1. Product Specifications
Core Architecture
- Part Number: XCV600E-7FG676C
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Speed Grade: -7 (High-performance grade)
- Temperature Grade: Commercial (C-temp: 0°C to +85°C)
- Logic Elements: 15,552 logic cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- System Gates: 186,624 gates (186.624K)
Performance Specifications
- Maximum Clock Frequency: 400MHz
- Internal Performance: Up to 400MHz operation
- Process Technology: 0.18μm CMOS technology
- Core Voltage: 1.8V ± 5%
- Combinatorial Delay: 0.42ns maximum
- Total RAM: 294,912 RAM bits (36kB)
Package Information
- Package Type: 676-Pin Flip-Chip Ball Grid Array (FCBGA)
- Package Designation: FG676C (Commercial)
- Package Dimensions: 27mm × 27mm
- I/O Count: 444 user I/O pins
- Pin Configuration: 676 total pins
- Mounting Type: Surface Mount Technology (SMT)
Advanced Features
- JESD-30 Code: S-PBGA-B676
- Moisture Sensitivity Level: MSL-3 (168 hours)
- Package Body Material: Plastic/Epoxy
- Status: Discontinued (legacy support available)
- Organization: 3456 CLBs, 186624 Gates
- RAM Size: 36kB total memory
2. Pricing Information
Current Market Pricing (2025)
Retail Market Pricing:
- eBay Marketplace: $460.00 – $575.00 per unit
- Single unit: $575.00
- 2+ units: $517.50 each
- 3+ units: $488.75 each
- 4+ units: $460.00 each
Distributor Pricing:
- ICQQG: $8.94 per unit (volume pricing)
- Contact for Quote: Most authorized distributors
Stock Availability:
- XI DA Electronics: 2,873 units available
- Various Distributors: Multiple suppliers maintain inventory
- eBay Sellers: 400+ units available from electronics suppliers
Pricing Characteristics:
- Legacy Product: Discontinued status affects pricing and availability
- Commercial Grade: Lower cost than industrial temperature variants
- Volume Discounts: Significant savings available for multi-unit purchases
- Market Fluctuation: Prices vary based on demand and inventory levels
Supply Chain Information:
- New, original factory-sealed components
- 365-day warranty from most distributors
- Global shipping via DHL, FedEx, UPS
- Pre-shipment inspection (PSI) available
Note: XCV600E-7FG676C pricing reflects legacy product status. Contact multiple suppliers for competitive quotations and current availability.
3. Documents & Media
Technical Documentation
- Virtex-E Family Datasheet: Complete specifications for commercial operation
- FG676C Package Specifications: Mechanical drawings and thermal characteristics
- Speed Grade -7 Analysis: Timing specifications and performance data
- Commercial Temperature Guidelines: Operating characteristics 0°C to +85°C
Design Resources
- PCB Layout Guidelines: 676-pin FCBGA design best practices
- Signal Integrity Analysis: High-speed routing for 444 I/O pins
- Power Distribution: Multi-rail power supply design recommendations
- Thermal Management: Heat dissipation strategies for commercial applications
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy support)
- Place & Route Tools: Optimized implementation for Virtex-E architecture
- Timing Analysis: Static timing analysis and constraint methodology
- Programming Solutions: iMPACT configuration and bitstream generation
Application Documentation
- Commercial Applications: Design guidelines for cost-sensitive projects
- Telecommunications: Protocol processing and infrastructure applications
- Industrial Control: Automation and process control implementations
- Embedded Systems: System-on-chip and processor interface designs
Quality Documentation
- Reliability Analysis: Commercial-grade qualification and testing
- Component Lifecycle: End-of-life planning and migration strategies
- Quality Assurance: Manufacturing test procedures and specifications
- Compliance Standards: Commercial electronics industry certifications
4. Related Resources
Development Platforms
- Virtex-E Evaluation Boards: Commercial development environments
- FG676 Breakout Boards: Access to all 444 I/O pins for prototyping
- Reference Designs: Proven commercial application implementations
- Educational Platforms: University and training program resources
Compatible Products & Alternatives
- Speed Grade Variants:
- XCV600E-6FG676C (357MHz, lower cost option)
- XCV600E-8FG676C (higher performance, limited availability)
- XCV600E-7FG676I (Industrial temperature: -40°C to +100°C)
- Package Alternatives:
- XCV600E-7BG432C (432-pin, compact footprint)
- XCV600E-7BG560C (560-pin, mid-range I/O)
- XCV600E-7FG680C (680-pin, maximum I/O count)
- Capacity Options:
- XCV400E-7FG676C (Lower logic capacity)
- XCV800E-7FG676C (Higher logic capacity)
- XCV1000E-7FG676C (Maximum logic capacity)
Design Tools & Software
- Primary Development:
- Xilinx ISE Design Suite (versions 10.1-14.7)
- ISE WebPACK (free development environment)
- Legacy tool support and maintenance
- IP Core Libraries:
- CORE Generator optimized cores
- Third-party IP solutions
- Application-specific intellectual property
- Simulation & Verification:
- ModelSim simulation environment
- ISE Simulator integration
- Timing-driven verification flows
Technical Support Resources
- Legacy Product Support: AMD/Xilinx archived documentation
- Community Resources: Virtex-E user forums and knowledge base
- Migration Planning: Upgrade paths to modern FPGA families
- Application Engineering: Commercial design consultation services
Supply Chain Support
- Authorized Distributors: Global network of certified suppliers
- Inventory Management: Stock monitoring and availability tracking
- Quality Verification: Counterfeit detection and authentication
