The XCV812E-6FGG900I is a cutting-edge field-programmable gate array (FPGA) designed to deliver exceptional performance for demanding applications across telecommunications, industrial automation, and embedded systems. This advanced semiconductor solution combines robust architecture with flexible programmability to meet the evolving needs of modern electronic designs.
Product Specifications
The XCV812E-6FGG900I features a comprehensive set of technical specifications that make it ideal for high-performance computing applications. This FPGA incorporates advanced logic elements with optimized routing architecture, ensuring efficient signal processing and minimal latency. The device operates across industrial temperature ranges while maintaining excellent power efficiency characteristics.
Key technical parameters include high-density logic capacity, multiple I/O standards support, and integrated memory blocks that enable complex digital signal processing tasks. The XCV812E-6FGG900I supports various clocking schemes and includes built-in phase-locked loops (PLLs) for precise timing control across different clock domains.
The package configuration utilizes fine-pitch ball grid array (FBGA) technology, providing excellent thermal performance and signal integrity. This packaging approach ensures reliable operation in challenging environmental conditions while maintaining compact form factor requirements for space-constrained applications.
Pricing Information
Pricing for the XCV812E-6FGG900I varies based on order quantity, delivery schedule, and specific customer requirements. Volume discounts are available for large-scale production runs, making this FPGA solution cost-effective for both prototype development and mass production scenarios.
Contact authorized distributors or sales representatives for current pricing information, as semiconductor costs fluctuate based on market conditions and availability. Special pricing programs may be available for educational institutions, startups, and long-term supply agreements.
Lead times typically range from stock availability to several weeks for custom configurations, depending on current demand and manufacturing schedules.
Documents & Media
Comprehensive technical documentation supports the XCV812E-6FGG900I implementation process. The complete datasheet provides detailed electrical characteristics, timing specifications, and package information necessary for proper circuit design and PCB layout.
Application notes offer practical guidance for common implementation scenarios, including power supply design, thermal management, and signal integrity considerations. Reference designs demonstrate best practices for integrating the XCV812E-6FGG900I into various system architectures.
Development tools and software support include industry-standard design environments, simulation models, and debugging utilities. Programming guides and code examples accelerate the development process for both experienced engineers and those new to FPGA technology.
Video tutorials and webinar recordings provide additional learning resources, covering topics from basic FPGA concepts to advanced implementation techniques specific to the XCV812E-6FGG900I architecture.
Related Resources
The XCV812E-6FGG900I ecosystem includes complementary products and development tools that enhance the overall design experience. Evaluation boards provide hands-on learning opportunities and rapid prototyping capabilities for proof-of-concept development.
Compatible memory devices, power management solutions, and interface components are available from preferred suppliers, ensuring optimal system-level performance and reliability. Reference designs showcase successful implementations across various application domains.
Training resources include online courses, certification programs, and technical workshops that help engineers maximize the potential of the XCV812E-6FGG900I in their specific applications. Community forums and technical support channels provide ongoing assistance throughout the product lifecycle.
Third-party IP cores and software libraries expand functionality and reduce development time for common processing tasks and communication protocols.
Environmental & Export Classifications
The XCV812E-6FGG900I meets strict environmental compliance standards, including RoHS (Restriction of Hazardous Substances) regulations and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) requirements. These certifications ensure responsible manufacturing practices and environmental sustainability.
Export classification information is available for international shipping and regulatory compliance purposes. The device classification status determines applicable export control regulations and licensing requirements for different destination countries.
Operating temperature ranges support both commercial and industrial applications, with extended temperature variants available for harsh environment deployments. Humidity and altitude specifications ensure reliable operation across diverse installation conditions.
Quality certifications include ISO standards compliance and automotive-grade qualifications where applicable, providing confidence for mission-critical applications requiring high reliability and long-term availability.
The XCV812E-6FGG900I represents a versatile and powerful FPGA solution that combines advanced technology with practical design considerations, making it an excellent choice for engineers seeking high-performance programmable logic capabilities.
