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XCVU065-2FFVC1517I: High-Performance Virtex UltraScale+ FPGA for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

The XCVU065-2FFVC1517I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing.

Product Specification

The XCVU065-2FFVC1517I features advanced 20nm process technology, offering superior power efficiency and performance optimization. This industrial-grade FPGA includes 504,000 logic cells and 1,728 DSP slices, providing extensive processing capabilities for complex algorithms and signal processing tasks.

Key Technical Features:

  • Logic Cells: 504,000 system logic cells
  • DSP Slices: 1,728 DSP48E2 slices
  • Block RAM: 38.4 Mb total block RAM
  • UltraRAM: 22.5 Mb UltraRAM capacity
  • Package: FFVC1517 (1517-ball flip chip BGA)
  • Speed Grade: -2 (high performance)
  • Temperature Range: Industrial (-40ยฐC to +100ยฐC)
  • I/O Pins: 832 user I/O pins
  • Transceivers: 16 GTH transceivers supporting up to 16.3 Gbps

The XCVU065-2FFVC1517I incorporates Xilinx’s innovative UltraScale+ architecture, featuring hardened IP blocks including PCIe Gen4, 100G Ethernet MAC, and advanced memory controllers for DDR4 and HBM2 interfaces.

Price

Pricing for the XCVU065-2FFVC1517I varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Enterprise customers may qualify for volume discounts and custom pricing arrangements.

Pricing Considerations:

  • Unit price varies by order quantity
  • Lead times may affect pricing
  • Available through authorized distributors
  • OEM pricing available for high-volume applications

Documents & Media

Technical Documentation:

  • Product Data Sheet (DS890)
  • UltraScale+ FPGA User Guide
  • Package and Pinout Specifications
  • Power and Thermal Design Guidelines
  • PCB Design Guidelines for FFVC1517 package

Development Resources:

  • Vivado Design Suite compatibility information
  • Reference designs and application notes
  • Evaluation boards and development kits
  • IP core documentation and licensing

Media Resources:

  • Product photos and package diagrams
  • Block diagrams and architecture overviews
  • Performance benchmarks and case studies
  • Video tutorials and webinar recordings

Related Resources

Development Tools:

  • Vivado Design Suite (recommended version 2019.1 or later)
  • Vitis Unified Software Platform
  • System Generator for DSP
  • High-Level Synthesis (HLS) tools

Evaluation Platforms:

  • VCU118 Evaluation Kit (compatible architecture)
  • Custom evaluation boards for XCVU065-2FFVC1517I
  • Partner ecosystem development boards

IP Cores and Libraries:

  • Xilinx LogiCORE IP portfolio
  • DSP and communications IP
  • Video and imaging processing IP
  • Connectivity and interface IP

Support Resources:

  • Xilinx Community Forums
  • Technical support portal
  • Application engineering support
  • Training and certification programs

Environmental & Export Classifications

Environmental Compliance:

  • RoHS compliant (lead-free)
  • REACH regulation compliant
  • Conflict minerals reporting template available
  • ISO 14001 environmental management certification

Export Classifications:

  • Export Control Classification Number (ECCN): 3A001.a.7
  • Harmonized Tariff Schedule (HTS): 8542.31.0001
  • Country of Origin: Various (check specific lot)
  • Export licensing requirements may apply

Quality Standards:

  • Automotive Quality Grade (AEC-Q100 qualified variants available)
  • Military and aerospace screening options
  • Commercial temperature range: 0ยฐC to +85ยฐC
  • Industrial temperature range: -40ยฐC to +100ยฐC

Reliability Data:

  • MTBF calculations available
  • Qualification test reports
  • Reliability prediction models
  • Accelerated life testing data

The XCVU065-2FFVC1517I represents the pinnacle of FPGA technology, combining high performance, extensive connectivity, and robust reliability for mission-critical applications. Its advanced architecture and comprehensive development ecosystem make it an ideal choice for next-generation designs requiring maximum flexibility and performance.