Product Overview
The XCVU080-3FFVB1760E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Virtex UltraScale family, designed to deliver exceptional performance and integration capabilities. This advanced FPGA combines high logic capacity, superior I/O bandwidth, and energy efficiency, making it ideal for demanding applications in data centers, aerospace, defense, and high-performance computing.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale
- Part Number: XCVU080-3FFVB1760E
- Technology Node: 20nm process technology
- Speed Grade: -3 (Industrial grade performance)
- Logic Cells: 780,000 to 975,000 cells
- Core Voltage: 1V operating voltage
Package Details
- Package Type: FFVB1760 (Flip-chip Fine-pitch Ball Grid Array)
- Pin Count: 1760 pins
- Package Dimensions: 42.5mm x 42.5mm
- Ball Pitch: 1.0mm
- Package Height: Optimized for high-density designs
Memory and I/O Specifications
- Block RAM: Up to 50.0 Mb total Block RAM
- User I/O: 650 High Range (HR) and High Performance (HP) I/O pins
- I/O Standards: Support for multiple voltage levels and signaling standards
- Serial Transceivers:
- 32 GTH (16.3 Gb/s) channels
- 16 GTY (32.75 Gb/s) channels
- DSP Slices: High-performance DSP48E2 slices for signal processing
Performance Features
- Maximum Operating Frequency: Up to 741 MHz for optimized designs
- Power Efficiency: Advanced 20nm UltraScale architecture for reduced power consumption
- Interconnect: Advanced routing architecture for high-speed signal integrity
- Configuration: Multiple configuration options including JTAG, SPI, and SelectMAP
2. Price Information
Pricing Structure
- Unit Price: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities of 100+ units
- Lead Time: Standard lead time 8-12 weeks (subject to availability)
- Minimum Order Quantity: 1 unit for prototyping, 25 units for production orders
Cost Considerations
- Development Tools: Vivado Design Suite required (separate licensing)
- Evaluation Boards: Development boards available separately
- Support Packages: Technical support and training packages available
Note: Prices are subject to change based on market conditions and volume requirements. Contact authorized distributors for current quotes.
3. Documents & Media
Technical Documentation
- Datasheet: DS890 UltraScale Overview and Specifications
- User Guide: UG575 UltraScale Architecture Package Pinouts and Board Design
- Application Notes:
- Power Management Guidelines
- High-Speed Design Considerations
- Signal Integrity Best Practices
Design Resources
- Pinout Files: Available in ASCII, CSV, and Excel formats
- Package Drawings: Mechanical specifications and land pattern recommendations
- Reference Designs: Example implementations for common applications
- Vivado IP Catalog: Pre-verified IP cores and reference designs
Software Support
- Vivado Design Suite: Complete development environment
- System Generator: MATLAB/Simulink integration tools
- SDK: Software development kit for embedded processing
- Documentation: Comprehensive user guides and tutorials
4. Related Resources
Development Tools
- Vivado Design Suite: Industry-leading FPGA design software
- Hardware Manager: Device programming and debugging tools
- IP Integrator: Graphical IP integration environment
- Constraint Wizard: Timing and physical constraint guidance
Evaluation Platforms
- VCU108 Evaluation Board: Compatible development platform
- Custom Carrier Boards: Third-party development solutions
- FMC Modules: FPGA Mezzanine Card expansion options
Training and Support
- Technical Training: Online and instructor-led courses
- Community Forums: Developer community and support resources
- Application Engineering: Direct technical support services
- Partner Network: Certified design service providers
Compatible Products
- XCVU095-3FFVB1760E: Higher capacity variant
- XCVU080-2FFVB1760E: Commercial grade alternative
- Memory Solutions: Compatible DDR4, HBM, and QDR-IV memory interfaces
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature Range:
- Commercial (C): 0ยฐC to +85ยฐC
- Industrial (I): -40ยฐC to +100ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Resistance: ฮธJA = 11.2ยฐC/W (typical with proper cooling)
Reliability Standards
- RoHS Compliance: RoHS 6/6 compliant, lead-free packaging
- REACH Compliance: Meets EU REACH regulations
- MSL Rating: Moisture Sensitivity Level 3
- ESD Rating: Class 1C (>2000V) Human Body Model
Quality Certifications
- ISO 9001: Manufacturing quality management
- ISO 14001: Environmental management systems
- IATF 16949: Automotive quality standards (where applicable)
- AS9100: Aerospace quality management
Export Control Information
- ECCN Classification: 3A001.a.7 (subject to US export regulations)
- Export License: May require export license for certain destinations
- Country Restrictions: Check current export control lists
- DDTC Compliance: Defense trade control regulations apply
Environmental Impact
- Lead-Free Packaging: Pb-free solder ball and package materials
- Halogen-Free: Package materials meet halogen-free requirements
- Recycling Programs: Manufacturer recycling programs available
- Carbon Footprint: Optimized manufacturing processes for reduced environmental impact
Applications
The XCVU080-3FFVB1760E is ideal for:
- Data Center Acceleration: Machine learning inference, database acceleration
- 5G Wireless Infrastructure: Baseband processing, beamforming
- High-Performance Computing: Scientific computing, financial modeling
- Aerospace & Defense: Radar processing, software-defined radio
- Video Processing: 4K/8K video transcoding, broadcast equipment
- Industrial Automation: Real-time control systems, motor control
Summary
The XCVU080-3FFVB1760E represents the pinnacle of FPGA technology, offering unmatched performance, flexibility, and integration capabilities. With its advanced 20nm UltraScale architecture, comprehensive I/O options, and robust development ecosystem, this FPGA is the ideal choice for next-generation applications requiring high performance and low power consumption.
For detailed specifications, pricing, and availability, contact your local AMD/Xilinx authorized distributor or visit the official AMD website.
