The XCVU095-2FFVB2104I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed for demanding applications requiring exceptional processing power and flexibility. This advanced programmable logic device delivers superior performance for data center acceleration, wireless infrastructure, and high-performance computing applications.
Product Specifications
The XCVU095-2FFVB2104I features comprehensive technical specifications that make it ideal for complex digital signal processing and hardware acceleration tasks:
Core Architecture:
- Device Family: Virtex UltraScale+
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,280,000
- CLB LUTs: 1,140,000
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 432 Mb integrated UltraRAM
Memory and DSP Capabilities:
- DSP Slices: 2,520 DSP48E2 slices
- Memory Controllers: Integrated DDR4/DDR3 memory interface
- PCIe Support: PCIe Gen3 x16 and Gen4 x8 capability
- Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
Package Details:
- Package Type: FFVB2104 (Flip Chip Ball Grid Array)
- Pin Count: 2,104 pins
- Speed Grade: -2 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC
- Supply Voltage: Multiple voltage rails (1.0V core, 1.8V auxiliary)
Price Information
The XCVU095-2FFVB2104I pricing varies based on quantity and distribution channel. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary from 12-20 weeks depending on market conditions and inventory levels.
Factors affecting XCVU095-2FFVB2104I pricing include:
- Order quantity and volume commitments
- Packaging and delivery requirements
- Regional availability and distribution costs
- Current market demand and supply chain conditions
Documents & Media
Essential documentation for the XCVU095-2FFVB2104I includes comprehensive technical resources to support design and implementation:
Technical Documentation:
- Virtex UltraScale+ FPGA Data Sheet (DS923)
- XCVU095-2FFVB2104I Package and Pinout Specifications
- Power and Thermal Design Guidelines
- SelectIO Resources and Packaging User Guide
- Memory Interface Solutions User Guide
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core integration guidelines
- Timing and constraint examples
- Hardware debugging documentation
Development Tools:
- Xilinx Vivado Design Suite support
- Software Development Kit (SDK) compatibility
- Hardware simulation models
- Power estimation tools and calculators
Related Resources
The XCVU095-2FFVB2104I ecosystem includes complementary products and development resources:
Development Boards:
- Xilinx VCU118 Evaluation Kit
- Third-party development platforms
- Custom carrier board designs
- Evaluation and prototyping modules
Compatible IP Cores:
- High-speed interface IP (DDR4, PCIe, Ethernet)
- Signal processing IP cores
- Video and imaging processing blocks
- Networking and security IP solutions
Software Tools:
- Vivado HLS for high-level synthesis
- PetaLinux for embedded Linux development
- SDSoC development environment
- Model-based design tool integration
Training and Support:
- Xilinx University Program resources
- Online training courses and tutorials
- Technical support and community forums
- Design methodology and best practices guides
Environmental & Export Classifications
The XCVU095-2FFVB2104I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting template available
- ISO 14001 environmental management certification
Export Control Classification:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
- Export license requirements may apply for certain destinations
Quality and Reliability:
- Commercial temperature grade: 0ยฐC to +85ยฐC
- Moisture sensitivity level: MSL 3
- ESD protection: Human Body Model (HBM) and Charged Device Model (CDM)
- MTBF (Mean Time Between Failures): Exceeds 1,000,000 hours
Packaging and Handling:
- Anti-static packaging requirements
- Dry pack storage conditions
- Baking requirements before assembly
- Traceability and lot control procedures
