The XCV812E-7FGG900C is a premium Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex-E family, designed for demanding applications requiring high-performance programmable logic solutions. This advanced FPGA delivers exceptional processing capabilities with extended memory features, making it ideal for complex digital signal processing, telecommunications, and embedded system applications.
1. Product Specifications
Core Features
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-E with Extended Memory
- Part Number: XCV812E-7FGG900C
- Package Type: 900-Pin Fine-Pitch Ball Grid Array (FBGA)
- Technology: 0.18μm CMOS process with 6-layer metal
- Supply Voltage: 1.71V to 1.89V (1.8V nominal)
Performance Specifications
- Gate Count: 254,016 system gates
- Configurable Logic Blocks (CLBs): 4,704 CLBs
- Logic Cells: Approximately 21,168 logic cells
- Operating Frequency: Up to 416MHz maximum performance
- Speed Grade: -7 (high-performance grade)
- RAM Bits: 1,146,880 total distributed RAM bits
- Block RAM: 140kB of dedicated block RAM
Physical Characteristics
- Package: 900-pin FBGA (Fine-pitch Ball Grid Array)
- I/O Pins: 556 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
- Operating Temperature: 0°C to +85°C (Commercial grade)
- Total Pins: 900 pins
Advanced Features
- Extended Memory Architecture: Enhanced memory capabilities for data-intensive applications
- High-Speed Interconnect: Optimized routing resources for maximum performance
- Programmable I/O: Flexible input/output configuration options
- ESD Protection: Built-in electrostatic discharge protection
- RoHS Compliance: Lead-free and environmentally compliant
2. Price Information
The XCV812E-7FGG900C pricing varies based on quantity, supplier, and market conditions. Current market pricing includes:
- Stock Status: Available from authorized distributors
- Lead Time: Typically 1-4 weeks for standard quantities
- Minimum Order Quantity (MOQ): Varies by supplier (typically 1-25 units)
- Price Range: Contact authorized distributors for current pricing
- Volume Discounts: Available for larger quantities
Price Factors:
- Market demand and availability
- Order quantity and volume commitments
- Distributor relationships and terms
- Geographic location and shipping requirements
Note: Prices fluctuate based on market conditions. Contact authorized distributors for real-time quotations and volume pricing.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guide
- Application Notes: Design examples and best practices
- Pin-out Diagrams: Detailed pin configuration and assignments
- Package Drawings: Mechanical specifications and dimensions
Design Resources
- IBIS Models: Signal integrity simulation models
- SPICE Models: Circuit simulation parameters
- CAD Symbols: Schematic capture symbols
- PCB Footprints: Land pattern recommendations
- 3D Models: Mechanical design files
Software Support
- Vivado Design Suite: Current design environment
- ISE Design Tools: Legacy development environment (compatible)
- Development Boards: Reference designs and evaluation platforms
- IP Core Library: Pre-verified intellectual property blocks
4. Related Resources
Development Tools
- Programming Cables: JTAG and configuration interfaces
- Evaluation Boards: Development and prototyping platforms
- Reference Designs: Application-specific implementations
- Debug Tools: Logic analyzers and verification equipment
Complementary Products
- Configuration Memory: Serial Flash and PROM devices
- Power Management: Voltage regulators and power modules
- Clock Sources: Oscillators and clock distribution ICs
- Interface Components: Transceivers and level shifters
Technical Support
- Design Consultation: Expert engineering support
- Training Resources: Online courses and workshops
- Community Forums: Peer-to-peer technical discussions
- Application Engineering: Dedicated support for complex projects
Alternative Products
- Speed Variants: XCV812E-6FGG900C, XCV812E-8FG900C
- Package Options: XCV812E-7BG560C (smaller package)
- Family Members: XCV405E, XCV600E (different capacities)
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS Compliant (Lead-free)
- REACH Compliance: EU chemical regulation compliant
- Conflict Minerals: Conflict-free sourcing certified
- Green Packaging: Recyclable anti-static packaging
- Environmental Rating: Commercial temperature range (0°C to +85°C)
Quality & Reliability
- Quality Grade: Industrial/Commercial grade
- Reliability Standards: JEDEC qualified
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- ESD Rating: Human Body Model (HBM) and Charged Device Model (CDM) compliant
Export Control Information
- ECCN Classification: Export Control Classification Number available
- Country of Origin: Manufacturing location specified
- Export Restrictions: Subject to applicable export control regulations
- Dual-Use Technology: May require export licensing for certain destinations
Certifications
- ISO Standards: Manufactured under ISO 9001 quality management
- Industry Certifications: Meets telecommunications and automotive standards
- Safety Approvals: UL, CE marking where applicable
- Supply Chain Security: Authorized distribution channel verified
Packaging & Handling
- Anti-Static Protection: ESD-safe packaging and handling procedures
- Traceability: Full lot tracking and genealogy records
- Storage Requirements: Temperature and humidity controlled environments
- Shipping: Global logistics with proper handling protocols
Keywords: XCV812E-7FGG900C, Xilinx FPGA, Virtex-E FPGA, programmable logic, 254016 gates, FBGA900, high-performance FPGA, extended memory FPGA, AMD Xilinx, field programmable gate array
For technical support, pricing inquiries, or detailed specifications, contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website.
