The XCVU080-3FFVC1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This advanced programmable logic device delivers exceptional performance and integration capabilities for demanding applications in networking, data centers, telecommunications, and high-performance computing.
Product Specifications
Core Architecture
- Family: Virtex UltraScale
- Part Number: XCVU080-3FFVC1517E
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Technology Node: 20nm
- Speed Grade: -3 (highest performance grade)
Logic Resources
- Logic Cells: 780,000 cells
- System Logic Cells: Approximately 975,000 equivalent
- I/O Count: 520 user I/O pins
- Package Type: 1517-pin FCBGA (Flip Chip Ball Grid Array)
- Package Code: FFVC1517
Power and Operating Conditions
- Core Voltage: 1.0V typical
- Supply Voltage Range: 0.970V – 1.030V
- Operating Temperature: 0ยฐC to 100ยฐC (TJ – Junction Temperature)
- Commercial grade device
Memory and Processing
- Block RAM: High-density on-chip memory
- DSP Slices: Optimized for signal processing applications
- Transceivers: Next-generation high-speed serial I/O capability
- Clock Management: Advanced clocking resources with PLLs and MMCMs
Advanced Features
- UltraScale Architecture: Built on AMD’s innovative UltraScale platform
- SSI Technology: Stacked Silicon Interconnect for enhanced performance
- Power Optimization: Advanced power management features
- High-Speed Connectivity: Support for various high-speed protocols
Price Information
The XCVU080-3FFVC1517E is positioned as a premium high-performance FPGA with pricing reflecting its advanced capabilities:
- Price Range: $938.00 – $6,618.00 (varies by quantity and distributor)
- Volume Discounts: Available for bulk orders
- Lead Time: Standard availability from authorized distributors
- Minimum Order: Typically 1 piece minimum order quantity
Authorized Distributors
- Mouser Electronics
- DigiKey
- FPGAkey
- Microchip USA
- OMO Electronic
- Ovaga Technologies
Note: Prices fluctuate based on market conditions, quantity, and distributor. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD Xilinx documentation portal
- Package and Pinout Information: UG575 UltraScale Package and Pinout Guide
- Configuration User Guide: UG570 UltraScale Configuration User Guide
- Product Brief: Virtex UltraScale Product Overview
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Application-specific design examples
- Migration Guides: For upgrading from previous FPGA generations
Support Materials
- Application Notes: Implementation best practices
- White Papers: Technical deep-dives and performance analysis
- Video Tutorials: Design methodology and tool usage
- Community Forums: Technical support and user discussions
Related Resources
Development Platforms
- VCU118 Evaluation Kit: Recommended development platform for Virtex UltraScale+ (similar architecture)
- Compatible Evaluation Boards: Various third-party development platforms
- Prototyping Solutions: Custom carrier boards and development systems
Design Tools
- Vivado Design Suite: Integrated design environment
- Vivado HLS: High-Level Synthesis for C/C++/SystemC
- SDK/Vitis: Software development platform
- ChipScope Pro: Integrated logic analyzer
Compatible Products
- XCVU080-2FFVC1517E: Lower speed grade variant (-2 speed grade)
- XCVU080-1FFVC1517E: Lowest speed grade variant (-1 speed grade)
- XCVU095: Higher logic density alternative
- XCVU065: Lower logic density alternative
Application Areas
- 400G+ Networking: High-bandwidth network infrastructure
- Data Center Acceleration: Machine learning and AI acceleration
- 5G Infrastructure: Baseband processing and beamforming
- ASIC Prototyping: Large-scale system verification
- Radar Systems: Real-time signal processing
- Test Equipment: High-speed protocol analysis
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances certified
- REACH Compliant: European chemical regulation compliance
- Halogen-Free: Environmentally friendly packaging materials
- Pb-Free: Lead-free manufacturing process
Package Information
- Package Dimensions: 47.5mm ร 47.5mm
- Ball Pitch: Fine-pitch BGA for high I/O density
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Storage Requirements: Dry storage recommended
Export Classifications
- ECCN: Export Control Classification Number (contact manufacturer for current status)
- Country of Origin: Manufactured in authorized facilities
- Export Restrictions: Subject to applicable export control regulations
- License Requirements: May require export licenses for certain destinations
Quality Standards
- ISO 9001: Quality management system certified
- Automotive Grade: Available in automotive-qualified variants
- Industrial Temperature: Extended temperature range options
- Radiation Tolerant: Space-grade variants available
Packaging Options
- Tray Packaging: Standard for prototyping and low-volume production
- Tape and Reel: Available for high-volume manufacturing
- Moisture Barrier Bag: Enhanced protection during shipping and storage
Technical Support: For detailed technical specifications, design guidance, and application support, contact AMD Xilinx technical support or authorized distributors. The XCVU080-3FFVC1517E represents the pinnacle of FPGA performance and integration, delivering the capabilities needed for next-generation digital systems.
