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XCV600E-7FG680I – Xilinx Virtex-E FPGA Industrial Temperature High-Performance Solution

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Part Number: XCV600E-7FG680I
  • Manufacturer: Xilinx (now AMD)
  • Product Family: Virtex-E 1.8V FPGAs
  • Speed Grade: -7 (High-performance grade)
  • Temperature Grade: Industrial (I-temp: -40ยฐC to +100ยฐC)
  • Logic Elements: 15,552 logic cells
  • Configurable Logic Blocks (CLBs): 3,456 CLBs
  • Total RAM: 294,912 RAM bits

Performance Specifications

  • System Gates: 985,882 gates
  • Internal Performance: Up to 400MHz operation
  • Process Technology: 0.18ฮผm CMOS technology
  • Core Voltage: 1.71V to 1.89V (1.8V nominal)
  • Extended Temperature Range: -40ยฐC to +100ยฐC junction temperature
  • Maximum Junction Temperature: +125ยฐC

Package Information

  • Package Type: 680-Pin Fine-pitch Ball Grid Array (FTEBGA)
  • Package Designation: FG680I (Industrial)
  • Package Dimensions: 40mm ร— 40mm surface-mount
  • I/O Count: 512 user I/O pins
  • Mounting Type: Surface Mount Technology (SMT)
  • Lead Configuration: FCBGA encapsulation

Industrial-Grade Features

  • Extended Temperature Operation: -40ยฐC to +100ยฐC for harsh environments
  • Enhanced Reliability: Industrial-grade qualification and testing
  • Robust Design: Optimized for aerospace, defense, and industrial applications
  • High I/O Count: Maximum connectivity with 512 I/O pins
  • Flexible I/O Standards: Support for multiple interface protocols
  • Advanced Clock Management: Integrated delay-locked loops (DLLs)

2. Pricing Information

Current Market Pricing (2025)

Stock Availability by Supplier:

  • IC-Components: 2,672 units available (new original)
  • Xilinx-ADM: 2,672 units in stock
  • OMO Electronic: Stock available, immediate shipping
  • B-LINKWELL Electronics: In-stock quantities available

Pricing Characteristics:

  • Industrial Premium: I-grade commands 20-40% premium over commercial C-grade
  • Temperature Range Value: Extended -40ยฐC to +100ยฐC operation justifies premium
  • High I/O Count: 680-pin package with 512 I/O represents maximum connectivity
  • Legacy Product: Limited new production, pricing reflects availability constraints

Market Positioning:

  • Premium pricing for industrial temperature range
  • Higher cost than commercial XCV600E-7FG680C variant
  • Volume discounts available for 50+ units
  • Lead times vary based on supplier inventory

Supply Chain Considerations:

  • Multiple authorized distributors maintain inventory
  • New, original factory-sealed components guaranteed
  • 365-day warranty coverage from most suppliers
  • Global shipping via DHL, FedEx, UPS, TNT

Note: XCV600E-7FG680I pricing reflects industrial-grade specifications and extended temperature range. Contact authorized distributors for current quotations and volume pricing.


3. Documents & Media

Technical Documentation

  • Virtex-E Industrial Datasheet: Complete specifications for I-temp operation
  • Temperature Derating Guidelines: Performance characteristics across full temperature range
  • FG680I Package Specifications: Industrial-grade mechanical and thermal data
  • Reliability Analysis: Industrial qualification test results and MTBF data

Design Resources

  • Industrial PCB Design Guidelines: Layout considerations for harsh environments
  • Thermal Management: Heat dissipation strategies for extended temperature operation
  • Signal Integrity Analysis: High-speed design for 680-pin industrial packages
  • Power Supply Design: Multi-rail requirements for industrial temperature range

Development Tools

  • Xilinx ISE Design Suite: Primary development environment with I-temp support
  • Industrial Timing Analysis: Temperature-dependent timing constraints
  • Configuration Tools: iMPACT programming for industrial environments
  • Simulation Models: Temperature-aware behavioral and timing models

Application Documentation

  • Industrial Application Notes: Design guidelines for harsh environments
  • Aerospace Design Guide: Space and aviation application considerations
  • Military/Defense Standards: Compliance with defense industry requirements
  • Telecommunications Infrastructure: Outdoor equipment design practices

