1. Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E 1.8V FPGAs
- Part Number: XCV600E-7FG680C
- System Gates: 985,882 gates
- Logic Gates: 186,624 gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456
- Maximum Internal Performance: 400MHz (-7 speed grade)
- Process Technology: 0.18μm CMOS, 6-layer metal
- Core Voltage: 1.8V ±5%
Memory and Storage Resources
- Total RAM Bits: 294,912 bits
- Block RAM: Multiple embedded memory blocks for data storage
- Distributed RAM: Flexible memory using CLB resources
- Configuration: SRAM-based for unlimited reprogrammability
- Memory Controllers: Support for external memory interfaces
Package and I/O Specifications
- Package Type: 680-pin Fine-Pitch Ball Grid Array (FBGA)
- Package Designation: FG680
- Package Dimensions: 40mm x 40mm footprint
- Ball Pitch: Fine-pitch for high-density interconnection
- Total Pin Count: 680 balls
- User I/O Pins: 512 user I/O pins (industry-leading connectivity)
- Mounting Type: Surface mount technology
Electrical Characteristics
- Core Voltage: 1.8V ±5% (1.71V to 1.89V)
- I/O Voltage Support: Multiple standards (1.5V to 3.3V)
- Operating Temperature: Commercial (0°C to +85°C)
- Speed Grade: -7 (400MHz maximum frequency)
- Power Consumption: Optimized for high-performance operation
- I/O Standards: 16 high-performance interface standards supported
Advanced I/O Features
- SelectI/O+ Technology: Supports 16 interface standards
- High-Speed Interfaces: LVDS, LVPECL, SSTL, HSTL support
- Differential I/O: Extensive differential pair support
- DDR Support: Double Data Rate interface capability
- Programmable Drive Strength: Adjustable output drive capability
- Input/Output Banks: Multiple independent I/O banks for flexibility
Performance Features
- Delay-Locked Loops (DLLs): 4 fully digital DLLs for clock management
- Clock Networks: Global and regional clock distribution
- Dedicated Carry Logic: High-speed arithmetic operations
- Wide-Input Functions: Support for complex combinatorial logic
- IEEE 1149.1 Boundary Scan: Complete test and debug capability
- PCI Interface Support: Full PCI bus compliance
2. Pricing Information
Current Market Pricing (2025)
- Typical Market Range: $120 – $350 USD (varies by supplier and quantity)
- Premium I/O Package: Higher pricing due to maximum I/O count
- Minimum Order Quantity: Usually 1 piece minimum
- Volume Pricing: Significant discounts for quantities >25 pieces
- Lead Time: 2-6 weeks depending on supplier availability
Pricing Factors
- Maximum I/O Count: 512 I/O pins command premium pricing
- Speed Grade: -7 speed grade represents high-performance tier
- Package Complexity: FG680 package costs more than smaller alternatives
- Market Demand: High I/O capability drives sustained demand
- Supplier Type: Authorized distributors vs. secondary market variations
Current Availability Status
- Stock Levels: 630 pieces available from IC-Components
- Multiple Sources: 2,884 pieces available from Xilinx-ADM
- Quality Assurance: New original parts with datasheet compliance
- Warranty Options: Standard 1-year warranty available
- Global Distribution: Worldwide shipping available through multiple channels
Cost-Performance Analysis
- High I/O Density: Best cost-per-I/O ratio in Virtex-E family
- Performance Value: 400MHz performance with maximum connectivity
- Design Efficiency: Reduces need for additional I/O expansion chips
- Total System Cost: Lower overall system cost due to high integration
Note: The XCV600E-7FG680C is classified as obsolete by AMD (formerly Xilinx) but remains available through distributor inventory and secondary markets. Its maximum I/O capability maintains strong demand for legacy system support and new designs requiring extensive connectivity.
