Product Overview
The XCVU080-3FFVA2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, specifically designed for demanding applications requiring exceptional processing power, flexibility, and integration capabilities. This cutting-edge FPGA leverages advanced 20nm technology to deliver superior performance while maintaining optimal power efficiency.
1. Product Specifications
Core Technical Specifications
- Family: Virtex UltraScale
- Manufacturer: AMD (formerly Xilinx)
- Part Number: XCVU080-3FFVA2104E
- Technology Node: 20nm
- Speed Grade: -3 (high performance)
Logic Resources
- Logic Elements/Cells: 975,000
- CLBs/LABs: 55,714
- Total RAM Bits: 51,200,000 (50.0 MB Block RAM)
- DSP Slices: Integrated high-performance DSP blocks for signal processing
Physical Characteristics
- Package Type: 2104-BBGA, FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 2104-FCBGA (47.5ร47.5mm)
- Pin Count: 2104 pins
- I/O Count: 832 user I/Os
- Mounting Type: Surface Mount Technology (SMT)
Electrical Specifications
- Supply Voltage: 0.970V ~ 1.030V (core voltage)
- Operating Temperature Range: 0ยฐC to 100ยฐC (TJ – Junction Temperature)
- Moisture Sensitivity Level: MSL 4 (72 hours)
Performance Features
- Advanced UltraScale architecture for maximum performance
- Next-generation stacked silicon interconnect (SSI) technology
- High-speed serial transceivers
- Optimized DSP and Block RAM-to-logic ratios
- Enhanced clock management and distribution
2. Pricing Information
Pricing varies by quantity and supplier. Contact authorized distributors for current pricing:
- Lead Time: Typically 30-44 weeks (standard manufacturing lead time)
- Packaging: Bulk packaging
- Minimum Order: Contact suppliers for MOQ requirements
- Price Range: Premium pricing tier (contact distributors for quotes)
Note: Pricing is subject to market conditions and availability. For the most current pricing information, please contact authorized AMD distributors such as Mouser Electronics, Digi-Key, or other certified suppliers.
3. Documents & Media
Technical Documentation
- Datasheet: DS890 UltraScale FPGA Overview
- Package and Pinout Guide: UG575 UltraScale Packaging and Pinout Guide
- SelectIO Resources Guide: Comprehensive I/O planning documentation
- Power and Thermal Guide: Thermal management and power consumption specifications
Development Resources
- Software Support: Vivado Design Suite (recommended development environment)
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Application-specific reference implementations
- User Guides: Comprehensive documentation for implementation and optimization
Media Resources
- High-resolution product images
- Package outline drawings
- 3D CAD models (available for download)
- Technical application notes
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for synthesis, implementation, and debugging
- Vivado HLS: High-Level Synthesis for C/C++/SystemC development
- SDK/Vitis: Software development kit for embedded processing
- ChipScope Pro: Real-time debugging and verification
Evaluation Platforms
- Virtex UltraScale Evaluation Kits: Complete development platforms
- Third-party Development Boards: Various form factors and configurations
- Starter Kits: Entry-level development platforms
Application Support
- Technical Support: AMD technical support services
- Training Resources: Online training modules and certification programs
- Community Forums: Developer community and knowledge sharing
- Application Notes: Specific implementation guidance
Compatible IP Cores
- Communication interfaces (PCIe, Ethernet, USB)
- Signal processing IP (FFT, FIR filters, codecs)
- Video and imaging IP
- Networking and security IP
5. Environmental & Export Classifications
Environmental Compliance
- RoHS 3 Compliant: Meets EU Directive 2011/65/EU requirements for restricted substances
- REACH Compliant: Complies with EU REACH regulation (EC) No 1907/2006
- Halogen-Free: Meets halogen-free requirements for environmentally conscious applications
- Lead-Free: Manufactured with lead-free processes and materials
Restricted Substances Compliance
The XCVU080-3FFVA2104E complies with international environmental regulations by restricting or eliminating:
- Lead (Pb)
- Mercury (Hg)
- Cadmium (Cd)
- Hexavalent Chromium (Cr6+)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
- Four additional phthalates: DEHP, BBP, DBP, and DIBP
Export Control Classifications
- ECCN: Check current export control classification with AMD
- HTS Code: 8542.39.0001 (Electronic integrated circuits)
- Country of Origin: Manufacturing location varies (check specific units)
- Export Restrictions: Subject to applicable export control regulations
Certifications & Standards
- CE Marking: Compliant for European market distribution
- ISO 14001: Manufactured under environmental management systems
- Quality Standards: Manufactured to automotive and industrial quality standards
- Conflict Minerals: Compliant with conflict minerals regulations
Environmental Impact
- Recyclable Materials: Designed for end-of-life recyclability
- Energy Efficiency: Optimized for low power consumption
- Packaging: Environmentally conscious packaging materials
- WEEE Compliance: Compliant with Waste Electrical and Electronic Equipment directive
Key Benefits
โ High Performance: 975,000 logic elements for complex applications
โ Advanced Technology: 20nm process node for optimal power and performance
โ Extensive I/O: 832 user I/Os for flexible connectivity
โ Industry Compliance: RoHS 3 and REACH compliant for global markets
โ Proven Architecture: Mature UltraScale platform with extensive ecosystem support
The XCVU080-3FFVA2104E represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive development tools, and environmental compliance to meet the most demanding applications in telecommunications, aerospace, defense, and high-performance computing markets.