Quality Documentation

  • Industrial Qualification Reports: Extended temperature testing results
  • Reliability Data: FIT rates and failure analysis for industrial conditions
  • Environmental Testing: Thermal cycling, shock, and vibration test results
  • Compliance Certificates: Industrial standards and military specifications

4. Related Resources

Development Platforms

  • Industrial Evaluation Boards: Ruggedized development platforms for harsh environments
  • FG680I Breakout Systems: Industrial-grade access to all 512 I/O pins
  • Environmental Test Platforms: Temperature chamber compatible development tools
  • Aerospace Reference Designs: Space-qualified design examples and templates

Compatible Products & Alternatives

  • Temperature Grade Variants:
    • XCV600E-7FG680C (Commercial: 0ยฐC to +85ยฐC)
    • XCV600E-6FG680I (Industrial: -40ยฐC to +100ยฐC, lower speed)
    • XCV600E-8FG680I (Industrial: maximum performance, if available)
  • Package Alternatives:
    • XCV600E-7BG432I (Industrial, 432-pin, compact)
    • XCV600E-7BG560I (Industrial, 560-pin, mid-range I/O)
    • XCV600E-7FG676I (Industrial, 676-pin, alternative layout)
  • Capacity Options:
    • XCV400E-7FG680I (Lower logic capacity, industrial)
    • XCV800E-7FG680I (Higher logic capacity, industrial)
    • XCV1000E-7FG680I (Maximum logic capacity, industrial)

Design Tools & Software

  • Primary Development:
    • Xilinx ISE Design Suite (versions supporting I-temp devices)
    • Industrial timing analysis and constraint tools
    • Temperature-aware place and route optimization
  • Specialized Tools:
    • Military/Aerospace design flow extensions
    • Radiation-tolerant design methodologies
    • High-reliability design verification tools
  • Programming & Test:
    • Industrial-grade programming cables and adapters
    • Environmental test integration tools
    • Boundary scan test for harsh environment validation

Technical Support Resources

  • Industrial Applications Engineering: Specialized support for harsh environment designs
  • Military/Aerospace Consultancy: Defense industry design expertise
  • Thermal Analysis Services: Thermal simulation and validation support
  • Reliability Engineering: MTBF analysis and failure mode assessment

Supply Chain Support

  • Qualified Distributors: Military and aerospace supply chain certified
  • Long-Term Availability: Industrial lifecycle support programs
  • Quality Assurance: Counterfeit detection and component authentication
  • Custom Testing: Environmental stress screening and burn-in services

5. Environmental & Export Classifications

Environmental Specifications

  • Industrial Temperature Grade (I-temp):
    • Operating Temperature: -40ยฐC to +100ยฐC
    • Junction Temperature: Up to +125ยฐC maximum
    • Storage Temperature: -65ยฐC to +150ยฐC
    • Enhanced thermal qualification for harsh environments
  • Extended Environmental Conditions:
    • Altitude: Up to 10,000 meters operational
    • Humidity: 5% to 95% relative humidity, non-condensing
    • Thermal Shock: Qualified for rapid temperature transitions
    • Vibration: Enhanced mechanical stress resistance

Physical Characteristics

  • Industrial Package Specifications:
    • Package Type: 680-FTEBGA (40mm ร— 40mm)
    • Package Height: 2.8mm maximum
    • Weight: Approximately 4.5 grams
    • Ball Count: 680 solder balls
    • Ball Diameter: 0.45mm ยฑ 0.05mm
  • Thermal Performance:
    • Thermal Resistance (ฮธJA): 12ยฐC/W (still air)
    • With industrial heatsink: 5ยฐC/W typical
    • Enhanced thermal interface for extreme conditions
    • Qualified for extended high-temperature operation

Power Requirements

  • Supply Voltage Specifications:
    • Core Voltage: 1.71V to 1.89V (1.8V nominal)
    • I/O Voltages: Variable by bank (1.2V to 3.3V)
    • Enhanced power supply rejection for industrial environments
    • Low-noise requirements for precision applications
  • Power Consumption:
    • Temperature-dependent power characteristics
    • Enhanced power efficiency at extreme temperatures
    • Industrial power management features
    • Thermal throttling for sustained operation

