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XCVU065-1FFVC1517I: High-Performance Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XCVU065-1FFVC1517I is a cutting-edge FPGA (Field-Programmable Gate Array) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device combines high-speed processing capabilities with flexible configuration options, making it ideal for data center acceleration, wireless infrastructure, and high-performance computing applications.

Key Technical Specifications:

  • Device Family: Virtex UltraScale+
  • Logic Cells: 692,000 system logic cells
  • Package Type: FFVC1517 (Fine-Pitch BGA)
  • Speed Grade: -1 (standard performance)
  • Temperature Grade: Industrial (-40°C to +100°C)
  • I/O Count: Up to 832 user I/Os
  • Memory: 41.6 Mb block RAM, 6.6 Mb UltraRAM
  • DSP Slices: 2,280 DSP48E2 slices
  • Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps

The XCVU065-1FFVC1517I features advanced 20nm FinFET+ technology, providing superior power efficiency and performance compared to previous generations. Its heterogeneous architecture includes programmable logic, memory, and DSP resources optimized for parallel processing and high-throughput applications.

Price

Pricing for the XCVU065-1FFVC1517I varies based on quantity, distribution channel, and current market conditions. As a high-end FPGA solution, this device typically falls within the premium pricing tier reflecting its advanced capabilities and target applications.

For current pricing information and volume discounts, contact authorized Xilinx distributors or visit the official Xilinx website. Educational institutions and qualifying organizations may be eligible for special pricing programs. Lead times can vary depending on demand and production schedules.

Documents & Media

Technical Documentation:

  • Product Data Sheet: Comprehensive specifications and electrical characteristics
  • User Guide: Detailed implementation guidelines and best practices
  • Package and Pinout Information: Complete pin assignment and mechanical drawings
  • Power Estimation Tools: Xilinx Power Estimator (XPE) support files
  • Migration Guide: Transition information from previous FPGA generations

Design Resources:

  • Reference Designs: Pre-validated IP cores and example implementations
  • Application Notes: Specific use case guidance and optimization techniques
  • Vivado Design Suite: Full development environment support
  • IP Catalog: Extensive library of pre-verified intellectual property blocks

Media Resources:

  • Product Videos: Architecture overviews and application demonstrations
  • Webinar Series: Technical deep-dives and design methodology sessions
  • White Papers: Advanced topics and competitive analysis

Related Resources

Development Tools:

  • Vivado Design Suite: Primary development environment for the XCVU065-1FFVC1517I
  • Vitis Unified Software Platform: High-level synthesis and application development
  • ChipScope Pro: Advanced debugging and verification tools
  • System Generator: MATLAB/Simulink integration for DSP applications

Evaluation Platforms:

  • VCU065 Evaluation Board: Complete development platform featuring the XCVU065-1FFVC1517I
  • Starter Kits: Entry-level development options for initial prototyping
  • Third-Party Boards: Partner solutions for specific application domains

Support Resources:

  • Xilinx Forums: Community-driven technical support and discussions
  • Answer Database: Searchable repository of solutions and workarounds
  • Training Courses: Professional development and certification programs
  • Field Application Engineers: Direct technical support for complex implementations

Compatible IP and Solutions:

  • Video Processing: H.264/H.265 codecs, image processing pipelines
  • Networking: Ethernet MAC/PHY, TCP/IP offload engines
  • Signal Processing: FFT cores, digital filters, beamforming solutions
  • Security: Encryption/decryption engines, secure boot implementations

Environmental & Export Classifications

Environmental Compliance:

The XCVU065-1FFVC1517I meets stringent environmental standards and regulations:

  • RoHS Compliance: Fully compliant with EU Restriction of Hazardous Substances directive
  • REACH Regulation: Conforms to European chemical safety requirements
  • Conflict Minerals: Responsibly sourced materials certification
  • Halogen-Free: Environmentally friendly package materials
  • MSL Rating: Moisture Sensitivity Level 3 for proper handling and storage

Operating Conditions:

  • Temperature Range: -40°C to +100°C junction temperature (Industrial grade)
  • Voltage Requirements: Multiple supply voltages (VCCINT, VCCAUX, VCCO)
  • Power Consumption: Optimized for low-power operation with dynamic power management
  • Thermal Management: Advanced thermal design considerations for high-performance applications

Export Classifications:

  • ECCN: Export Control Classification Number as per US Department of Commerce
  • Export Restrictions: Subject to applicable export control regulations
  • Country-Specific Requirements: Compliance with destination country import regulations
  • End-Use Restrictions: Certain applications may require export licenses

Quality and Reliability:

  • Automotive Qualification: AEC-Q100 qualified variants available
  • Industrial Standards: Compliant with relevant industrial quality standards
  • Reliability Testing: Extensive qualification testing including thermal cycling, vibration, and accelerated aging
  • Traceability: Full manufacturing traceability for quality assurance

The XCVU065-1FFVC1517I represents the pinnacle of FPGA technology, offering developers the tools and performance needed for next-generation applications while maintaining compliance with global environmental and export requirements.