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XCVU080-2FFVB1760E: High-Performance Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XCVU080-2FFVB1760E is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device features the innovative UltraScale+ architecture, providing superior power efficiency and processing capabilities.

Key Technical Specifications:

Core Architecture:

  • Device Family: Virtex UltraScale+
  • Logic Cells: 80,000 system logic cells
  • Speed Grade: -2 (standard performance)
  • Package Type: FFVB1760 (Fine-pitch Ball Grid Array)
  • Pin Count: 1760 pins
  • Operating Temperature: Extended commercial range

Memory and Processing:

  • Block RAM: High-density memory blocks for data storage
  • DSP Slices: Dedicated signal processing units
  • Transceivers: High-speed serial connectivity
  • PCIe Support: Integrated PCIe hard blocks
  • DDR4 Memory Interface: Native support for high-bandwidth memory

Power and Performance:

  • Advanced 16nm FinFET+ process technology
  • Optimized power consumption with intelligent clock gating
  • Enhanced signal integrity and thermal management
  • Support for multiple voltage domains

The XCVU080-2FFVB1760E excels in applications requiring high-performance computing, including data center acceleration, 5G infrastructure, aerospace systems, and advanced driver assistance systems (ADAS).

Price

XCVU080-2FFVB1760E pricing varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for quantities over 100 units.

Note: Prices subject to change without notice. Contact suppliers for real-time quotes and lead times.

Documents & Media

Technical Documentation:

  • Datasheet: Complete electrical specifications and pin assignments
  • User Guide: Comprehensive implementation guidelines
  • Package Drawing: Mechanical specifications and thermal characteristics
  • PCN Documents: Product change notifications and updates
  • Application Notes: Design implementation best practices

Development Resources:

  • Vivado Design Suite: Compatible with latest Vivado versions
  • Reference Designs: Proven design examples and IP cores
  • Simulation Models: IBIS and SPICE models for signal integrity analysis
  • Development Boards: Evaluation platforms and starter kits

All documentation is available through the official Xilinx website and authorized distributors.

Related Resources

Compatible Products:

  • Development Tools: Vivado Design Suite, Vitis Unified Software Platform
  • IP Cores: Xilinx LogiCORE IP portfolio
  • Evaluation Boards: VCU108, VCU118 evaluation platforms
  • Programming Solutions: JTAG programmers and configuration devices

Design Support:

  • Alliance Program: Access to third-party IP and services
  • Training Resources: Online courses and certification programs
  • Community Forums: Technical support and design discussions
  • FAE Support: Field Application Engineer assistance

Complementary ICs:

  • Power management solutions optimized for UltraScale+ FPGAs
  • Clock generation and distribution devices
  • Memory interfaces and controllers
  • High-speed connector solutions

Environmental & Export Classifications

Environmental Compliance:

  • RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
  • REACH Compliant: Complies with EU chemical regulation requirements
  • Halogen-Free: Environmentally friendly package materials
  • Lead-Free: Pb-free solder ball attachment

Operating Conditions:

  • Temperature Range: Commercial (0°C to +85°C junction temperature)
  • Humidity: Standard commercial humidity specifications
  • Altitude: Suitable for standard commercial applications
  • Shock and Vibration: Meets JEDEC standards for handling and transport

Export Classifications:

  • ECCN: Export Control Classification Number as per US Commerce Department
  • HTS Code: Harmonized Tariff Schedule classification
  • Country of Origin: Manufacturing location information
  • Export Restrictions: Compliance with international trade regulations

Quality Standards:

  • ISO 9001: Quality management system certification
  • Automotive: AEC-Q100 qualified versions available
  • Military: MIL-STD compliant variants for defense applications
  • Medical: IEC 62304 compatible for medical device integration

The XCVU080-2FFVB1760E represents the pinnacle of FPGA technology, combining high performance, power efficiency, and comprehensive development support for next-generation applications across multiple industries.