Product Overview
The XCV812E-7BG560C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E Extended Memory series. This advanced programmable logic device delivers exceptional performance, high capacity, and superior integration capabilities for demanding electronic applications. The XCV812E-7BG560C is designed to provide optimal silicon efficiency through advanced architecture optimization and cutting-edge 0.18 μm CMOS process technology.
1. Product Specifications
Core Technical Specifications
- Part Number: XCV812E-7BG560C
- Manufacturer: Xilinx Inc. (now AMD)
- Product Family: Virtex-E Extended Memory (EM) Series
- Device Type: Field Programmable Gate Array (FPGA)
- Package Type: 560-LBGA (Land Ball Grid Array) Exposed Pad, Metal
- Pin Count: 560 pins
- Speed Grade: -7 (Commercial grade)
Performance Characteristics
- Logic Elements/Cells: 21,168 logic elements for complex digital designs
- System Gates: High-density gate array with enhanced processing capability
- I/O Count: 404 user I/O pins for maximum connectivity
- RAM Bits: 1,146,880 RAM bits for extensive memory applications
- Operating Voltage: 1.8V core voltage (1.71V to 1.89V range)
- Process Technology: Advanced 6-layer metal 0.18 μm CMOS process
- Operating Temperature: Commercial temperature range
Key Features
- High-Speed Performance: Optimized for demanding real-time applications
- Extended Memory Architecture: Enhanced memory capacity for data-intensive operations
- Advanced Place-and-Route Efficiency: Optimized silicon utilization
- Surface Mount Technology: Professional-grade mounting for reliable connections
- RoHS Compliance: Meets environmental standards (Note: Some sources indicate RoHS non-compliant – verify with supplier)
2. Pricing Information
Current Market Pricing
The XCV812E-7BG560C pricing varies based on quantity, supplier, and market conditions. Current market indicators show:
- Availability Status: In stock at multiple authorized distributors
- Stock Levels: Over 6,000+ units available across various suppliers
- Pricing Model: Request for Quote (RFQ) basis due to market volatility
- Minimum Order Quantity: Typically 1-10 pieces depending on distributor
- Lead Time: 1-5 business days for in-stock items
Volume Pricing
- Small quantities (1-10 pcs): Contact for quote
- Medium volumes (11-100 pcs): Volume discounts available
- Large orders (100+ pcs): Competitive bulk pricing options
- OEM/Contract Manufacturing: Special pricing programs available
Note: Prices are subject to change due to market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: XCV812E-7BG560C datasheet PDF available from Xilinx/AMD
- Product Brief: Virtex-E Extended Memory family overview
- Pin Configuration: Detailed pinout diagrams and ball assignment
- Electrical Characteristics: DC and AC specifications
- Thermal Guidelines: Package thermal characteristics and recommendations
Design Resources
- Reference Designs: Sample implementations and design examples
- Application Notes: Best practices for XCV812E-7BG560C implementation
- Development Tools: Xilinx ISE or Vivado Design Suite compatibility
- Programming Files: Bitstream generation and configuration guides
- PCB Design Guidelines: Layout recommendations for optimal performance
Software Support
- Xilinx ISE Design Suite: Legacy design environment support
- Vivado Design Suite: Modern design tools (check compatibility)
- IP Core Libraries: Pre-verified intellectual property blocks
- Simulation Models: VHDL/Verilog simulation support
4. Related Resources
Compatible Development Boards
- Evaluation Kits: XCV812E evaluation boards for prototyping
- Development Platforms: Third-party development systems
- Reference Boards: Industry-standard evaluation platforms
- Starter Kits: Educational and learning platforms
Related FPGA Products
- XCV812E-6BG560C: -6 speed grade variant
- XCV812E-8BG560C: -8 speed grade alternative
- XCV812E-7FG900C: Alternative package option
- XCV1000E-7BG560C: Higher capacity option in same package
Technical Support
- Design Consultation: Expert engineering support services
- Application Engineering: Custom implementation assistance
- Training Resources: FPGA design methodology courses
- Community Forums: User community and knowledge base
- Replacement Parts: Cross-reference and alternative solutions
Supply Chain Services
- Authorized Distributors: Global network of certified suppliers
- Inventory Management: Just-in-time delivery programs
- Quality Assurance: Original manufacturer warranty
- Obsolescence Management: Lifecycle and replacement planning
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Verify compliance status with current supplier
- REACH Compliance: European chemical regulation conformance
- Conflict Minerals: Responsible sourcing certification
- WEEE Directive: Electronic waste management compliance
- California Proposition 65: Chemical exposure warning requirements
Quality Standards
- ISO 9001: Quality management system certification
- IPC Standards: Electronic assembly and reliability standards
- JEDEC Standards: Semiconductor reliability and testing compliance
- Automotive Grade: Industrial/commercial grade classification
- Military Standards: Contact for defense/aerospace variants
Export Control Information
- ECCN Classification: Export Control Classification Number designation
- Country of Origin: Manufacturing location details
- Export Restrictions: International trade compliance information
- Import Documentation: Required customs and regulatory paperwork
- Dual-Use Technology: Strategic trade control considerations
Package and Handling
- ESD Protection: Anti-static packaging and handling requirements
- Moisture Sensitivity: Level 3 MSL rating with proper storage requirements
- Temperature Storage: Recommended storage conditions (-40°C to +125°C)
- Shelf Life: Extended storage capabilities with proper environmental controls
- Traceability: Full supply chain documentation and lot tracking
Sustainability Information
- Lifecycle Assessment: Environmental impact throughout product life
- Material Declaration: Complete bill of materials and substance listing
- Recycling Guidelines: End-of-life disposal and material recovery
- Energy Efficiency: Power consumption optimization features
- Green Design: Environmentally conscious engineering practices
Contact Information: For detailed specifications, current pricing, technical support, or bulk orders of the XCV812E-7BG560C, contact your authorized Xilinx/AMD distributor or electronic components supplier. Professional technical support and application engineering services are available to ensure successful implementation of this advanced FPGA solution.
