The XCVU095-1FFVC1517I is a cutting-edge Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale+ series, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU095-1FFVC1517I features advanced 20nm technology with impressive capabilities that make it ideal for complex processing tasks. This FPGA incorporates approximately 537,600 logic cells and 1,728 DSP slices, providing substantial computational power for signal processing, machine learning inference, and parallel processing applications.
Key specifications of the XCVU095-1FFVC1517I include:
- Logic Cells: 537,600 system logic cells
- Block RAM: 38.4 Mb total block RAM
- DSP Slices: 1,728 DSP48E2 slices
- Package: FFVC1517 (1517-pin flip chip BGA)
- Speed Grade: -1 (standard performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- I/O Pins: Up to 832 user I/O pins
- Transceivers: 48 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen4 x16 capability
- Memory Interface: DDR4-2666, DDR4-2400 support
The XCVU095-1FFVC1517I utilizes AMD Xilinx’s UltraScale+ architecture, which combines programmable logic with hardened IP blocks for optimal performance per watt. This FPGA supports advanced features including UltraRAM technology, providing additional memory hierarchy options for data-intensive applications.
Price
Pricing for the XCVU095-1FFVC1517I varies based on quantity, distributor, and current market conditions. The XCVU095-1FFVC1517I typically falls within the premium FPGA price range due to its high-performance capabilities and advanced features. For current pricing and availability of the XCVU095-1FFVC1517I, customers should contact authorized AMD Xilinx distributors or check electronic component suppliers’ websites. Volume discounts may be available for large-quantity orders of the XCVU095-1FFVC1517I.
Documents & Media
Comprehensive documentation supports the XCVU095-1FFVC1517I implementation and development process. Essential documents for the XCVU095-1FFVC1517I include:
The official datasheet provides detailed electrical characteristics, timing specifications, and pinout information specific to the XCVU095-1FFVC1517I. Package and pinout documentation offers mechanical drawings and pin assignments for the FFVC1517 package used in the XCVU095-1FFVC1517I.
User guides cover the UltraScale+ architecture fundamentals, helping developers understand the XCVU095-1FFVC1517I’s capabilities and optimization strategies. Application notes demonstrate best practices for implementing designs on the XCVU095-1FFVC1517I, including power management, thermal considerations, and high-speed design techniques.
Development tools documentation includes Vivado Design Suite guides, which provide comprehensive information for designing, simulating, and implementing projects on the XCVU095-1FFVC1517I. Reference designs and example projects accelerate development time when working with the XCVU095-1FFVC1517I.
Related Resources
The XCVU095-1FFVC1517I ecosystem includes various development tools and resources that enhance the design experience. Vivado Design Suite serves as the primary development environment for the XCVU095-1FFVC1517I, providing synthesis, implementation, and debugging capabilities.
Development boards featuring the XCVU095-1FFVC1517I or similar UltraScale+ devices offer hands-on evaluation platforms. These boards typically include memory interfaces, connectivity options, and reference designs that demonstrate the XCVU095-1FFVC1517I’s capabilities.
IP cores and libraries optimized for the XCVU095-1FFVC1517I architecture provide pre-verified functionality blocks, reducing development time and improving reliability. These include DSP libraries, communication protocols, and interface controllers specifically tested with the XCVU095-1FFVC1517I.
Training resources and documentation help engineers maximize the potential of the XCVU095-1FFVC1517I through online courses, webinars, and technical workshops focused on UltraScale+ architecture and advanced FPGA design techniques.
Environmental & Export Classifications
The XCVU095-1FFVC1517I meets various environmental and regulatory standards required for commercial and industrial applications. This device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing processes.
Environmental specifications for the XCVU095-1FFVC1517I include operating temperature ranges suitable for industrial applications, with the “I” grade supporting -40ยฐC to +100ยฐC operation. The device undergoes extensive qualification testing to ensure reliability across its specified environmental conditions.
Export classification information for the XCVU095-1FFVC1517I indicates any relevant export control restrictions that may apply to international shipments. Users should verify current export regulations when incorporating the XCVU095-1FFVC1517I into products intended for global distribution.
The XCVU095-1FFVC1517I represents a powerful solution for applications requiring high-performance programmable logic capabilities, combining advanced architecture with comprehensive development support for successful project implementation.
