The XCVU080-2FFVC1517I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing.
Product Specifications
The XCVU080-2FFVC1517I features advanced 20nm technology with impressive capabilities:
Core Architecture:
- Logic Cells: 872,000 system logic cells
- CLB LUTs: 522,720 configurable logic blocks
- CLB Flip-Flops: 1,045,440 storage elements
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 0 Mb (not available in this variant)
DSP and Processing:
- DSP Slices: 4,560 DSP58 slices for high-speed signal processing
- ARM Cortex-A53 Processing System: Not integrated (FPGA-only device)
- Maximum Operating Frequency: Up to 741 MHz
I/O and Connectivity:
- Package: FFVC1517 (1517-pin Fine-Pitch BGA)
- I/O Pins: 832 user I/Os
- Speed Grade: -2 (industrial grade performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Advanced Features:
- PCIe Gen3 x16 connectivity
- 100G Ethernet capability
- Built-in security features
- Advanced power management
Price
The XCVU080-2FFVC1517I is positioned as a premium FPGA solution with pricing that reflects its high-performance capabilities. Contact authorized Xilinx distributors for current pricing information, as costs vary based on:
- Volume requirements
- Lead times
- Regional availability
- Support package options
Typical pricing ranges from $3,000 to $8,000 per unit depending on quantity and market conditions.
Documents & Media
Technical Documentation:
- Product Brief and Datasheet
- UltraScale+ FPGA User Guide
- Packaging and Pinout Specifications
- Power and Thermal Design Guidelines
- PCB Design Guidelines
Software Resources:
- Vivado Design Suite compatibility
- IP Core libraries and examples
- Reference designs and application notes
- Simulation models and timing data
Video Resources:
- Product overview presentations
- Technical webinars and training materials
- Design methodology tutorials
Related Resources
Development Tools:
- Vivado Design Suite (required for XCVU080-2FFVC1517I development)
- Vitis Unified Software Platform
- ChipScope Pro debugging tools
- ModelSim simulation environment
Evaluation Boards:
- VCU108 Evaluation Kit (compatible platform)
- Custom evaluation boards from third-party vendors
IP Cores:
- Xilinx LogiCORE IP portfolio
- Video processing IP
- Connectivity IP (PCIe, Ethernet, USB)
- DSP and math function IP
Support Communities:
- Xilinx Community Forums
- Technical support portal
- Training and certification programs
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free package)
- REACH regulation compliant
- Conflict minerals compliance
- ISO 14001 environmental management
Operating Conditions:
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters
Export Classification:
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- Schedule B: 8542.39.0001
- TARIC: 8542390010
Quality Standards:
- Automotive qualification available (select variants)
- Military/Aerospace screening options
- Commercial temperature grade standard
Packaging Information:
- Moisture Sensitivity Level: MSL 3
- Package weight: Approximately 8.5 grams
- Recommended storage: Dry pack with desiccant
The XCVU080-2FFVC1517I represents a powerful solution for applications requiring high-performance programmable logic, making it ideal for next-generation designs in telecommunications, data centers, and advanced driver assistance systems.
