The XCVU095-1FFVA1760C is a premium Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed for demanding applications requiring exceptional processing power and flexibility. This advanced FPGA delivers outstanding performance for data center acceleration, machine learning, and high-bandwidth signal processing applications.
Product Specifications
The XCVU095-1FFVA1760C features robust specifications that make it ideal for complex digital signal processing and acceleration tasks:
Core Architecture
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 912,000 flip-flops
- CLB LUTs: 456,000 Look-Up Tables
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb UltraRAM capacity
Processing Elements
- DSP Slices: 768 DSP48E2 slices for high-performance arithmetic
- PCIe Lanes: Up to 16 PCIe Gen4 lanes
- Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
- Speed Grade: -1 speed grade for balanced performance and power
Package Details
- Package Type: FFVA1760 (Flip-Chip Fine-Pitch BGA)
- Pin Count: 1,760 pins
- Temperature Grade: Commercial (C) grade: 0ยฐC to +85ยฐC
- Voltage: Multiple voltage domains supported
The XCVU095-1FFVA1760C integrates ARM Cortex-A53 processing system with programmable logic, providing unmatched flexibility for system-on-chip designs.
Price
Pricing for the XCVU095-1FFVA1760C varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities.
Note: Prices subject to change. Contact suppliers for real-time quotes on the XCVU095-1FFVA1760C.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and operating conditions
- User Guide: Comprehensive implementation guide for the XCVU095-1FFVA1760C
- Package Information: Detailed pin-out diagrams and mechanical specifications
- Application Notes: Design guidelines and best practices
- Selection Guide: Comparison with other Virtex UltraScale+ devices
Development Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified IP cores compatible with XCVU095-1FFVA1760C
- Reference Designs: Accelerated development starting points
- Simulation Models: Behavioral and timing simulation support
Related Resources
Development Boards
- VCU118 Evaluation Kit: Full-featured development platform
- Custom carrier boards: Third-party solutions for specific applications
Software Tools
- Xilinx Vivado: Complete design suite for XCVU095-1FFVA1760C development
- Vitis Unified Software Platform: High-level synthesis and optimization
- Hardware debugging tools: ChipScope and integrated logic analyzers
Support Communities
- Xilinx Community Forums: Technical discussions and troubleshooting
- Application Engineering: Direct technical support from Xilinx
- Training Resources: Online courses and certification programs
Environmental & Export Classifications
Environmental Compliance
The XCVU095-1FFVA1760C meets stringent environmental standards:
- RoHS Compliant: Lead-free construction
- REACH Compliance: European chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Export Control Classification
- ECCN: Check current export control classification
- Country Restrictions: Verify export licensing requirements
- Trade Compliance: Consult legal requirements for international shipping
Operating Environment
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters operational
The XCVU095-1FFVA1760C represents cutting-edge FPGA technology, combining high-performance processing capabilities with flexible programmability for next-generation applications in data centers, telecommunications, and aerospace industries.
For detailed technical specifications and the latest updates on the XCVU095-1FFVA1760C, consult the official Xilinx documentation and authorized distributors.
