Overview
The XCVU080-1FFVB1760I is a premium FPGA (Field Programmable Gate Array) from AMD Xilinx’s Virtex UltraScale family, engineered for high-performance computing applications. This advanced programmable logic device delivers exceptional processing power, energy efficiency, and integration capabilities in a robust 1760-pin FCBGA package.
1. Product Specifications
Core Specifications
- Part Number: XCVU080-1FFVB1760I
- Manufacturer: AMD Xilinx
- Product Family: Virtex UltraScale FPGAs
- Logic Cells: 780,000 cells
- Technology Node: 20nm manufacturing process
- Operating Voltage: 0.95V
- Speed Grade: -1 (industrial grade)
Package Details
- Package Type: FCBGA (Flip-Chip Ball Grid Array)
- Pin Count: 1760 pins
- Package Code: FFVB1760
- Package Technology: Flip-chip, fine-pitch BGA
- Temperature Grade: I (Industrial: -40°C to +100°C)
Architecture Features
- UltraScale Architecture: Next-generation programmable logic architecture
- High-Speed Transceivers: Advanced serial I/O capabilities
- Block RAM: Integrated memory blocks for data storage
- DSP Slices: Dedicated signal processing blocks
- I/O Banks: Multiple configurable I/O banks
- PCIe Support: Built-in PCIe connectivity options
Performance Characteristics
- Maximum System Performance: High-speed data processing
- Power Efficiency: Optimized for low power consumption
- Integration Level: High logic density
- Memory Bandwidth: Enhanced memory interface capabilities
- Serial I/O Bandwidth: High-speed serial communication
2. Price Information
Pricing Details
- Price Range: Contact authorized distributors for current pricing
- Market Position: Premium enterprise-grade FPGA
- Volume Discounts: Available for bulk orders
- Lead Time: Contact suppliers for current availability
- MOQ: Typically 1 piece minimum order quantity
Cost Considerations
- Professional-grade component with premium pricing
- Long-term availability guarantee
- Comprehensive technical support included
- Development tools and software licenses may be required
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: UG575 – UltraScale FPGAs Package and Pinout Guide
- Reference Manual: Comprehensive architecture documentation
- Application Notes: Design implementation guidelines
- Errata: Known issues and workarounds
Design Resources
- Pinout Files: Available in CSV and TXT formats
- Package Drawings: Mechanical specifications and dimensions
- Footprint Files: PCB layout guidelines
- 3D Models: CAD models for mechanical design
- Thermal Models: Heat dissipation analysis tools
Software Tools
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified intellectual property blocks
- Simulation Tools: ModelSim, Questa integration
- Debug Tools: ChipScope Pro, ILA (Integrated Logic Analyzer)
4. Related Resources
Development Platforms
- Xilinx development boards compatible with XCVU080
- Evaluation kits for rapid prototyping
- Reference designs and demo applications
- Third-party development platforms
Technical Support
- Community Forums: Xilinx developer community
- Knowledge Base: Comprehensive technical articles
- Application Support: Direct engineering assistance
- Training Resources: Online courses and tutorials
- Webinars: Regular technical presentations
Compatible Products
- XCVU095-1FFVB1760I: Higher-capacity variant
- XCVU080-2FFVB1760I: Higher speed grade version
- Development Boards: ZedBoard, Basys 3, Nexys4-DDR
- Programming Tools: Platform Cable USB, JTAG programmers
Application Areas
- High-performance computing (HPC)
- Data center acceleration
- Machine learning inference
- 5G wireless infrastructure
- Video processing and transcoding
- Network packet processing
- Aerospace and defense systems
- Medical imaging equipment
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliant: Complies with EU chemical regulations
- Conflict Minerals: Conflict-free sourcing certified
- Halogen-Free: Lead-free and halogen-free materials
- Green Initiative: Environmental sustainability program participant
Quality Standards
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management certified
- IATF 16949: Automotive quality standard (where applicable)
- AS9100: Aerospace quality standard compliance
Export Classifications
- ECCN: Export Control Classification Number available
- HS Code: Harmonized System classification
- Country of Origin: Manufacturing location documentation
- Export Restrictions: Subject to US export control regulations
- ITAR: International Traffic in Arms Regulations compliance
Reliability Standards
- Operating Temperature: -40°C to +100°C (Industrial grade)
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Shock and Vibration: MIL-STD-883 compliant
- MTBF: Mean Time Between Failures data available
Packaging & Handling
- ESD Sensitive: Requires anti-static handling procedures
- Moisture Sensitivity: Level 3 (MSL3) classification
- Lead-Free: Compatible with lead-free soldering processes
- Packaging: Anti-static tray or tape and reel options
- Storage: Controlled environment storage recommended
Key Benefits
The XCVU080-1FFVB1760I offers exceptional value for demanding applications requiring high-performance programmable logic. With its advanced UltraScale architecture, this FPGA delivers the processing power, flexibility, and efficiency needed for next-generation digital systems while maintaining the reliability and support expected from AMD Xilinx products.
Perfect for: Data centers, telecommunications infrastructure, industrial automation, and high-performance computing applications where programmable acceleration and real-time processing are critical requirements.