Compliance & Certifications

  • Industrial Standards:
    • IEC 61000 electromagnetic compatibility
    • MIL-STD-883 military standard testing (where applicable)
    • JESD47 stress test qualification
    • AEC-Q100 automotive qualification (selected applications)
  • Environmental Compliance:
    • RoHS Status: Contains lead / RoHS non-compliant
    • REACH Regulation: Compliant with EU requirements
    • Conflict Minerals: Industry standard reporting
    • WEEE Directive: Electronic waste disposal guidelines

Export Control Information

  • Enhanced Export Restrictions:
    • ECCN Classification: Subject to enhanced export controls
    • Military/Dual-Use: Potential restrictions for defense applications
    • Technology Transfer: Enhanced controls for sensitive applications
    • End-Use Monitoring: Subject to enhanced verification requirements
  • Geographic Restrictions:
    • Certain destinations require export licenses
    • Defense industry applications subject to ITAR
    • Enhanced documentation for aerospace applications
    • Compliance with international arms control agreements

Quality & Reliability Standards

  • Industrial Qualification:
    • Extended temperature cycling: -65ยฐC to +150ยฐC
    • Thermal shock testing: 1000+ cycles
    • Mechanical stress: Enhanced vibration and shock
    • Accelerated aging: High-temperature life testing
  • Reliability Metrics:
    • MTBF: Enhanced calculations for industrial conditions
    • FIT Rate: Industrial environment specifications
    • Failure Analysis: Extended temperature failure modes
    • Quality Assurance: Enhanced inspection and testing

Environmental Impact

  • Sustainable Design:
    • Long operational life reduces replacement frequency
    • Energy-efficient CMOS technology
    • Recyclable packaging materials
    • Environmental impact assessment available

Moisture Sensitivity

  • MSL Rating: Moisture Sensitivity Level 3
    • Floor Life: 168 hours at 30ยฐC/60% RH
    • Baking Requirements: 125ยฐC for 24 hours if exceeded
    • Enhanced moisture barrier packaging for harsh environments
    • Special handling procedures for industrial applications

Applications

The XCV600E-7FG680I excels in demanding industrial and harsh environment applications:

Aerospace & Defense:

  • Satellite communication systems and space-qualified electronics
  • Military radar and electronic warfare systems
  • Aircraft avionics and flight control systems
  • Missile guidance and navigation systems

Industrial Automation:

  • Outdoor industrial control systems in extreme climates
  • Oil and gas exploration equipment in harsh environments
  • Mining and heavy machinery control systems
  • Renewable energy systems (wind, solar, geothermal)

Telecommunications Infrastructure:

  • Outdoor base station equipment and cell towers
  • Submarine and maritime communication systems
  • Microwave and satellite communication links
  • Network infrastructure in extreme environments

Transportation Systems:

  • Railway signaling and control systems in all climates
  • Automotive engine management in extreme conditions
  • Marine navigation and control systems
  • Airport ground support equipment

Scientific & Research:

  • Antarctic and Arctic research equipment
  • Deep-sea exploration and underwater systems
  • High-altitude atmospheric research instruments
  • Particle accelerator control systems

Design Considerations

Industrial Temperature Advantages:

  • Reliable operation from -40ยฐC to +100ยฐC
  • Enhanced component qualification and testing
  • Proven performance in harsh environmental conditions
  • Reduced system-level thermal management requirements

Implementation Requirements:

  • Industrial-grade PCB materials and manufacturing
  • Enhanced power supply design for temperature extremes
  • Thermal interface materials for extreme conditions
  • Robust mechanical design for shock and vibration

Reliability Features:

  • Extended temperature qualification testing
  • Enhanced screening and burn-in procedures
  • Military-grade component traceability
  • Long-term availability and lifecycle support

Conclusion

The XCV600E-7FG680I delivers uncompromising performance and reliability for the most demanding industrial applications requiring operation in harsh environmental conditions. With its extended -40ยฐC to +100ยฐC temperature range, 512 I/O pins, and proven industrial-grade qualification, this Virtex-E FPGA provides designers with the ultimate solution for mission-critical applications in aerospace, defense, industrial automation, and telecommunications infrastructure. The robust supply chain support and comprehensive development ecosystem ensure continued availability and technical support for long-term industrial programs requiring maximum reliability and performance.