The XCVU065-3FFVC1517E is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex UltraScale family. This advanced semiconductor device delivers exceptional processing capabilities and flexible programmability for demanding applications across telecommunications, aerospace, defense, and high-performance computing markets.
Product Specifications
Core Architecture
- Family: Virtex UltraScale FPGA
- Manufacturer: Xilinx (now AMD)
- Logic Cells: 626,640 cells
- Technology Node: 20nm process technology
- Package Type: 1517-Pin FCBGA (Flip Chip Ball Grid Array)
- Operating Voltage: 1V core voltage
- Speed Grade: -3 (high-performance grade)
Memory and Processing Features
- Block RAM: Integrated high-speed block RAM for data buffering
- UltraRAM: On-chip UltraRAM memory for reduced BOM costs
- DSP Slices: High DSP-to-logic ratios for signal processing applications
- I/O Count: 520 user I/O pins
- Package Code: FFVC1517E
Advanced Technologies
- SSI Technology: Stacked Silicon Interconnect (SSI) technology for enhanced integration
- Transceivers: Next-generation high-speed transceivers
- Power Optimization: Multiple power options balancing performance and power consumption
- Serial I/O: Optimized serial I/O bandwidth and logic capacity
Key Performance Benefits
The XCVU065-3FFVC1517E combines monolithic and next-generation stacked silicon interconnect technology to deliver superior price-performance ratios. The device features high DSP and block RAM-to-logic ratios paired with next-generation transceivers and cost-effective packaging.
Price Information
The XCVU065-3FFVC1517E is available through authorized distributors and electronics suppliers worldwide. Pricing varies based on:
- Quantity Ordered: Volume discounts available for bulk purchases
- Distribution Channel: Authorized distributors offer competitive pricing
- Market Conditions: Real-time pricing subject to market fluctuations
- Geographic Region: Regional pricing variations may apply
For current pricing and availability, contact authorized Xilinx distributors or submit a request for quotation (RFQ) through electronic component suppliers. Many distributors offer real-time inventory tracking and competitive bulk pricing options.
Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation and design guidelines
- Product Brief: Quick reference specifications and features overview
- Application Notes: Implementation examples and best practices
- Errata Documents: Known issues and workarounds
Design Resources
- Pinout Information: Complete pin assignment and configuration details
- Package Drawings: Mechanical drawings and land pattern recommendations
- Thermal Guidelines: Thermal management and heat dissipation recommendations
- Power Estimation Tools: Power consumption calculation utilities
Development Tools
- Vivado Design Suite: Primary development environment for Xilinx FPGAs
- IP Catalog: Pre-verified intellectual property cores
- Example Designs: Reference implementations and starter projects
- Board Design Files: Reference board layouts and schematics
Related Resources
Compatible Development Boards
- Evaluation Boards: Official Xilinx evaluation platforms
- Third-party Boards: ZedBoard, Nexys4-DDR, and other compatible platforms
- Custom Boards: Design guidelines for custom board development
Software and Tools
- Vivado Design Suite: Complete FPGA design flow from synthesis to implementation
- Vivado HLS: High-Level Synthesis for C/C++ to RTL conversion
- SDSoC: Software-defined development environment
- PetaLinux: Embedded Linux development tools
Technical Support
- Community Forums: FPGA development community discussions
- Application Engineers: Technical support and design consultation
- Training Resources: Online courses and certification programs
- Documentation Portal: Comprehensive technical documentation library
Replacement and Alternatives
- Pin-Compatible Variants: Other speed grades and temperature ranges
- Family Alternatives: Related Virtex UltraScale devices
- Upgrade Paths: Migration guidelines to newer FPGA families
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Meets EU Restriction of Hazardous Substances directive
- Lead-Free: Compatible with lead-free assembly processes
- Halogen-Free: Environmentally friendly packaging materials
- REACH Compliance: Compliant with EU chemical regulation standards
Operating Conditions
- Temperature Range: Commercial temperature grade operation
- Humidity Tolerance: Standard commercial humidity specifications
- Thermal Management: Advanced thermal design considerations required
- Power Supply: Multiple voltage domains with specific sequencing requirements
Export Control Classifications
- ECCN Code: 3A001.a.7.b (Export Control Classification Number)
- Export Restrictions: Subject to U.S. export administration regulations
- USHTS Code: 8542390001 (U.S. Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (EU customs classification)
Quality and Reliability
- Qualification Standards: Automotive and industrial quality standards
- Reliability Testing: Comprehensive qualification and stress testing
- Quality Certifications: ISO 9001 manufacturing quality systems
- Traceability: Full component traceability for critical applications
Applications and Markets
The XCVU065-3FFVC1517E excels in applications requiring high-performance processing, including:
- 400G Networking: High-speed network infrastructure equipment
- ASIC Prototyping: Large-scale ASIC prototyping and emulation
- Signal Processing: Advanced digital signal processing applications
- Aerospace & Defense: Mission-critical systems requiring high reliability
- High-Performance Computing: Acceleration of compute-intensive algorithms
This advanced FPGA provides the ideal combination of performance, flexibility, and cost-effectiveness for next-generation electronic systems requiring programmable logic solutions.
