Product Specifications
The XCVU080-2FFVC1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, delivering exceptional performance and integration capabilities at the 20nm process node. This advanced FPGA is designed to meet the demanding requirements of high-end applications ranging from 400G networking to large-scale ASIC prototyping and emulation.
Core Specifications:
- Logic Cells: 975,000 system logic cells
- DSP Slices: 672 high-performance DSP slices
- Memory: 50.0 Mb of on-chip memory
- Technology Node: 20nm advanced process technology
- Operating Voltage: 0.95V core voltage
- Package: 1517-pin FCBGA (Flip Chip Ball Grid Array)
- Temperature Range: 0°C to +100°C (TJ)
- Speed Grade: -2 (commercial grade)
Advanced I/O and Connectivity:
- I/O Pins: 832 user I/O pins for maximum connectivity
- GTH Transceivers: 32 channels at 16.3 Gb/s for high-speed serial communication
- GTY Transceivers: 32 channels at 30.5 Gb/s for ultra-high-speed applications
- PCIe Support: PCIe Gen3 x16 compatibility
- Data Rate: Up to 30.5 Gb/s per transceiver channel
Key Features:
- UltraScale Architecture: Built on AMD’s advanced UltraScale architecture for optimal performance
- Stacked Silicon Interconnect (SSI): Enables higher integration and performance
- Advanced Clocking: Multiple clock management tiles with MMCM and PLL
- High-Speed Serial I/O: Industry-leading transceiver performance
- Low Power Design: Optimized for power efficiency at 20nm node
Price Information
The XCVU080-2FFVC1517E is positioned as a premium FPGA solution with pricing reflecting its high-end capabilities:
- Commercial Pricing: Contact authorized distributors for current pricing
- Volume Discounts: Available for high-volume purchases (1000+ units)
- Lead Time: Typically 30 weeks from authorized suppliers
- Availability: Available through major electronic component distributors
- Package Options: Bulk packaging and tape & reel available
Note: Pricing varies based on quantity, lead time, and distributor. Contact sales representatives for accurate quotes and volume pricing.
Documents & Media
Technical Documentation:
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: Comprehensive implementation and design guidelines
- Product Selection Guide: UltraScale FPGA family comparison and selection criteria
- Pin-out Documentation: Detailed pin assignments and package information
- Reference Manual: Architecture overview and advanced features
Design Resources:
- Vivado Design Suite: Primary development environment and toolchain
- IP Catalog: Extensive library of pre-verified IP cores
- Reference Designs: Proven implementations for common applications
- Application Notes: Best practices and design methodologies
- Video Tutorials: Technical training and design guidance
CAD Models:
- ECAD Models: PCB footprint and symbol libraries
- 3D Models: Mechanical package models for board design
- Simulation Models: SPICE and behavioral models
Related Resources
Development Platforms:
- VCU110 Development Kit: Complete evaluation platform for Virtex UltraScale FPGAs
- Evaluation Boards: Various third-party development boards available
- Reference Designs: 400G networking, video processing, and compute acceleration examples
Compatible Products:
- XCVU065-2FFVC1517E: Lower-density alternative with 783K logic cells
- XCVU095-2FFVC1517E: Higher-density option with 1.176M logic cells
- XCVU125-2FFVC1517E: Premium variant with 1.567M logic cells
Software Tools:
- Vivado Design Suite: Integrated development environment
- Vitis Unified Software Platform: Application acceleration framework
- System Generator: Model-based design for DSP applications
- MicroBlaze Processor: Soft processor core running at 200+ DMIPs
Application Areas:
- 5G Wireless Infrastructure: Base station and network equipment
- Data Center Acceleration: Machine learning and AI workloads
- Automotive: Advanced driver assistance systems (ADAS)
- Aerospace & Defense: Radar, communications, and signal processing
- High-Performance Computing: Scientific and research applications
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets RoHS3 directive requirements
- REACH Compliant: Complies with EU REACH regulation
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Environmental Rating: Commercial temperature range (0°C to +100°C TJ)
Export Classifications:
- ECCN: 3A001.a.7.b (Export Administration Regulations)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Trade Integrated Tariff)
- Country of Origin: Varies by manufacturing location
Packaging & Handling:
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Sensitivity: Class 1C (Human Body Model)
- Storage Requirements: -55°C to +150°C storage temperature
- Lead-Free: Compliant with lead-free soldering requirements
Quality Standards:
- ISO 9001: Manufacturing quality management certification
- Automotive: AEC-Q100 qualified versions available
- Reliability: JEDEC standard reliability testing
- Traceability: Full manufacturing traceability maintained
The XCVU080-2FFVC1517E represents the pinnacle of FPGA technology, offering unmatched performance and flexibility for the most demanding applications. With its advanced 20nm UltraScale architecture, high-speed transceivers, and comprehensive software ecosystem, this FPGA enables breakthrough innovations across multiple industries and applications.
