The XCV812E-7FGG900I is a cutting-edge Field Programmable Gate Array (FPGA) from the renowned Virtex-E family, manufactured by Xilinx (now part of AMD). This high-performance programmable logic device delivers exceptional speed, capacity, and flexibility for demanding applications across multiple industries.
1. Product Specifications
Core Technical Specifications
Part Number: XCV812E-7FGG900I
Manufacturer: Xilinx (AMD)
Product Family: Virtex-E 1.8V Extended Memory FPGAs
Package Type: FBGA-900 (Fine Ball Grid Array)
Pin Count: 900 pins
Technology Node: 0.18μm CMOS process
Operating Voltage: 1.8V
Performance Characteristics
- Logic Capacity: 254,016 gates equivalent
- System Gates: 21,168 logic cells
- Operating Frequency: Up to 400MHz
- CLBs (Configurable Logic Blocks): 4,704 CLBs
- Memory Architecture: Extended memory configuration
- I/O Count: High-density I/O configuration
- Speed Grade: -7 (high-performance grade)
Key Features
- Advanced 6-layer metal 0.18μm CMOS process for enhanced performance
- Optimized architecture for place-and-route efficiency
- Rich hierarchy of interconnect resources for design flexibility
- Extended memory capabilities for data-intensive applications
- Industrial temperature range operation (-40°C to +85°C)
- High-speed differential signaling support
- On-chip clock management with DLLs and DCMs
Applications
The XCV812E-7FGG900I excels in diverse applications including:
- Communications Equipment – High-speed networking and telecommunications
- Industrial Motor Drives – Precision control systems
- Enterprise Systems – Server and data center infrastructure
- Wireless Infrastructure – Base stations and RF processing
- Personal Electronics – Advanced consumer devices
- Automotive Infotainment – In-vehicle entertainment systems
- Connected Peripherals & Printers – Smart device connectivity
2. Pricing Information
Current Market Status: Available through authorized distributors
Lifecycle Status: Mature product (Legacy/Obsolete for new designs)
Lead Time: Typically 2-8 weeks depending on quantity
MOQ (Minimum Order Quantity): Varies by distributor (typically 1-25 pieces)
Pricing Structure:
- Small quantities (1-9 pieces): Contact for quote
- Medium volumes (10-99 pieces): Volume pricing available
- Large volumes (100+ pieces): Best pricing with extended lead times
Note: Pricing is subject to market conditions and availability. Contact authorized distributors for current pricing and stock levels.
3. Documents & Media
Technical Documentation
- Official Datasheet: Virtex-E 1.8V Extended Memory FPGA datasheet
- User Guide: Virtex-E Configuration Guide
- Application Notes: Design optimization guidelines
- PCB Layout Guidelines: Package-specific layout recommendations
- Thermal Management Guide: Heat dissipation best practices
Design Resources
- ECAD Models: Available for major CAD tools
- PCB Footprint Files: Standard FBGA-900 footprint
- 3D Models: For mechanical design verification
- Symbol Libraries: Schematic symbol files
- Reference Designs: Example implementations
Software Support
- Xilinx ISE Design Suite: Primary development environment
- Vivado Design Suite: Limited support (legacy device)
- ChipScope Pro: For debugging and verification
- CORE Generator: IP core integration
4. Related Resources
Development Tools
- Programming Cables: JTAG boundary-scan programming
- Configuration PROMs: External configuration memory
- Evaluation Boards: Third-party development platforms
- Reference Kits: Application-specific starter kits
Compatible Products
- Configuration Devices: XC18V series PROMs
- Power Management: Dedicated FPGA power solutions
- Clock Sources: Low-jitter oscillators and crystals
- Level Translators: Multi-voltage interface solutions
Technical Support
- Application Engineers: Design consultation services
- Training Resources: Online courses and webinars
- Community Forums: Peer-to-peer technical discussions
- Knowledge Base: Searchable technical articles
Alternative Solutions
For new designs, consider these modern alternatives:
- Spartan-7 Series: Cost-optimized successor
- Artix-7 Series: Enhanced performance and features
- Kintex-7 Series: Higher capacity options
- Zynq Series: SoC integration with ARM processors
5. Environmental & Export Classifications
Environmental Compliance
RoHS Status: Non-compliant (contains lead)
REACH Compliance: Not compliant with current regulations
Halogen Status: Contains halogenated materials
Lead-Free Status: Not lead-free (legacy product)
Package Material: Plastic FBGA with lead-based solder balls
Export Control Information
ECCN (Export Control Classification Number): 3A001.a.7
HTS (Harmonized Tariff Schedule): 8542.39.0001
Country of Origin: Various (refer to specific lot markings)
Export License Requirements: May require export license for certain destinations
Quality Standards
- MSL (Moisture Sensitivity Level): Level 3
- Storage Conditions: -55°C to +150°C in sealed bag
- Shelf Life: 12 months in original packaging
- Quality Grade: Industrial standard
- Qualification Standards: AEC-Q100 automotive qualified versions available
Packaging Information
- Tray Packaging: Standard for production quantities
- Tube Packaging: Available for small quantities
- Tape & Reel: Available for automated assembly
- Anti-static Protection: ESD-safe packaging included
- Marking Standards: Industry-standard part marking
The XCV812E-7FGG900I represents proven FPGA technology with extensive field deployment. While not recommended for new designs, it remains an excellent choice for legacy system maintenance and cost-sensitive applications requiring mature, stable technology.
Contact Information: For technical inquiries, pricing, and availability, please contact authorized Xilinx/AMD distributors or your local sales representative.
