The XCVU080-H1FFVB1760E represents AMD Xilinx’s cutting-edge Field Programmable Gate Array (FPGA) technology, designed for demanding applications requiring exceptional processing power and flexibility. This Virtex UltraScale+ series device delivers outstanding performance for data center acceleration, machine learning inference, and high-bandwidth computing applications.
Product Specifications
Core Architecture
The XCVU080-H1FFVB1760E features advanced 20nm technology with the following key specifications:
Logic Resources:
- Logic Cells: 832,000
- CLB Flip-Flops: 1,663,200
- CLB LUTs: 831,600
- Distributed RAM: 331 Kb
- Block RAM: 45.6 Mb
DSP and Memory:
- DSP Slices: 6,840
- UltraRAM: 270 Mb
- Maximum Memory Bandwidth: Up to 1,200 GB/s
I/O and Connectivity:
- Package: FFVB1760 (Fine-pitch BGA)
- Total I/O Pins: 832
- High-Performance I/O Banks: 12
- Transceiver Count: 80 (GTY)
- Maximum Data Rate: 30.5 Gbps per channel
Power and Thermal:
- Core Voltage: 0.85V
- Operating Temperature: -40ยฐC to +100ยฐC (Commercial)
- Power Consumption: Optimized for high-performance applications
Package Details
The XCVU080-H1FFVB1760E utilizes a 1760-pin Fine-pitch Ball Grid Array (FFVB) package, measuring 42.5mm ร 42.5mm with a 0.8mm ball pitch. This compact form factor enables high-density board designs while maintaining excellent thermal performance.
Price Information
XCVU080-H1FFVB1760E pricing varies based on order quantity and distribution channel:
- Single Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for quantities over 100 units
- Development Kits: Evaluation boards available starting from $2,995
Note: Prices are subject to change and may vary by region. Contact AMD Xilinx or authorized distributors for the most current XCVU080-H1FFVB1760E pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: DS890 – Virtex UltraScale+ FPGAs Data Sheet
- User Guide: UG575 – Virtex UltraScale+ FPGAs User Guide
- PCB Design Guide: UG583 – Virtex UltraScale+ FPGAs PCB Design and Pin Planning Guide
- Power Management: UG583 – Virtex UltraScale+ FPGAs Power Management Guide
Software Resources
- Vivado Design Suite: Complete development environment for XCVU080-H1FFVB1760E
- Vitis Unified Software Platform: For application acceleration and AI inference
- Reference Designs: Pre-validated designs for common applications
Media Resources
- Product overview videos and webinars
- Technical white papers on UltraScale+ architecture
- Application notes for specific use cases
- Training materials and tutorials
Related Resources
Development Tools
- Vivado Design Suite 2023.2+: Required for XCVU080-H1FFVB1760E development
- Vitis HLS: High-level synthesis tool for C/C++ to RTL conversion
- System Generator: MATLAB/Simulink integration for DSP applications
Compatible Products
- Zynq UltraScale+ MPSoCs: For system-level integration
- Kintex UltraScale+ FPGAs: For cost-optimized alternatives
- Versal ACAP: Next-generation adaptive compute acceleration platform
Application Areas
The XCVU080-H1FFVB1760E excels in:
- Data Center Acceleration: Database analytics, search acceleration
- Machine Learning: CNN inference, deep learning training
- High-Frequency Trading: Ultra-low latency financial applications
- Video Processing: 8K/4K video transcoding and streaming
- 5G Infrastructure: Baseband processing and beamforming
Support Resources
- AMD Xilinx Support: Technical support and documentation portal
- Community Forums: Peer-to-peer technical discussions
- Training Programs: Online and in-person FPGA design courses
- Application Engineering: Direct support for complex designs
Environmental & Export Classifications
Environmental Compliance
The XCVU080-H1FFVB1760E meets stringent environmental standards:
- RoHS Compliant: Restriction of Hazardous Substances directive compliant
- REACH Compliant: Registration, Evaluation, Authorization of Chemicals regulation
- Halogen-Free: Environmentally friendly materials and processes
- WEEE Compliant: Waste Electrical and Electronic Equipment directive
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters
Export Classifications
Important: The XCVU080-H1FFVB1760E is subject to export control regulations:
- ECCN (Export Control Classification Number): 3A001.a.7
- US Export Administration Regulations (EAR): Subject to EAR controls
- International Traffic in Arms Regulations (ITAR): Not ITAR controlled
- License Requirements: May require export license for certain destinations
Compliance Certifications
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system
- TS 16949: Automotive quality management (where applicable)
- AS9100: Aerospace quality management system
Packaging and Logistics
- Moisture Sensitivity Level (MSL): Level 3
- Shelf Life: 12 months from date of manufacture
- Packaging: Anti-static trays with moisture barrier bags
- Lead Time: Typically 12-16 weeks for standard orders
The XCVU080-H1FFVB1760E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. For detailed technical specifications, pricing, and availability, contact AMD Xilinx or authorized distributors.
