1. Product Specifications
Core Architecture
- Part Number Family: XCV600E-FG680 series
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Capacity: 186.624K system gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Total RAM: 294,912 RAM bits
Performance Specifications
- Operating Frequency: 357MHz (Speed Grade -6), 400MHz (Speed Grade -7)
- Internal Performance: Up to 130MHz across four logic levels
- Process Technology: 0.18ฮผm CMOS technology
- Metal Layers: 6-layer metal process for enhanced routing efficiency
- Core Voltage: 1.8V operation
Package Information
- Package Type: 680-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FG680
- I/O Count: 512 user I/O pins (maximum configuration)
- Package Dimensions: 27mm ร 27mm ร 2.8mm
- Ball Pitch: Fine-pitch configuration for high-density routing
- Temperature Grades: Commercial (C), Industrial (I)
Speed Grade Variants
- XCV600E-6FG680C/I: 357MHz commercial/industrial operation
- XCV600E-7FG680C/I: 400MHz commercial/industrial operation
- XCV600E-8FG680C: 450MHz+ commercial operation (select variants)
2. Pricing Information
Current Market Pricing (2025)
Speed Grade -6 Variants:
- Commercial (C): Contact for current pricing
- Industrial (I): Premium pricing for extended temperature range
Speed Grade -7 Variants:
- Commercial (C): Contact for current pricing
- Industrial (I): Premium pricing for enhanced performance
Stock Availability by Supplier:
- Ovaga Technologies: 1,300-7,146 units available
- IC-Components: 2,600+ units in stock
- Multiple Distributors: Extensive global inventory
Pricing Factors:
- Speed grade selection (-6, -7, -8)
- Temperature grade (Commercial vs Industrial)
- Package marking and date codes
- Volume discounts available for 100+ units
- Lead times vary by speed/temperature combination
Note: XCV600E-FG680 pricing varies significantly based on speed grade and temperature range. Contact authorized distributors for current quotations as this is a legacy product with limited production.
3. Documents & Media
Technical Documentation
- Virtex-E Family Datasheet: Complete electrical and timing specifications
- FG680 Package Specifications: Mechanical drawings and thermal characteristics
- Pinout Documentation: Complete 680-pin assignment and signal mapping
- Speed Grade Analysis: Detailed timing specifications for each performance grade
Design Resources
- Reference Designs: High I/O count implementation examples
- PCB Layout Guidelines: FG680 package design best practices
- Signal Integrity Guidelines: High-speed design considerations for 680-pin package
- Thermal Management: Heat dissipation strategies for maximum performance
Development Tools
- Xilinx ISE Design Suite: Legacy design environment (recommended for Virtex-E)
- Programming Solutions: iMPACT configuration tools and bitstream generation
- Simulation Models: Comprehensive behavioral and timing models
- IP Core Library: Pre-verified intellectual property blocks
Application Notes
- AN-001: FG680 PCB Design Guidelines and Via Strategies
- AN-002: High-Speed Signal Routing for 680-Pin Packages
- AN-003: Power Distribution Network Design for Virtex-E FPGAs
- AN-004: Thermal Management in High I/O Count Applications
Quality Documentation
- Reliability Reports: MTBF calculations and qualification data
- Test Procedures: Electrical and functional test specifications
- Assembly Guidelines: BGA soldering and inspection procedures
- Failure Analysis: Common failure modes and prevention strategies
4. Related Resources
Development Platforms
- Virtex-E Evaluation Boards: Complete development environments with FG680 support
- High I/O Breakout Boards: Specialized PCBs for 680-pin package access
- System-Level Platforms: Reference designs for telecommunications and networking
- Third-Party Solutions: Compatible development boards from ecosystem partners
Compatible Products & Alternatives
- Pin-Compatible Options:
- XCV600E-6FG680C (357MHz commercial)
- XCV600E-7FG680C (400MHz commercial)
- XCV600E-6FG680I (357MHz industrial)
- XCV600E-7FG680I (400MHz industrial)
- Package Alternatives:
- XCV600E-FG676 (676-pin, reduced I/O count)
- XCV600E-BG432 (432-pin, compact footprint)
- XCV600E-BG560 (560-pin, mid-range I/O)
- Capacity Variants:
- XCV400E-FG680 (lower logic capacity)
- XCV800E-FG680 (higher logic capacity)
- XCV1000E-FG680 (maximum logic capacity)
Design Tools & Software
- Primary Development Environment:
- Xilinx ISE Design Suite (versions 10.1-14.7 recommended)
- ISE WebPACK (free version with device support)
- Simulation & Verification:
- ModelSim simulation environment
- ISE Simulator (integrated solution)
- Third-party simulation tools
- Programming & Debug:
- iMPACT programming software
- ChipScope Pro embedded logic analyzer
- Platform Cable USB/II programming hardware
Technical Support Resources
- AMD/Xilinx Legacy Support: Documentation portal and archives
- Community Resources: FPGA forums and user groups
