The XCV812E-6BG560I represents cutting-edge field-programmable gate array (FPGA) technology designed for demanding applications requiring exceptional processing power and flexibility. This advanced semiconductor device delivers robust performance characteristics that make it ideal for telecommunications, aerospace, industrial automation, and high-performance computing applications.
Product Specifications
The XCV812E-6BG560I features a comprehensive set of technical specifications engineered for professional-grade implementations:
Core Architecture: Built on advanced FPGA architecture with high-density logic cells and optimized routing resources. The device incorporates thousands of configurable logic blocks (CLBs) providing exceptional flexibility for custom digital signal processing and control applications.
Package Configuration: Housed in a BG560 ball grid array (BGA) package, the XCV812E-6BG560I offers excellent thermal performance and signal integrity. The 560-pin configuration provides extensive I/O capabilities while maintaining compact footprint requirements for space-constrained designs.
Speed Grade: The -6 speed grade designation indicates superior timing performance, enabling high-frequency operation essential for time-critical applications. This speed rating ensures reliable operation across demanding environmental conditions.
Operating Characteristics: The device supports wide voltage ranges and temperature specifications, making it suitable for both commercial and industrial deployment scenarios. Power consumption optimization features help maintain efficiency across varying operational loads.
Memory Resources: Integrated block RAM and distributed RAM resources provide flexible memory solutions for data buffering, lookup tables, and temporary storage requirements within FPGA-based designs.
Pricing Information
Pricing for the XCV812E-6BG560I varies based on order quantities, delivery requirements, and current market conditions. Contact authorized distributors for current pricing information and volume discount schedules. Educational institutions and research organizations may qualify for special academic pricing programs.
Factors affecting price include packaging options, testing specifications, and delivery timeframes. Extended temperature range versions and enhanced screening options are available at premium pricing for mission-critical applications.
Documents & Media
Comprehensive technical documentation supports XCV812E-6BG560I implementation and development:
Datasheet: Complete electrical specifications, timing characteristics, and pin configuration details provide essential design information. The datasheet includes AC/DC parameters, switching characteristics, and recommended operating conditions.
User Guide: Step-by-step implementation guidance covers design methodology, configuration procedures, and best practices for optimal performance. The user guide includes practical examples and troubleshooting recommendations.
Application Notes: Specialized documentation addresses specific use cases including digital signal processing implementations, communication protocol development, and system integration considerations.
Development Tools: Software support includes synthesis tools, simulation environments, and debugging utilities optimized for XCV812E-6BG560I development workflows.
Reference Designs: Pre-validated design examples demonstrate common implementation patterns and provide starting points for custom development projects.
Related Resources
The XCV812E-6BG560I ecosystem includes complementary products and resources that enhance development capabilities:
Development Boards: Evaluation platforms featuring the XCV812E-6BG560I enable rapid prototyping and proof-of-concept development. These boards include essential support circuitry, debugging interfaces, and expansion connectors.
IP Core Library: Pre-verified intellectual property blocks accelerate development timelines by providing tested implementations of common functions including communication protocols, digital filters, and interface controllers.
Training Materials: Educational resources including webinars, tutorials, and hands-on workshops help development teams maximize XCV812E-6BG560I capabilities and implement best practices.
Technical Support: Comprehensive support services include online resources, community forums, and direct engineering assistance for complex implementation challenges.
Companion Devices: Related semiconductor products including configuration memories, clock management devices, and interface transceivers complement XCV812E-6BG560I implementations.
Environmental & Export Classifications
The XCV812E-6BG560I meets stringent environmental and regulatory requirements for global deployment:
Environmental Compliance: RoHS (Restriction of Hazardous Substances) compliant manufacturing ensures environmental responsibility and regulatory compliance in global markets. Lead-free packaging options support green technology initiatives.
Operating Environment: Qualified for operation across extended temperature ranges from -40°C to +85°C, the device supports deployment in challenging environmental conditions including industrial, automotive, and outdoor applications.
Export Classifications: Export control classifications vary by destination country and end-use application. Consult current export control documentation and work with authorized distributors to ensure compliance with applicable regulations including EAR (Export Administration Regulations) and ITAR (International Traffic in Arms Regulations) requirements.
Quality Standards: Manufacturing processes meet ISO 9001 quality management standards and automotive-grade quality requirements where applicable. Comprehensive testing and screening procedures ensure consistent performance and reliability.
Reliability Specifications: Extensive qualification testing including thermal cycling, vibration testing, and accelerated aging validates long-term reliability for mission-critical applications. Mean time between failure (MTBF) calculations support system-level reliability analysis.
The XCV812E-6BG560I combines advanced FPGA technology with comprehensive support resources, making it an excellent choice for demanding applications requiring flexible, high-performance programmable logic solutions.