3. Documents & Media
Official Technical Documentation
- Primary Datasheet: Virtex-E 1.8V Field Programmable Gate Arrays (DS022-1 v2.3)
- Package Documentation: FG680 package mechanical drawings and specifications
- Pinout Information: Complete 680-pin ball assignment and signal descriptions
- I/O Standards Guide: Comprehensive interface standard specifications
- Electrical Specifications: Timing, power, and signal integrity characteristics
High-I/O Design Resources
- PCB Design Guidelines: Layout recommendations for 680-pin FG680 package
- Signal Integrity: High-speed design practices for maximum I/O utilization
- Power Distribution: Power delivery network design for 512 I/O pins
- Thermal Management: Heat dissipation strategies for high-density packages
- I/O Planning: Methodology for optimizing pin assignment and banking
Software and Development Tools
- ISE Design Suite: Legacy development environment with full FG680 support
- PACE Pinout Tool: Pin assignment and area constraints editor
- I/O Planning Tools: Specialized tools for managing 512 I/O pins
- Timing Analysis: Static timing analysis for high-speed interfaces
- Power Estimation: Power consumption analysis for high I/O applications
Application-Specific Resources
- High-Speed Interface Design: LVDS, SSTL, and DDR implementation guides
- Multi-Standard I/O: Mixed-voltage interface design methodologies
- System Integration: Board-level design considerations for maximum I/O
- Performance Optimization: Techniques for achieving 400MHz performance
- Connectivity Solutions: Interfacing with multiple peripheral devices
Technical Support Materials
- Migration Guides: Upgrade paths to modern high-I/O FPGAs
- Design Methodology: Best practices for high-density FPGA designs
- Troubleshooting: Common issues and solutions for FG680 package
- Reference Designs: Example implementations leveraging maximum I/O capability
4. Related Resources
Speed Grade Alternatives (FG680 Package)
- XCV600E-6FG680C: -6 speed grade (357MHz, lower cost option)
- XCV600E-8FG680C: -8 speed grade (416MHz, maximum performance)
- XCV600E-4FG680C: -4 speed grade (budget-friendly alternative)
- XCV600E-5FG680C: -5 speed grade (balanced performance/cost)
Temperature Grade Variants
- XCV600E-7FG680I: Industrial temperature range (-40°C to +100°C)
- XCV600E-7FG680M: Military temperature range (if available)
Package Alternatives (Same Die, Reduced I/O)
- XCV600E-7FG676C: 676-pin FBGA package (444 I/O pins)
- XCV600E-7BG560C: 560-pin BGA package (404 I/O pins)
- XCV600E-7BG432C: 432-pin BGA package (316 I/O pins)
- XCV600E-7HQ240C: 240-pin HQFP package (158 I/O pins)
Higher-Density Virtex-E Options
- XCV1000E-7FG860C: Larger device with 860-pin package
- XCV1600E-7FG860C: Higher capacity with extensive I/O
- XCV2000E-7FG900C: Maximum density Virtex-E option
Modern High-I/O FPGA Alternatives
- Kintex-7 Series: XC7K325T, XC7K410T with high I/O count
- Virtex-7 Series: XC7V585T, XC7VX485T for maximum I/O applications
- UltraScale Architecture: High-I/O options with modern features
- Versal ACAP: Adaptive platforms with extensive connectivity
High-I/O Development Platforms
- Multi-Connector Evaluation Boards: Platforms utilizing maximum I/O
- High-Speed Interface Cards: Specialized boards for connectivity testing
- Protocol Analyzer Platforms: Tools for high-speed signal validation
- Custom Carrier Boards: Application-specific development platforms
Application Markets and Use Cases
- Telecommunications Infrastructure: Base stations, switching equipment
- High-Performance Computing: Accelerator cards, compute clusters
- Test and Measurement: Multi-channel analyzers, signal generators
- Broadcasting Equipment: Video processing, signal distribution
- Network Infrastructure: Routers, switches, protocol converters
- Medical Imaging: Multi-channel data acquisition, real-time processing
Technical Expertise Networks
- High-Speed Design Consultants: Specialists in maximum I/O utilization
- Signal Integrity Engineers: Experts in high-density package design
- FPGA Architects: Experienced in large-scale system integration
- PCB Design Services: Specialized in complex multi-layer layouts
5. Environmental & Export Classifications
Environmental Compliance
- Operating Temperature Range: Commercial (0°C to +85°C)
- Storage Temperature: -65°C to +150°C
