยฐC to 85ยฐC)
The XCVU095-2FFVC1517E operates with multiple power supply voltages and includes advanced power management features for optimal efficiency in high-performance applications.
Price
Pricing for the XCVU095-2FFVC1517E varies based on quantity, supplier, and current market conditions. Enterprise customers typically receive volume discounts for bulk orders. Contact authorized distributors for current pricing and availability, as FPGA prices fluctuate based on semiconductor market conditions and demand.
For budget planning, consider factors such as:
- Minimum order quantities
- Lead times for delivery
- Long-term availability commitments
- Technical support requirements
Documents & Media
Essential documentation for the XCVU095-2FFVC1517E includes:
Technical Documentation:
- Virtex UltraScale+ FPGA Data Sheet with complete electrical specifications
- Package and pinout documentation for FFVC1517 package
- Power and thermal design guidelines
- PCB design and layout recommendations
Software Resources:
- Vivado Design Suite compatibility information
- IP core libraries and reference designs
- Debugging and verification tools documentation
Application Notes:
- High-speed transceiver implementation guides
- Memory interface design best practices
- Thermal management strategies
- Signal integrity considerations for high-speed designs
These resources are available through Xilinx’s official documentation portal and authorized design tool environments.
Related Resources
The XCVU095-2FFVC1517E ecosystem includes comprehensive development resources:
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- Vitis unified software platform for acceleration applications
- Hardware debug tools and analyzers
- Simulation and verification environments
Reference Designs:
- 100G Ethernet implementation examples
- PCIe endpoint and root complex designs
- High-speed ADC/DAC interface solutions
- Machine learning acceleration frameworks
Community and Support:
- Xilinx developer forums and community resources
- Training materials and certification programs
- Technical application support channels
- Partner ecosystem for specialized solutions
Complementary Products:
- Compatible development boards and evaluation kits
- Power management solutions
- Cooling and thermal management systems
- High-speed connectors and cables
Environmental & Export Classifications
The XCVU095-2FFVC1517E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant for lead-free manufacturing
- REACH regulation compliance for chemical safety
- Conflict minerals reporting compliance
- ISO 14001 environmental management system certified
Operating Conditions:
- Operating temperature range: 0ยฐC to +85ยฐC (extended commercial)
- Storage temperature range: -65ยฐC to +150ยฐC
- Humidity tolerance: 5% to 95% non-condensing
- Altitude operation up to 2,000 meters
Export Classifications:
- Export Control Classification Number (ECCN) classification applies
- Subject to U.S. export administration regulations
- May require export licenses for certain destinations
- Compliance with international trade regulations required
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive-grade reliability testing available
- Extended temperature variants for harsh environments
- Long-term supply commitment programs available
The XCVU095-2FFVC1517E represents a premium solution for applications requiring maximum performance, extensive I/O capabilities, and reliable operation in demanding environments. Its combination of processing power, connectivity options, and comprehensive development ecosystem makes it an excellent choice for next-generation system designs.
