The XCV812E-FG900 is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E series, designed to deliver exceptional performance and flexibility for advanced digital design applications. This high-capacity programmable logic device offers outstanding processing capabilities in a compact 900-pin Fine-pitch Ball Grid Array (FBGA) package.
1. Product Specifications
Technical Specifications
- Manufacturer: Xilinx Inc. (now AMD)
- Product Family: Virtex-E EM Series
- Package Type: 900-FBGA (Fine-pitch Ball Grid Array)
- Package Size: 1mm pitch spacing
- Pin Count: 900 pins
- Technology: 0.18μm CMOS process with 6-layer metal
- Supply Voltage: 1.8V (1.71V – 1.89V operating range)
Logic Resources
- Logic Elements/Cells: 21,168 fundamental building blocks
- Configurable Logic Blocks (CLBs): 4,704 LABs/CLBs
- System Gates: 254,016 gates
- RAM Memory: 140kB embedded RAM
- RAM Bits: 1,146,880 total RAM bits
- I/O Pins: 556 user I/O ports
Performance Characteristics
- Maximum Operating Frequency: 357MHz crystal oscillation
- Operating Temperature Range: 0°C to +85°C (TJ)
- Mounting Type: Surface Mount Technology (SMT)
- Life Cycle Status: Mature product (some variants obsolete)
Package & Environmental Features
- RoHS Compliance: Yes (Lead-free/RoHS compliant)
- Environmental Rating: Green compliant
- ESD Protection: Anti-static packaging included
- Package Description: PLASTIC, FBGA-900
2. Price Information
The XCV812E-FG900 pricing varies based on quantity, speed grade, and supplier. Contact authorized distributors for current pricing:
- Small Quantities: Request quote for prototype quantities
- Production Volumes: Volume discounts available
- Lead Time: Typically 2-4 weeks for standard orders
- Minimum Order Quantity (MOQ): Varies by distributor
Price Factors:
- Speed grade (-6, -7, -8 variants available)
- Temperature grade (Commercial vs Industrial)
- Package type and quantity
- Current market availability
Note: As this is a mature product with some variants marked obsolete, pricing may fluctuate based on remaining inventory.
3. Documents & Media
Available Documentation
- Official Datasheet: XCV812E-FG900 technical specifications PDF
- PCB Footprint Files: EDA/CAD compatible footprint libraries
- Symbol Libraries: Schematic symbol files for major EDA tools
- Package Specifications: Detailed mechanical drawings
- Application Notes: Design implementation guidelines
Design Resources
- Xilinx Vivado Design Suite: Complete development environment
- ISE Design Suite: Legacy development tools (for older projects)
- Reference Designs: Example implementations and tutorials
- Pin Mapping: Complete pinout documentation
- Timing Analysis: Speed grade characterization data
Media Files
- Product Images: High-resolution package photos
- Block Diagrams: Internal architecture illustrations
- Performance Charts: Speed and power consumption graphs
4. Related Resources
Compatible Development Boards
- Virtex-E Evaluation Boards: XCMECH-FG900 mechanical samples
- Custom PCB Solutions: Professional layout services available
- Prototyping Platforms: Third-party development systems
Software Tools
- Xilinx Vivado: Primary development environment
- Vivado HLS: High-Level Synthesis tools
- SDK/Vitis: Embedded software development
- ChipScope Pro: Hardware debugging tools
Training & Support
- Technical Documentation: Comprehensive user guides
- Community Forums: Xilinx developer community
- Application Engineering: Professional design support
- Training Courses: FPGA design methodology training
Companion Products
- Configuration Memory: Flash and PROM devices
- Clock Management: Phase-locked loops and clock buffers
- Power Solutions: Dedicated FPGA power supplies
- Interface Components: Level shifters and transceivers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant (Lead-free)
- REACH Regulation: Not compliant (legacy product)
- Green Classification: Environmentally friendly
- Halogen-Free: Package materials meet halogen-free standards
- MSL Rating: Moisture Sensitivity Level classification available
Export Control Information
- ECCN (Export Control Classification Number): Contact manufacturer
- Country of Origin: Various manufacturing locations
- HS Code/HTSUS: 8479899599 (Programmable logic devices)
- CCATS: Commodity Classification Automated Tracking System data
Quality & Reliability
- Operating Life: Industrial-grade reliability standards
- MTBF Rating: Mean Time Between Failures data available
- Quality Standards: ISO 9001 certified manufacturing
- Reliability Testing: Military-standard qualification procedures
Packaging & Shipping
- Anti-Static Protection: ESD-safe packaging required
- Thermal Protection: Temperature-controlled shipping recommended
- Moisture Protection: Dry pack shipping for humidity-sensitive components
- Traceability: Full lot tracking and documentation
Applications
The XCV812E-FG900 excels in demanding applications including:
- Communications Equipment: Wireless infrastructure and broadband systems
- Industrial Automation: Motor drives and control systems
- Automotive Electronics: Advanced infotainment and cluster systems
- Enterprise Systems: High-performance computing and networking
- Personal Electronics: Tablets and connected devices
- Test & Measurement: High-speed signal processing equipment
Conclusion
The XCV812E-FG900 represents proven FPGA technology with robust performance characteristics suitable for both legacy system maintenance and new design projects requiring mature, well-characterized programmable logic solutions. With comprehensive documentation, development tool support, and broad distributor availability, this Virtex-E series device continues to serve critical applications across multiple industries.
For current availability, detailed specifications, and volume pricing on the XCV812E-FG900, contact authorized Xilinx/AMD distributors or electronic component suppliers.