- Application Engineering: Expert consultation for complex designs
- Training Materials: Virtex-E design methodology courses
PCB Design Support
- Layout Services: Specialized FG680 PCB design expertise
- Assembly Partners: BGA soldering and test capabilities
- Component Libraries: Footprints and models for major CAD tools
- Design Rule Verification: DRC files for routing validation
5. Environmental & Export Classifications
Environmental Specifications
- Commercial Grade (C-temp):
- Operating Temperature: 0ยฐC to +85ยฐC
- Junction Temperature: Up to +125ยฐC
- Industrial Grade (I-temp):
- Operating Temperature: -40ยฐC to +100ยฐC
- Junction Temperature: Up to +125ยฐC
- Storage Conditions:
- Temperature Range: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters
Physical Characteristics
- Package Dimensions: 27mm ร 27mm ร 2.8mm (nominal)
- Weight: Approximately 3.2 grams
- Ball Count: 680 solder balls
- Ball Diameter: 0.45mm (typical)
- Ball Pitch: 1.0mm center-to-center spacing
Thermal Characteristics
- Thermal Resistance (ฮธJA):
- Still air: 15ยฐC/W (typical)
- With heatsink: 8ยฐC/W (with proper thermal interface)
- Maximum Power Dissipation: Variable by application and cooling
- Thermal Interface: Exposed pad for enhanced heat transfer
Compliance & Certifications
- RoHS Compliance: Varies by manufacturing date and supplier
- Pre-2006 devices: May contain lead
- Post-2006 devices: RoHS compliant options available
- REACH Regulation: Compliant with EU chemical safety requirements
- Halogen-Free: Select variants available upon request
- Conflict Minerals: Compliant with industry standards
Export Control Information
- ECCN Classification: Subject to U.S. Export Administration Regulations
- Export License Requirements: May require approval for certain destinations
- Technology Transfer: Subject to restrictions for sensitive applications
- Country of Origin: Various manufacturing locations (Asia-Pacific)
Quality & Reliability Standards
- Quality Grade: Commercial and Industrial grade classifications
- Qualification Testing:
- Temperature cycling (-65ยฐC to +150ยฐC)
- Thermal shock testing
- Humidity and salt spray exposure
- Mechanical shock and vibration
- Reliability Metrics:
- MTBF calculations available
- FIT (Failures in Time) rate specifications
- Wear-out mechanisms analysis
Environmental Impact
- Material Composition: Silicon die with organic substrate
- Packaging Materials: Bismaleimide triazine (BT) substrate
- End-of-Life: Electronic waste recycling guidelines
- Energy Efficiency: CMOS technology for reduced power consumption
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)
- Baking Requirements: 125ยฐC for 24 hours if exceeded
- Storage: Dry pack with desiccant recommended
- Floor Life: Limited exposure time after bag opening
Applications
The XCV600E-FG680 excels in high I/O count applications including:
Telecommunications Infrastructure:
- Central office switching equipment
- Base station signal processing
- High-capacity routers and switches
- Protocol conversion systems
Industrial Automation:
- Multi-axis motion control systems
- High-resolution data acquisition
- Real-time process control
- Distributed I/O modules
Medical Equipment:
- MRI and CT scanner control systems
- High-resolution imaging processing
- Multi-channel patient monitoring
- Laboratory automation equipment
Test & Measurement:
- High-channel count oscilloscopes
- Logic analyzers and protocol analyzers
- Automated test equipment (ATE)
- Multi-channel signal generators
Signal Processing:
- Software-defined radio (SDR) systems
- Multi-channel audio processing
- Video processing and routing
- Radar and sonar signal processing
Design Considerations
FG680 Package Advantages:
- Maximum I/O capability in Virtex-E family
- Excellent signal integrity with proper layout
- Proven thermal performance with adequate cooling
- Industry-standard package with broad ecosystem support
Implementation Strategies:
- Via-in-pad technology for escape routing
- Multi-layer PCB design (8+ layers recommended)
- Dedicated power and ground planes
- Proper decoupling capacitor placement
Legacy Support:
- Continued availability through authorized distributors
- Long-term support through AMD/Xilinx legacy programs
- Extensive documentation and design resources
- Strong community support and knowledge base
Conclusion
The XCV600E-FG680 delivers maximum I/O capability and proven performance for demanding applications requiring extensive connectivity. With its robust 680-pin FBGA package, multiple speed grades, and comprehensive development ecosystem, this Virtex-E device provides designers with a reliable, high-performance solution for I/O-intensive embedded applications. The extensive supplier network and legacy support ensure continued availability for critical system designs, while the mature architecture guarantees stable, predictable performance.
