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XCV812E-6FG900C: High-Performance FPGA Solution for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

The XCV812E-6FG900C represents cutting-edge field-programmable gate array (FPGA) technology designed for demanding computational applications. This advanced semiconductor device delivers exceptional performance, flexibility, and reliability for professional engineering projects.

Product Specifications

The XCV812E-6FG900C features robust technical specifications that make it ideal for complex digital signal processing and embedded system applications:

Core Architecture:

  • Advanced FPGA architecture optimized for high-speed processing
  • Enhanced logic capacity for complex algorithm implementation
  • Low-power design with efficient thermal management
  • High-speed I/O capabilities for seamless system integration

Package Details:

  • Package Type: Fine-pitch Ball Grid Array (FBGA)
  • Pin Configuration: 900-pin layout for maximum connectivity
  • Operating Temperature Range: Industrial-grade temperature tolerance
  • Speed Grade: -6 performance grade for optimal processing speeds

Key Features:

  • Superior logic density for complex designs
  • Built-in memory blocks for data storage and buffering
  • Multiple clock domains for flexible timing requirements
  • Advanced routing architecture for signal integrity

Price Information

The XCV812E-6FG900C pricing varies based on order quantities and distribution channels. Contact authorized distributors for current pricing information, volume discounts, and availability. Educational institutions and qualified research organizations may be eligible for special pricing programs.

Factors affecting XCV812E-6FG900C pricing include:

  • Order volume and quantity breaks
  • Lead times and stock availability
  • Regional market conditions
  • Special packaging or testing requirements

Documents & Media

Comprehensive technical documentation supports successful XCV812E-6FG900C implementation:

Technical Documentation:

  • Complete datasheet with electrical specifications
  • Pin configuration and package drawings
  • Programming and configuration guides
  • Application notes and design examples
  • Thermal analysis and power consumption data

Development Resources:

  • Software development tools compatibility matrix
  • Reference designs and evaluation boards
  • Hardware description language (HDL) examples
  • Simulation models and timing analysis files

Quality Documentation:

  • Reliability and qualification reports
  • Manufacturing test specifications
  • Quality assurance certifications
  • Compliance documentation

Related Resources

The XCV812E-6FG900C ecosystem includes comprehensive support resources:

Development Tools:

  • Compatible with industry-standard FPGA development environments
  • Synthesis and place-and-route software support
  • Debugging and verification tools
  • IP core libraries and pre-verified components

Hardware Support:

  • Evaluation and development boards
  • Reference designs for common applications
  • Socket adapters and programming accessories
  • Thermal management solutions

Technical Support:

  • Online knowledge base and forums
  • Application engineering support
  • Training materials and webinars
  • Community-driven design examples

Environmental & Export Classifications

The XCV812E-6FG900C meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS (Restriction of Hazardous Substances) compliant
  • REACH regulation conformance
  • Conflict minerals reporting compliance
  • Green packaging initiatives support

Export Classifications:

  • Export Control Classification Number (ECCN) designation
  • International traffic regulations compliance
  • Country-specific import/export requirements
  • Technology transfer licensing considerations

Quality Standards:

  • ISO 9001 quality management certification
  • Automotive qualification standards where applicable
  • Military and aerospace specifications compliance
  • Industry-specific quality requirements

Reliability Specifications:

  • Mean Time Between Failures (MTBF) ratings
  • Operating life expectancy data
  • Stress testing and qualification results
  • Environmental operating conditions

The XCV812E-6FG900C delivers the performance, reliability, and flexibility required for next-generation FPGA applications. Its comprehensive feature set, robust documentation, and strong ecosystem support make it an excellent choice for engineers developing advanced digital systems.