- Lifecycle Support: Long-term availability planning and alternatives
5. Environmental & Export Classifications
Environmental Specifications
- Commercial Temperature Grade (C-temp):
- Operating Temperature: 0°C to +85°C
- Junction Temperature: Up to +125°C maximum
- Optimized for standard commercial environments
- Storage Conditions:
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Standard commercial storage requirements
- Operational Environment:
- Altitude: Up to 3,000 meters
- Standard atmospheric pressure operation
- Commercial-grade environmental resilience
Physical Characteristics
- Package Specifications:
- Package Type: 676-FCBGA (27mm × 27mm)
- Package Height: 2.5mm maximum
- Weight: Approximately 3.0 grams
- Ball Count: 676 solder balls
- Ball Pitch: Fine-pitch configuration
- Thermal Performance:
- Thermal Resistance (θJA): 13°C/W (still air)
- Enhanced thermal performance with heatsink
- Commercial temperature optimization
- Standard thermal interface requirements
Power Requirements
- Supply Specifications:
- Core Voltage: 1.8V ± 5%
- I/O Voltages: Variable by bank (1.2V to 3.3V)
- Commercial power supply tolerance
- Standard power sequencing requirements
- Power Consumption:
- Temperature-dependent characteristics
- Optimized for commercial applications
- CMOS technology for efficient operation
- Dynamic power management features
Compliance & Certifications
- Commercial Standards:
- FCC Part 15 electromagnetic compatibility
- CE marking for European markets
- Commercial electronics safety standards
- Industry standard qualification testing
- Environmental Compliance:
- RoHS Status: Varies by manufacturing date
- REACH Regulation: EU chemical safety compliance
- WEEE Directive: Electronic waste disposal guidelines
- Commercial packaging standards
Export Control Information
- Standard Export Classification:
- ECCN: Subject to U.S. Export Administration Regulations
- Commercial Use: Standard export procedures
- Technology Transfer: Commercial licensing requirements
- Geographic Restrictions: Limited sensitive destination controls
- Documentation Requirements:
- Standard commercial export documentation
- End-use certification for specific applications
- Compliance with international trade regulations
- Commercial supply chain verification
Quality & Reliability Standards
- Commercial Qualification:
- Standard temperature cycling: 0°C to +85°C
- Commercial reliability testing procedures
- Quality assurance for commercial applications
- Standard burn-in and screening processes
- Reliability Metrics:
- MTBF: Commercial environment calculations
- FIT Rate: Standard commercial specifications
- Quality Standards: Commercial electronics industry
- Failure Analysis: Standard commercial procedures
Environmental Impact
- Sustainable Design:
- Commercial lifecycle optimization
- Standard recycling procedures
- Energy-efficient CMOS technology
- Commercial packaging materials
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Floor Life: 168 hours at 30°C/60% RH
- Baking Requirements: 125°C for 24 hours if exceeded
- Standard moisture barrier packaging
- Commercial handling procedures
Applications
The XCV600E-7FG676C excels in commercial applications requiring high performance:
Telecommunications & Networking:
- Commercial communication equipment and infrastructure
- Protocol processing and packet classification systems
- Network switching and routing applications
- Digital signal processing for communication systems
Industrial Automation:
- Process control and monitoring systems
- Motor control and drive applications
- Data acquisition and instrumentation
- Human-machine interface (HMI) systems
Consumer Electronics:
- High-definition video processing and display systems
- Audio/video equipment and multimedia devices
- Gaming consoles and entertainment systems
- Smart home automation and IoT devices
Embedded Systems:
- System-on-chip (SoC) implementations
- Processor interface and acceleration
- Real-time control applications
- Custom computing solutions
Test & Measurement:
- Commercial test equipment and instrumentation
- Data acquisition and analysis systems
- Signal generation and processing
- Laboratory and educational equipment
Design Considerations
Commercial Grade Advantages:
- Cost-effective solution for standard operating environments
- Proven reliability in commercial temperature range
- Extensive development ecosystem and tool support
- Large user community and knowledge base
Implementation Guidelines:
- Standard commercial PCB design practices
- Proven thermal management for commercial environments
- Established power supply design methodologies
- Well-documented design flows and constraints
Legacy Product Considerations:
- Mature, stable development environment
- Extensive documentation and application notes
- Strong community support and resources
- Clear migration paths to modern FPGA families
Conclusion
The XCV600E-7FG676C delivers exceptional value for commercial applications requiring high-performance programmable logic capabilities. With its proven 400MHz operation, 444 I/O pins, and mature development ecosystem, this Virtex-E FPGA provides designers with a reliable, cost-effective solution for demanding commercial applications in telecommunications, industrial automation, and embedded systems. While representing a legacy product, its established architecture, comprehensive toolchain support, and available supply chain ensure continued viability for commercial systems requiring proven performance and reliability.
