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XCV812E-8FGG900I – Xilinx Virtex-EM 1.8V Field Programmable Gate Array (FPGA)

Original price was: $20.00.Current price is: $19.00.

Overview

The XCV812E-8FGG900I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E Extended Memory (Virtex-EM) family. This advanced programmable logic device delivers exceptional performance with 254,016 system gates and 21,168 logic cells, making it ideal for demanding applications requiring high-speed processing and extensive memory bandwidth.

Built using cutting-edge 0.18ฮผm CMOS technology with an aggressive 6-layer metal process, the XCV812E-8FGG900I offers superior silicon efficiency and optimized place-and-route performance. This FPGA is specifically designed for applications requiring high memory bandwidth, such as network switches, video processing systems, and advanced computing applications.


1. Product Specifications

Core Architecture

  • Device Family: Xilinx Virtex-E Extended Memory (Virtex-EM)
  • Part Number: XCV812E-8FGG900I
  • System Gates: 254,016 gates
  • Logic Elements/Cells: 21,168 cells
  • CLB Array Configuration: 56 x 84
  • Number of LABs/CLBs: 4,704

Memory Specifications

  • Total RAM Bits: 1,146,880 bits
  • Block RAM: Extensive embedded memory for high-bandwidth applications
  • Distributed RAM Bits: 301,056 bits

Performance Characteristics

  • Maximum Clock Frequency: 416 MHz
  • Speed Grade: -8 (high-performance grade)
  • Operating Temperature Range: 0ยฐC to +85ยฐC (TJ)
  • Supply Voltage: 1.8V (1.71V ~ 1.89V)

Package Information

  • Package Type: 900-pin Fine Pitch Ball Grid Array (FBGA)
  • Package Designation: FGG900
  • Package Size: 900-pin FBGA
  • Mounting Type: Surface Mount Technology (SMT)
  • Pin Count: 900 pins
  • Number of I/O: 556 user I/O pins
  • Differential I/O Pairs: 201 pairs

Process Technology

  • Manufacturing Process: 0.18ฮผm CMOS technology
  • Metal Layers: 6-layer metal interconnect
  • Architecture: Optimized for high-speed, low-power operation

2. Price Information

Current Market Pricing (as of June 2025):

  • Unit Price Range: Contact authorized distributors for current pricing
  • Quantity Breaks Available: Volume discounts available for orders of 100+ units
  • Lead Time: 2-4 weeks for standard quantities
  • Stock Availability: Available from multiple authorized distributors worldwide

Pricing Notes:

  • Prices subject to change based on market conditions
  • Volume pricing available for OEM customers
  • Long-term supply agreements available
  • Contact sales representatives for current quotations

Authorized Distributors:

  • OMO Electronic
  • IC-Components
  • FPGAkey
  • Utmel Electronic
  • Worldway Electronics

3. Documents & Media

Technical Documentation

  • Official Datasheet: XCV812E-8FGG900I Product Specification
  • User Guide: Virtex-E Extended Memory FPGA User Guide
  • Application Notes: Design implementation guidelines
  • Reference Manual: Comprehensive technical reference

Design Resources

  • ECAD Models: Available for major CAD tools
  • PCB Footprint: Standard FBGA900 footprint
  • Symbol Libraries: Schematic symbols for design tools
  • 3D Models: Mechanical models for PCB design

Software Support

  • Development Tools: Xilinx Vivado Design Suite
  • Legacy Support: ISE Design Suite compatibility
  • IP Cores: Extensive library of pre-verified IP
  • Design Examples: Reference designs and tutorials

Evaluation Resources

  • Development Boards: Compatible evaluation platforms available
  • Reference Designs: Sample implementations
  • Getting Started Guides: Quick-start documentation
  • Video Tutorials: Online training resources

4. Related Resources

Compatible Products

  • XCV812E-7FGG900I: Lower speed grade variant
  • XCV812E-6FGG900I: Commercial temperature grade
  • XCV812E-8FG900I: Alternative package option
  • XCV812E-8BG560I: Smaller package variant

Development Tools

  • Xilinx Vivado Design Suite: Primary development environment
  • ChipScope Pro: Integrated logic analyzer
  • System Generator: DSP design tool
  • ISE Design Suite: Legacy tool support

Support Resources

  • Technical Support: Xilinx support portal
  • Community Forums: User community discussions
  • Training Courses: Online and instructor-led training
  • Application Engineering: Direct technical assistance

Application Areas

  • Network Infrastructure: High-speed switches and routers
  • Video Processing: Broadcast and multimedia systems
  • Industrial Automation: Control and monitoring systems
  • Aerospace & Defense: Mission-critical applications
  • Medical Equipment: High-reliability medical devices
  • Automotive Electronics: Advanced driver assistance systems

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Lead-free / RoHS Compliant
  • REACH Compliance: Fully compliant with EU REACH regulation
  • Halogen-Free: Available in halogen-free variants
  • Green Package: Environmentally friendly packaging options

Quality Standards

  • Quality Grade: Industrial grade (-I suffix)
  • Reliability: High-reliability screening available
  • Quality Management: ISO 9001 certified manufacturing
  • Testing Standards: JEDEC standard compliance

Export Classifications

  • ECCN: Export Control Classification Number available
  • Country of Origin: Various manufacturing locations
  • Export License: Check current export regulations
  • Dual-Use Technology: Subject to export control regulations

Packaging & Handling

  • Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
  • ESD Protection: Requires proper ESD handling procedures
  • Storage Conditions: Standard semiconductor storage requirements
  • Shelf Life: Unlimited when properly stored

Certifications

  • UL Recognition: UL file number available
  • CE Marking: European conformity marking
  • FCC Compliance: Electromagnetic compatibility
  • Industry Standards: Complies with relevant industry standards

Key Features & Benefits

โœ“ High-Performance Architecture: 416 MHz operation with 254K system gates
โœ“ Extended Memory: 1.1M+ RAM bits for memory-intensive applications
โœ“ Advanced Process: 0.18ฮผm technology with 6-layer metal interconnect
โœ“ Flexible I/O: 556 user I/O pins with differential pair support
โœ“ Industry-Standard Package: 900-pin FBGA for high-density designs
โœ“ Development Support: Comprehensive tool suite and documentation
โœ“ Environmental Compliance: RoHS compliant and environmentally friendly

The XCV812E-8FGG900I represents the pinnacle of FPGA technology for applications demanding high performance, extensive memory, and reliable operation. Contact authorized distributors for pricing, availability, and technical support.


For the most current specifications, pricing, and availability information, please consult the official Xilinx documentation and authorized distributors.