1. Product Specifications
Core Architecture
- Part Number Family: XCV600E-FG676C series
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Capacity: 186.624K system gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- Total RAM: 294,912 RAM bits
Performance Specifications
- Operating Frequency: 357MHz (Speed Grade -6), 400MHz (Speed Grade -7), 450MHz+ (Speed Grade -8)
- Internal Performance: Up to 130MHz across four logic levels
- Process Technology: 0.18ฮผm CMOS technology
- Metal Layers: 6-layer metal process for optimized routing
- Core Voltage: 1.8V operation
- I/O Voltage: Multiple standards supported (1.2V to 3.3V)
Package Information
- Package Type: 676-Pin Fine-pitch Ball Grid Array (FBGA)
- Package Designation: FG676C
- I/O Count: 444 user I/O pins
- Package Dimensions: 27mm ร 27mm ร 2.8mm
- Ball Pitch: 1.0mm center-to-center spacing
- Temperature Grades: Commercial (C), Industrial (I)
Speed Grade Variants
- XCV600E-6FG676C: 357MHz commercial operation
- XCV600E-7FG676C: 400MHz commercial operation
- XCV600E-8FG676C: 450MHz+ commercial operation
- XCV600E-6FG676I: 357MHz industrial operation (-40ยฐC to +100ยฐC)
- XCV600E-7FG676I: 400MHz industrial operation (-40ยฐC to +100ยฐC)
Advanced Features
- SelectI/O+ Technology: Support for multiple I/O standards including LVDS, LVPECL
- Digital Delay-Locked Loops (DLLs): Eight DLLs for precise clock management
- Configuration Modes: Master Serial, Slave Serial, SelectMAP
- Memory Hierarchy: Flexible internal and external memory interfaces
2. Pricing Information
Current Market Pricing (2025)
Speed Grade -6 (357MHz):
- Commercial (C-temp): $641.48 – $685.00 per unit
- Industrial (I-temp): Premium pricing (contact for quotation)
Speed Grade -7 (400MHz):
- Commercial (C-temp): Contact for current pricing
- Industrial (I-temp): Premium pricing for enhanced performance
Speed Grade -8 (450MHz+):
- Commercial (C-temp): Contact for current pricing
Current Stock Availability:
- IC-Components: 2,700+ units (XCV600E-FG676C)
- Xilinx-ADM: 2,899+ units (XCV600E-8FG676C)
- Various Distributors: 193-2,700 units depending on speed grade
- Octopart: 6 authorized distributors with comparative pricing
Pricing Factors:
- Speed grade selection significantly impacts cost
- Temperature grade (Commercial vs Industrial)
- Package marking and date codes
- Volume discounts available for 100+ units
- Lead times vary by specific variant
Note: XCV600E-FG676C pricing fluctuates based on speed grade and availability. This is a legacy product with limited production, so contact authorized distributors for current quotations and delivery schedules.
