The XCVU080-H1FFVC1517E is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU080-H1FFVC1517E features advanced 20nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 663,360 logic cells with 2,520 CLBs (Configurable Logic Blocks), delivering substantial processing capability for complex digital designs.
Key Technical Specifications:
- Logic Cells: 663,360
- CLBs: 2,520
- Block RAM: 75.9 Mb total capacity
- UltraRAM: 360 Mb
- DSP Slices: 6,840 for high-performance signal processing
- Package Type: FFVC1517 (Flip Chip Fine Pitch BGA)
- I/O Pins: 832 user I/O pins
- Speed Grade: -1 (standard performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
The XCVU080-H1FFVC1517E supports PCIe Gen3 x16 connectivity and features advanced transceivers operating up to 32.75 Gb/s, making it ideal for high-bandwidth applications requiring rapid data transfer.
Price
Pricing for the XCVU080-H1FFVC1517E varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for large-quantity orders. Lead times may vary depending on global supply chain conditions.
Documents & Media
Essential Documentation:
- Product Data Sheet (DS893)
- Virtex UltraScale+ FPGA User Guide
- Package and Pinout Specifications
- Power and Thermal Design Guidelines
- Migration and Compatibility Guide
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Simulation models and IP cores
- Hardware evaluation boards documentation
Media Assets:
- High-resolution product images
- Technical block diagrams
- Package dimension drawings
- Thermal performance charts
Related Resources
Development Tools:
- Vivado Design Suite for synthesis and implementation
- Vitis Unified Software Platform for acceleration
- ChipScope Pro for debugging and verification
- ISE compatibility layers for legacy designs
Evaluation Boards:
- VCU1525 Acceleration Development Card
- Custom carrier boards from third-party vendors
- Prototyping platforms for specific applications
IP Cores and Libraries:
- Xilinx IP Portfolio compatibility
- Third-party IP integration support
- Custom IP development guidelines
- Pre-verified interface IP blocks
Technical Support:
- Xilinx Answer Database access
- Community forums and user groups
- Technical documentation portal
- Training resources and webinars
Environmental & Export Classifications
Environmental Compliance: The XCVU080-H1FFVC1517E meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance and REACH regulation requirements. The device is manufactured using lead-free processes and environmentally responsible materials.
Export Control Classification:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Various (component dependent)
Certifications:
- ISO 14001 environmental management
- IATF 16949 automotive quality standard
- IPC standards compliance
- UL recognition where applicable
End-of-Life Considerations: Xilinx provides comprehensive end-of-life management programs including proper disposal guidelines and recycling recommendations for the XCVU080-H1FFVC1517E and associated development materials.
The XCVU080-H1FFVC1517E represents the pinnacle of FPGA technology, combining high performance, flexibility, and reliability for mission-critical applications across multiple industries.
