The XCVU095-2FFVB1760E is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU095-2FFVB1760E features advanced 20nm technology and offers impressive computational capabilities:
Core Specifications:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 914,000
- CLB LUTs: 537,600
- Block RAM: 67.0 Mb total block RAM
- UltraRAM: 270.0 Mb UltraRAM capacity
- DSP Slices: 768 DSP48E2 slices
- Speed Grade: -2 (high performance)
- Package: FFVB1760 (1760-pin flip chip BGA)
- Operating Temperature: Extended commercial (0ยฐC to 85ยฐC)
Advanced Features:
- 16nm FinFET+ technology for optimal power efficiency
- Integrated 100G Ethernet MAC and PCS
- PCIe Gen4 x16 connectivity
- Advanced security features including encryption and authentication
- High-speed serial transceivers up to 32.75 Gbps
- Quad-core ARM Cortex-A53 processing system integration ready
Price
The XCVU095-2FFVB1760E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized distributors for current pricing and volume discounts. Typical market pricing ranges from $8,000 to $15,000 per unit, depending on quantity and supplier. Educational and development pricing may be available through Xilinx University Program.
Documents & Media
Technical Documentation:
- Product Brief and Datasheet (DS962)
- Virtex UltraScale+ FPGA User Guide (UG575)
- Packaging and Pinout Specifications (UG1075)
- Configuration User Guide (UG570)
- SelectIO Resources User Guide (UG571)
Development Resources:
- Vivado Design Suite compatibility guides
- Reference designs and application notes
- Power estimation and thermal analysis tools
- Hardware debugging and validation guides
Video Resources:
- Virtex UltraScale+ architecture overview
- Design methodology webinars
- Performance optimization tutorials
Related Resources
Development Tools:
- Vivado Design Suite (latest version recommended)
- Vitis Unified Software Platform
- ChipScope Pro Analyzer for debugging
- Power Estimator (XPE) tool
Evaluation Platforms:
- VCU118 Evaluation Kit (compatible development board)
- Virtex UltraScale+ VCU128 Evaluation Kit
- Custom carrier boards from ecosystem partners
Support Resources:
- Xilinx Support Portal and knowledge base
- Community forums and developer networks
- Technical support and consulting services
- Training courses and certification programs
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Conflict minerals reporting template available
- Environmental Product Declaration (EPD) available
Export Classifications:
- ECCN: 3A001.a.2 (US Export Administration Regulations)
- CCATS: Available upon request
- Export License: May be required for certain destinations
- Country of Origin: Taiwan/Singapore (assembly location varies)
Quality Standards:
- ISO 14001 environmental management certified
- Automotive-grade variants available (XCVU095-2FFVB1760I)
- Military temperature range options
- Extended reliability testing and qualification
The XCVU095-2FFVB1760E represents the pinnacle of FPGA technology, combining massive parallel processing capabilities with advanced connectivity features. Its robust architecture makes it ideal for applications requiring high bandwidth, low latency, and exceptional computational performance in mission-critical environments.