3. Documents & Media
Technical Documentation
- Virtex-E Family Datasheet: Complete electrical specifications and timing parameters
- FG676C Package Specifications: Mechanical drawings, dimensions, and thermal data
- Pinout Documentation: Complete 676-pin assignment with signal descriptions
- Speed Grade Comparison: Performance analysis across -6, -7, and -8 grades
Design Resources
- Reference Designs: Proven implementations showcasing 444 I/O capabilities
- PCB Layout Guidelines: FG676 package-specific design best practices
- Signal Integrity Application Notes: High-speed design considerations
- Power Distribution Guidelines: Multi-rail power supply design recommendations
Programming and Configuration
- Configuration Guide: Master Serial, Slave Serial, and SelectMAP modes
- Bitstream Generation: ISE Design Suite workflow and optimization
- Programming Hardware: Platform Cable USB/II compatibility
- Configuration Memory: PROM and Flash memory interface specifications
Development Tools
- Xilinx ISE Design Suite: Primary development environment (versions 10.1-14.7)
- IP Core Library: Pre-optimized blocks for common functions
- Simulation Models: Behavioral and timing models for verification
- Debugging Tools: ChipScope Pro embedded logic analyzer support
Application Notes
- AN-676-001: FG676C Package PCB Design Guidelines
- AN-676-002: High-Speed Signal Routing Strategies
- AN-676-003: Power Supply Design for Virtex-E FPGAs
- AN-676-004: Thermal Management in 676-Pin Applications
- AN-676-005: Migration Strategies from Other Package Types
Quality Documentation
- Reliability Analysis: MTBF calculations and qualification data
- Test Specifications: Functional and parametric test procedures
- Quality Standards: Manufacturing and assembly guidelines
- Failure Analysis: Common failure modes and prevention
4. Related Resources
Development Platforms
- Virtex-E Evaluation Boards: Complete development environments with FG676C support
- Prototyping Platforms: Specialized boards for 676-pin package development
- System Integration Platforms: Reference designs for embedded applications
- Third-Party Solutions: Ecosystem partner development boards
Compatible Products & Alternatives
- Pin-Compatible Variants:
- XCV600E-6FG676C (357MHz commercial)
- XCV600E-7FG676C (400MHz commercial)
- XCV600E-8FG676C (450MHz+ commercial)
- XCV600E-6FG676I (357MHz industrial)
- XCV600E-7FG676I (400MHz industrial)
- Package Alternatives:
- XCV600E-FG680C (680-pin, maximum I/O count)
- XCV600E-BG432C (432-pin, compact footprint)
- XCV600E-BG560C (560-pin, mid-range option)
- Capacity Variants:
- XCV400E-FG676C (lower logic capacity)
- XCV800E-FG676C (higher logic capacity)
- XCV1000E-FG676C (maximum logic capacity)
Design Tools & Software
- Primary Development Tools:
- Xilinx ISE Design Suite (recommended for Virtex-E)
- ISE WebPACK (free version with device support)
- Project Navigator (integrated design environment)
- Simulation & Verification:
- ModelSim simulation environment
- ISE Simulator (integrated solution)
- Aldec Active-HDL support
- Programming & Configuration:
- iMPACT programming software
- ChipScope Pro logic analyzer
- Platform Cable USB programming hardware
Technical Support Resources
- AMD/Xilinx Legacy Support: Comprehensive documentation archives
- Community Resources: Active FPGA forums and user groups
- Application Engineering: Expert consultation for complex designs
- Training Resources: Design methodology and best practices courses
PCB Design Support
- Layout Services: Specialized FG676C PCB design capabilities
- Assembly Partners: BGA soldering and inspection services
- Component Libraries: CAD footprints and 3D models
- Design Verification: DRC files and layout validation tools
Migration and Upgrade Paths
- Modern Alternatives: Recommended current-generation replacements
- Pin Compatibility: Migration strategies to newer devices
- Performance Scaling: Upgrade paths for enhanced performance
- Legacy Support: Long-term availability and support options
5. Environmental & Export Classifications
Environmental Specifications
- Commercial Grade (C-temp):
- Operating Temperature: 0ยฐC to +85ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- Ambient Temperature: Extended range with proper cooling
- Industrial Grade (I-temp):
- Operating Temperature: -40ยฐC to +100ยฐC
- Junction Temperature: Up to +125ยฐC maximum
- Enhanced reliability for harsh environments
- Storage and Handling:
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
Physical Characteristics
- Package Dimensions: 27mm ร 27mm ร 2.8mm (nominal)
- Weight: Approximately 3.0 grams
- Ball Count: 676 solder balls
- Ball Diameter: 0.40mm (typical)
- Ball Pitch: 1.0mm center-to-center spacing
- Substrate Material: Bismaleimide triazine (BT) organic substrate
Thermal Characteristics
- Thermal Resistance (ฮธJA):
- Still air: 16ยฐC/W (typical)
