The XCV812E-8BG560CES is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Xilinx Virtex-E Extended Memory family, delivering exceptional programmable logic solutions for demanding applications. This high-capacity FPGA combines superior performance with advanced 0.18ฮผm CMOS technology to meet the most stringent design requirements.
1. Product Specifications
Core Architecture
- Part Number: XCV812E-8BG560CES
- Family: Virtex-E Extended Memory (EM) FPGAs
- Manufacturer: AMD (formerly Xilinx)
- Technology Node: 0.18ฮผm 6-layer metal CMOS process
- System Gates: 254,016K gates
- Logic Elements: 21,168 cells
- Operating Frequency: Up to 416MHz
Physical Characteristics
- Package Type: 560-LBGA (Land Ball Grid Array) with Exposed Pad, Metal
- Pin Count: 560 pins
- I/O Ports: 404 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
- Package Dimensions: Compact footprint for space-constrained designs
Electrical Specifications
- Core Voltage: 1.8V (1.71V to 1.89V operating range)
- Operating Temperature: 0ยฐC to +85ยฐC (TJ – Junction Temperature)
- Speed Grade: -8 (high-performance grade)
- Power Consumption: Optimized for low-power applications
Memory and DSP Features
- Embedded Memory: Advanced on-chip memory blocks
- DSP Capabilities: Integrated multiply-accumulate functions
- Routing Architecture: Optimized for place-and-route efficiency
- I/O Standards: Support for multiple voltage levels and signaling standards
Advanced Features
- Extended Memory (EM): Enhanced memory capacity for data-intensive applications
- High-Speed Transceivers: Built-in serial communication capabilities
- Clock Management: Advanced clock distribution and management
- Configuration Options: Multiple configuration modes supported
2. Price Information
The XCV812E-8BG560CES is competitively priced in the high-performance FPGA market segment. Pricing varies based on quantity, with significant volume discounts available:
- Unit Price: Starting from $63.76 USD (subject to market fluctuations)
- Minimum Order Quantity (MOQ): 1 piece
- Volume Pricing: Available for quantities over 100 units
- Lead Time: Ships within 48 hours for in-stock items
- Stock Availability: Over 1,750 units currently in stock
Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- Pin Configuration Guide: Detailed pinout diagrams and descriptions
- Application Notes: Design guidelines and implementation examples
- Reference Designs: Proven design templates for rapid development
Development Resources
- Vivado Design Suite: Primary development environment for XCV812E-8BG560CES
- IP Cores: Extensive library of pre-verified intellectual property
- Simulation Models: SPICE and behavioral models for design verification
- ECAD Models: PCB footprints and 3D models for board design
Media Files
- Product Images: High-resolution component photographs
- Package Drawings: Mechanical drawings with dimensions
- 3D Models: CAD files for mechanical integration
- Video Tutorials: Getting started guides and design walkthroughs
4. Related Resources
Development Tools
- Xilinx Vivado Design Suite: Comprehensive FPGA design environment
- ISE Design Tools: Legacy support for existing projects
- ChipScope Pro: Real-time debugging and analysis
- System Generator: Model-based design for DSP applications
Evaluation Platforms
- XCV812E Development Boards: Complete evaluation platforms
- Reference Designs: Proven application examples
- Starter Kits: Entry-level development packages
- Educational Resources: Training materials and tutorials
Compatible Products
- Memory Interfaces: DDR, QDR, and SRAM controllers
- Communication Interfaces: PCIe, Ethernet, and serial protocols
- Power Management: Dedicated power supply solutions
- Cooling Solutions: Thermal management options
Support Resources
- Technical Support: Expert engineering assistance
- Community Forums: Peer-to-peer knowledge sharing
- Training Programs: Professional development courses
- Certification: AMD partner certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS non-compliant (contains lead)
- REACH Compliance: Meets European chemical regulations
- Conflict Minerals: Responsible sourcing certification
- Environmental Impact: Manufactured using eco-friendly processes
Export Control Information
- Export Classification: Subject to U.S. export control regulations
- ECCN (Export Control Classification Number): Classified under semiconductor regulations
- Country Restrictions: May require export licenses for certain destinations
- End-Use Restrictions: Subject to dual-use technology controls
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management certification
- JEDEC Standards: Compliance with semiconductor industry standards
- Military Standards: Optional MIL-STD qualified versions available
Packaging and Shipping
- ESD Protection: Anti-static packaging and handling
- Moisture Sensitivity: Level 3 moisture sensitivity rating
- Storage Requirements: Controlled temperature and humidity
- Shipping Methods: Global logistics with tracking
Lifecycle Information
- Product Status: Active (some variants may be obsolete)
- Lifecycle Stage: Mature product with long-term support
- Replacement Parts: Upgrade paths to newer Virtex families
- End-of-Life Planning: Minimum 5-year advance notice
Keywords: XCV812E-8BG560CES, Virtex-E FPGA, Extended Memory FPGA, AMD Xilinx, 560-LBGA, Field Programmable Gate Array, 0.18ฮผm technology, high-performance FPGA, embedded systems, programmable logic, digital signal processing
Applications: High-speed networking, telecommunications infrastructure, digital signal processing, embedded vision systems, industrial automation, aerospace applications, defense systems, protocol processing, data encryption, and advanced computing platforms.
