The XCVU080-2FFVB2104E is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing. This advanced FPGA combines cutting-edge 20nm technology with innovative architecture to provide superior processing capabilities and energy efficiency.
Product Specifications
Core Architecture
The XCVU080-2FFVB2104E features a robust architecture built on Xilinx’s UltraScale+ technology platform. This FPGA incorporates 849,600 system logic cells and 1,728 DSP slices, making it ideal for complex signal processing and computational tasks. The device operates at a speed grade of -2, ensuring reliable performance across various operating conditions.
Memory and I/O Configuration
This FPGA includes 45.6 Mb of block RAM and 360 Mb of UltraRAM, providing extensive on-chip memory resources for data-intensive applications. The device supports up to 832 user I/O pins, enabling flexible connectivity options. The XCVU080-2FFVB2104E comes in a flip-chip fine-pitch ball grid array (FFVB) package with 2104 pins, offering high-density interconnections.
Performance Characteristics
The XCVU080-2FFVB2104E delivers exceptional performance with support for high-speed serial transceivers operating at up to 32.75 Gbps. The device features 48 GTY transceivers, enabling high-bandwidth data transmission for demanding applications. Power consumption is optimized through advanced power management features, making it suitable for power-sensitive designs.
Price
The XCVU080-2FFVB2104E is positioned as a premium FPGA solution, with pricing reflecting its advanced capabilities and high-performance specifications. Pricing varies based on order quantity, delivery timeline, and distributor selection. For current pricing information and volume discounts, contact authorized Xilinx distributors or visit official pricing portals. Educational and research institutions may qualify for special pricing programs.
Documents & Media
Technical Documentation
Comprehensive technical documentation for the XCVU080-2FFVB2104E includes detailed datasheets, user guides, and application notes. The official Xilinx datasheet provides complete electrical specifications, timing parameters, and package information. PCB design guidelines and layout recommendations are available to ensure optimal signal integrity and thermal performance.
Development Resources
Xilinx provides extensive development resources including reference designs, IP cores, and software tools. The Vivado Design Suite offers complete design flow support for the XCVU080-2FFVB2104E, from synthesis through implementation and verification. Hardware development kits and evaluation boards are available to accelerate prototyping and development cycles.
Video and Training Materials
Educational videos and training materials cover FPGA design methodologies, optimization techniques, and best practices specific to the Virtex UltraScale+ architecture. Webinars and technical presentations provide insights into advanced features and application-specific implementations.
Related Resources
Compatible IP Cores
The XCVU080-2FFVB2104E supports a wide range of Xilinx IP cores, including high-speed interfaces, DSP functions, and connectivity solutions. Popular IP cores include PCIe Gen4, 100G Ethernet, DDR4 memory controllers, and video processing pipelines. Third-party IP providers also offer specialized solutions compatible with this FPGA.
Development Tools
Essential development tools for the XCVU080-2FFVB2104E include the Vivado Design Suite, System Generator for DSP, and SDK for embedded software development. Hardware debuggers and protocol analyzers support comprehensive system validation and debugging capabilities.
Application Examples
Common applications for the XCVU080-2FFVB2104E include 5G wireless infrastructure, aerospace radar systems, high-frequency trading platforms, and machine learning acceleration. Reference designs and application notes demonstrate implementation approaches for these diverse use cases.
Environmental & Export Classifications
Operating Conditions
The XCVU080-2FFVB2104E operates reliably across commercial and extended temperature ranges, typically from -40°C to +100°C for the junction temperature. The device meets strict environmental standards for humidity, thermal cycling, and mechanical stress, ensuring dependable operation in challenging conditions.
Compliance Standards
This FPGA complies with international quality and environmental standards, including RoHS directives for hazardous substance restrictions. The device undergoes comprehensive reliability testing and quality assurance processes to meet automotive and aerospace qualification requirements where applicable.
Export Control Information
The XCVU080-2FFVB2104E may be subject to export control regulations depending on the destination country and intended application. Users should consult current export control classifications and obtain necessary licenses for international shipments. Xilinx provides export control guidance and documentation to support compliance requirements.
Package and Handling
The FFVB2104 package utilizes lead-free construction and moisture-sensitive level (MSL) ratings appropriate for standard electronic manufacturing processes. Proper handling procedures and storage conditions ensure device integrity throughout the supply chain and manufacturing processes.
The XCVU080-2FFVB2104E represents cutting-edge FPGA technology, delivering the performance and flexibility needed for next-generation electronic systems. Its combination of high logic density, advanced I/O capabilities, and comprehensive development ecosystem makes it an ideal choice for demanding applications requiring maximum performance and reliability.
