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XCVU080-1FFVC1517I – AMD Xilinx Virtex UltraScale FPGA

Original price was: $20.00.Current price is: $19.00.

The XCVU080-1FFVC1517I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This advanced programmable logic device delivers exceptional performance and integration capabilities at 20nm technology, making it an ideal choice for demanding applications requiring superior processing power and flexibility.

Product Specifications

Core Architecture

  • Product Family: Virtex UltraScale FPGA
  • Part Number: XCVU080-1FFVC1517I
  • Manufacturer: AMD (formerly Xilinx)
  • Logic Cells: Approximately 780,000 cells
  • Technology Node: 20nm process technology
  • Operating Voltage: 0.95V core voltage
  • Speed Grade: -1 (Industrial grade)

Package Details

  • Package Type: FCBGA (Flip Chip Ball Grid Array)
  • Pin Count: 1517 pins
  • Package Code: FFVC1517
  • Temperature Grade: Industrial (-40°C to +100°C)
  • Package Size: Advanced flip-chip ball grid array for optimal thermal and electrical performance

Key Features

  • UltraScale Architecture: Next-generation FPGA architecture optimizing power efficiency and performance
  • High Logic Density: 780,000 logic cells for complex design implementation
  • Advanced I/O Capabilities: Multiple I/O standards support for versatile connectivity
  • DSP Resources: Integrated DSP blocks for signal processing applications
  • Block RAM: On-chip memory resources for data storage and buffering
  • Clock Management: Advanced clocking resources with low jitter PLLs

Performance Characteristics

  • Maximum Operating Frequency: Up to 600+ MHz depending on design complexity
  • Power Efficiency: Optimized for low power consumption with dynamic power management
  • Transceiver Support: High-speed serial transceivers for data communication
  • Memory Interface: Support for DDR3/DDR4 memory interfaces

Price Information

The XCVU080-1FFVC1517I pricing varies based on quantity, supplier, and market conditions. Current market pricing typically ranges from $2,000 to $4,000 per unit for low-volume purchases, with significant discounts available for bulk orders.

Pricing Factors

  • Quantity: Volume discounts available for orders over 100 units
  • Lead Time: Standard lead times range from 12-16 weeks
  • Market Conditions: Semiconductor pricing subject to supply chain fluctuations
  • Authorized Distributors: Best pricing through official AMD distribution channels

Where to Buy

  • DigiKey Electronics: Authorized distributor with immediate availability
  • Mouser Electronics: Comprehensive inventory and competitive pricing
  • AMD Direct: Official manufacturer sales channel
  • Regional Distributors: Local authorized partners worldwide

Documents & Media

Official Documentation

  • Product Datasheet: DS890 – UltraScale FPGAs Datasheet
  • User Guide: UG575 – UltraScale and UltraScale+ Package and Pinout Guide
  • Selection Guide: UltraScale FPGA Product Selection Guide
  • Package Specifications: Complete mechanical drawings and specifications

Design Resources

  • Reference Designs: Application-specific reference implementations
  • IP Cores: Pre-verified intellectual property blocks
  • Development Boards: VCU110 Development Kit for evaluation
  • Software Tools: Vivado Design Suite for development

Technical Documentation

  • Migration Guides: Transition from previous FPGA families
  • Power Estimation: Tools and guidelines for power analysis
  • Thermal Management: Guidelines for thermal design considerations
  • Signal Integrity: High-speed design recommendations

Related Resources

Development Tools

  • Vivado Design Suite: Complete FPGA design environment
  • SDK (Software Development Kit): Embedded software development
  • IP Integrator: Graphical IP integration tool
  • Vivado HLS: High-Level Synthesis for C/C++ to HDL conversion

Evaluation Platforms

  • VCU110 Development Kit: Full-featured evaluation platform
  • Custom Carrier Boards: Third-party development solutions
  • FMC Modules: FPGA Mezzanine Card expansion options

Support Resources

  • AMD Community Forums: Technical discussion and support
  • Application Notes: Detailed implementation guides
  • Training Materials: Online courses and certification programs
  • Technical Support: Direct access to AMD engineering support

Compatible Products

  • XCVU095-1FFVC1517: Higher logic density variant
  • XCVU065-1FFVC1517: Lower cost alternative
  • XCVU080-2FFVC1517: Higher speed grade version
  • UltraScale+ Family: Next-generation upgrade path

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets European restriction of hazardous substances directive
  • REACH Compliance: Registered under EU chemical regulation
  • Conflict Minerals: Conflict-free sourcing certified
  • ISO 14001: Environmental management system certified manufacturing

Operating Conditions

  • Operating Temperature: -40°C to +100°C (Industrial grade)
  • Storage Temperature: -65°C to +150°C
  • Humidity: 10% to 90% non-condensing
  • Altitude: Up to 3000 meters operational

Export Classifications

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.39.0001
  • Country of Origin: Various (check specific lot)
  • Export Restrictions: Subject to U.S. export administration regulations

Quality Standards

  • ISO 9001: Quality management system certified
  • IPC Standards: Manufacturing to IPC-A-610 standards
  • Automotive Grade: AEC-Q100 qualified versions available
  • Military Standards: MIL-STD-883 testing available

Packaging & Shipping

  • ESD Protection: Electrostatic discharge protective packaging
  • Moisture Sensitivity: MSL 3 (168 hours at 30°C/60% RH)
  • Lead Time: Standard 12-16 weeks ARO (After Receipt of Order)
  • Minimum Order Quantity: Typically 1 piece for sampling

The XCVU080-1FFVC1517I represents a powerful solution for applications requiring high-performance programmable logic, combining AMD Xilinx’s proven UltraScale architecture with advanced 20nm technology for optimal performance, power efficiency, and design flexibility.