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XCV812E-FG900AFS – High-Performance Virtex-EM Extended Memory FPGA

Original price was: $20.00.Current price is: $19.00.

Product Overview

The XCV812E-FG900AFS is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-EM (Extended Memory) family. This advanced 1.8V FPGA delivers exceptional performance for high-bandwidth applications, making it the ideal choice for network infrastructure, telecommunications, and demanding digital signal processing applications.

1. Product Specifications

Core Architecture

  • Family: Virtex-E Extended Memory (Virtex-EM) 1.8V FPGAs
  • Manufacturer: AMD Xilinx
  • Technology Node: 0.18μm CMOS with 6-layer metal copper interconnect
  • Operating Voltage: 1.8V core, 1.71V to 1.89V supply range
  • Package Type: 900-pin Fine-pitch Ball Grid Array (FBGA)
  • Package Code: FG900AFS

Logic Resources

  • Logic Cells: 21,168 equivalent logic cells
  • System Gates: 254,016 gates
  • Configurable Logic Blocks (CLBs): 4,704 CLBs
  • Look-Up Tables (LUTs): 4-input LUT architecture
  • Flip-Flops: Abundant dedicated flip-flops per CLB

Memory Capabilities

  • Block RAM: 1,146,880 RAM bits (140kB total)
  • Extended Memory: Enhanced block RAM capacity vs. standard Virtex-E
  • Memory Configuration: Flexible dual-port block RAM
  • Memory Bandwidth: Optimized for high-bandwidth applications up to 160 Gb/s

Performance Characteristics

  • Maximum Frequency: Up to 357MHz internal clock performance
  • I/O Standards: Multiple voltage standards supported
  • Total I/O Pins: 556 user I/O pins
  • Pin Count: 900 total pins in FG900 package

Physical Specifications

  • Operating Temperature Range: 0°C to +85°C (Commercial grade)
  • Package Dimensions: Compatible with industry-standard FBGA footprint
  • Mounting Type: Surface Mount Technology (SMT)

2. Pricing Information

Market Positioning

The XCV812E-FG900AFS represents premium-tier pricing within the Virtex-EM family, reflecting its high-performance capabilities and extended memory resources.

Pricing Factors

  • Volume Pricing: Available for high-volume applications
  • Distribution Channels: Authorized distributors worldwide
  • Lead Times: Subject to current market conditions
  • Custom Pricing: Contact authorized distributors for project-specific quotes

Note: Pricing varies by quantity, distribution channel, and market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability.

3. Documents & Media

Technical Documentation

  • Official Datasheet: Virtex-EM 1.8V FPGA Family Datasheet
  • User Guide: Complete configuration and implementation guide
  • PCB Footprint Files: CAD library files for PCB design
  • Pin-out Documentation: Comprehensive pin assignment files
  • Application Notes: Implementation best practices and design guidelines

Design Resources

  • Development Tools: Xilinx Vivado Design Suite compatibility
  • Reference Designs: Network switching and high-bandwidth applications
  • Simulation Models: VHDL/Verilog simulation libraries
  • Timing Models: Detailed timing analysis files

Media Resources

  • Product Images: High-resolution package photos
  • Block Diagrams: Internal architecture illustrations
  • Performance Charts: Benchmark data and comparison tables

4. Related Resources

Development Tools

  • Xilinx Vivado Design Suite: Primary development environment
  • Legacy ISE Support: Compatible with ISE design tools
  • ModelSim Integration: Simulation environment support
  • ChipScope Pro: Built-in logic analyzer capability

Evaluation Platforms

  • Development Boards: Third-party evaluation platforms available
  • Reference Designs: Network switch and video processing examples
  • IP Cores: Extensive library of verified IP cores
  • Support Community: Active developer community and forums

Compatible Products

  • XCV405E Series: Lower-density alternatives
  • Virtex-E Family: Standard memory variants
  • Configuration Devices: Compatible PROM and configuration solutions
  • Power Management: Recommended power supply solutions

Technical Support

  • Design Services: Professional design and consulting services
  • Training Programs: FPGA design methodology courses
  • Application Engineering: Direct technical support access
  • Documentation Portal: Comprehensive online resource library

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Lead-free and RoHS compliant manufacturing
  • REACH Compliance: Compliant with EU REACH regulations
  • Conflict Minerals: Conflict-free sourcing certification
  • Environmental Rating: Green product classification

Quality Standards

  • ISO Certification: Manufactured under ISO 9001 quality systems
  • Automotive Grade: Selected variants available for automotive applications
  • Military Standards: MIL-STD qualified versions available
  • Reliability: High-reliability screening options available

Export Classifications

  • ECCN Rating: Export Control Classification Number compliance
  • Country of Origin: Manufacturing location documentation
  • Export Licensing: Required export licenses and restrictions
  • International Standards: Compliance with international trade regulations

Packaging & Handling

  • ESD Protection: Anti-static packaging and handling requirements
  • Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating
  • Storage Requirements: Temperature and humidity specifications
  • Shelf Life: Component storage and handling guidelines

Applications

The XCV812E-FG900AFS excels in demanding applications requiring high-performance programmable logic:

  • Network Infrastructure: 160 Gb/s network switches and routers
  • Telecommunications: High-speed data processing and protocol handling
  • Video Processing: High-definition video and graphics systems
  • Digital Signal Processing: Real-time signal processing applications
  • Industrial Automation: High-speed control and monitoring systems

Why Choose XCV812E-FG900AFS?

Extended Memory Architecture: Superior memory bandwidth for data-intensive applications
Proven Technology: Built on mature 0.18μm process with copper interconnect
Design Flexibility: Reconfigurable architecture adapts to changing requirements
Fast Time-to-Market: No NRE costs or silicon development cycles
Comprehensive Support: Extensive documentation and development tools
Industry Legacy: Part of the successful Virtex-E family heritage

Contact authorized distributors today for pricing, availability, and technical support for your XCV812E-FG900AFS implementation.