- With heatsink: 9ยฐC/W (with proper thermal interface)
- Forced convection: 12ยฐC/W (200 LFM airflow)
- Maximum Power Dissipation: Application and cooling dependent
- Thermal Interface: Exposed die pad for enhanced heat transfer
- Power Consumption: Variable by utilization and clock frequency
Compliance & Certifications
- RoHS Compliance: Varies by manufacturing date
- Pre-2006 production: May contain lead-based solder
- Post-2006 production: RoHS compliant versions available
- REACH Regulation: Compliant with EU substance restrictions
- Conflict Minerals: Compliant with industry reporting standards
- Halogen-Free: Available upon request for specific applications
Export Control Information
- ECCN Classification: Subject to U.S. Export Administration Regulations
- Export License Requirements: Required for certain countries and applications
- Technology Transfer Restrictions: Applicable to sensitive technologies
- Country of Origin: Various Asian manufacturing facilities
- Dual-Use Technology: Subject to technology transfer controls
Quality & Reliability Standards
- Quality Grades:
- Commercial grade: Standard qualification
- Industrial grade: Enhanced temperature qualification
- Qualification Testing:
- Temperature cycling: -65ยฐC to +150ยฐC
- Thermal shock: Rapid temperature transitions
- Humidity testing: 85ยฐC/85% RH
- Mechanical stress: Vibration and shock testing
- Reliability Metrics:
- MTBF calculations: Available upon request
- FIT rate specifications: Failure rate data
- Accelerated life testing: Extended reliability validation
Environmental Impact
- Sustainability Initiatives:
- Material sourcing compliance
- Manufacturing energy efficiency
- End-of-life recycling programs
- Packaging Materials:
- ESD-safe tray packaging
- Moisture-sensitive device handling
- Reduced packaging waste initiatives
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Floor Life: 168 hours at 30ยฐC/60% relative humidity
- Baking Requirements: 125ยฐC for 24 hours if MSL exceeded
- Storage Requirements: Dry pack with desiccant recommended
- Handling Procedures: ESD precautions and proper storage
Applications
The XCV600E-FG676C excels in applications requiring balanced I/O count and performance:
Telecommunications Systems:
- Base station signal processing units
- Network interface controllers
- Protocol processing engines
- High-speed data routers and switches
Industrial Automation:
- Multi-axis motion control systems
- Real-time process control
- High-resolution data acquisition
- Distributed control systems
Medical Equipment:
- MRI and CT scanner control systems for intensive image processing tasks
- Patient monitoring systems
- Laboratory automation equipment
- High-resolution imaging systems
Test & Measurement:
- Logic analyzers and protocol analyzers
- High-channel count oscilloscopes
- Automated test equipment (ATE)
- Signal generation and analysis
Signal Processing:
- Software-defined radio (SDR) implementations
- Digital signal processing applications
- Multi-channel audio processing
- Video processing and routing systems
Aerospace & Defense:
- Radar signal processing
- Communication systems
- Navigation equipment
- Electronic warfare systems
Design Considerations
FG676C Package Advantages:
- Optimal balance of I/O count (444 pins) and package size
- 27mm ร 27mm package dimensions suitable for space-constrained designs
- Proven thermal performance with proper PCB design
- Industry-standard package with extensive ecosystem support
Performance Benefits:
- Up to 130 MHz internal performance with 1.8V core voltage operation
- Multiple I/O standard support through SelectI/O+ technology
- Eight DLLs for precise clock management and timing control
- Flexible configuration modes for various system architectures
Implementation Strategies:
- Multi-layer PCB design (minimum 6 layers recommended)
- Via-in-pad technology for efficient escape routing
- Dedicated power planes for clean power distribution
- Proper thermal management for sustained performance
Legacy Considerations:
- Continued support through AMD/Xilinx legacy programs despite discontinued production
- Extensive documentation and design resource availability
- Strong community support and proven design methodologies
- Long-term availability through authorized distributors
Conclusion
The XCV600E-FG676C delivers an optimal balance of performance, I/O capability, and package efficiency for demanding embedded applications. With its robust 676-pin FBGA package, multiple speed grades, and comprehensive development ecosystem, this Virtex-E device provides designers with a proven, reliable solution for applications requiring substantial connectivity without the complexity of larger packages. The extensive supplier network and continued legacy support ensure availability for critical system designs, while the mature architecture guarantees stable, predictable performance in production environments.