- Junction Temperature: Up to +125°C maximum
- Humidity Range: 5% to 95% relative humidity, non-condensing
- Altitude: Sea level to 2000 meters operational
- Vibration Resistance: Standard commercial qualification
Chemical and Material Compliance
- RoHS Status: Available in both lead-free and tin/lead variants
- Lead-Free Options: Pb-free packages for environmental compliance
- REACH Compliance: European chemical safety regulation adherence
- Conflict Minerals: Full supply chain traceability and reporting
- Halogen-Free: Available in halogen-free package options
- Material Declarations: Complete material composition documentation
Export Control Classifications
- ECCN: 3A991.d (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Integrated Tariff)
- Country of Origin: Varies by manufacturing facility and date code
- Export Licensing: May require export permits for restricted destinations
- Dual-Use Technology: Subject to international trade control regulations
Quality and Reliability Standards
- Quality Level: Standard commercial grade
- Qualification Standards: JEDEC and Xilinx commercial qualification
- Reliability Testing: Temperature cycling, HTOL, and stress testing
- MTBF Data: Mean Time Between Failures calculations available
- Lot Traceability: Complete manufacturing and test history
- Quality Certifications: ISO 9001 manufacturing quality systems
Package-Specific Requirements
- ESD Sensitivity: Class 1 (≤1000V Human Body Model)
- Moisture Sensitivity Level: MSL-3 (168 hours at 30°C/60% RH)
- Baking Requirements: 125°C for 24 hours if MSL limit exceeded
- Anti-Static Protection: ESD protection required throughout handling
- Storage Conditions: Controlled humidity environment recommended
- Shipping Requirements: Anti-static packaging with environmental protection
Assembly and Manufacturing
- Solder Process Compatibility: Compatible with lead-free and eutectic processes
- Reflow Temperature Profile: Standard BGA reflow specifications
- Placement Accuracy: High-precision placement required for fine-pitch BGA
- Inspection Requirements: X-ray inspection recommended for BGA assembly
- Rework Capability: Supports standard BGA rework procedures
- Thermal Interface: Compatible with thermal management solutions
Key Benefits of XCV600E-7FG680C
Maximum I/O Capability
- Industry-Leading Connectivity: 512 user I/O pins for extensive system interfaces
- High I/O Density: Best-in-class I/O count per package footprint
- Multiple Interface Standards: Support for 16 different I/O standards
- Flexible I/O Banking: Independent voltage and standard assignment per bank
High-Performance Processing
- 400MHz Internal Performance: -7 speed grade delivers high-speed operation
- Large Logic Capacity: Nearly 1 million system gates for complex designs
- Advanced Clock Management: 4 DLLs for precise timing control
- Dedicated Arithmetic Logic: High-speed carry chains for mathematical operations
System Integration Advantages
- Reduced Component Count: Maximum I/O eliminates need for additional interface chips
- Lower System Cost: High integration reduces overall bill of materials
- Simplified Routing: Central FPGA hub simplifies PCB layout complexity
- Enhanced Reliability: Fewer components improve system reliability
Design Flexibility
- Unlimited Reprogrammability: SRAM-based configuration enables design iteration
- Multi-Standard Support: Single device supports multiple interface requirements
- Scalable Architecture: Accommodates growing system complexity
- Legacy Support: Proven technology with extensive design resources
Application Suitability
- Telecommunications: Maximum I/O ideal for switching and routing applications
- High-Speed Computing: Extensive connectivity for accelerator and co-processor designs
- Test Equipment: Multi-channel capability for comprehensive signal analysis
- Broadcasting: High-bandwidth applications requiring numerous data streams
For detailed technical specifications, current pricing, or availability information regarding the XCV600E-7FG680C high-I/O FPGA, please contact authorized electronic component distributors or specialized FPGA suppliers. This component’s maximum I/O capability makes it an ideal choice for applications requiring extensive connectivity and high-performance programmable logic functionality.
