1. Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E 1.8V FPGAs
- Part Number: XCV600E-7BG432I
- Temperature Grade: Industrial (“I” suffix, -40°C to +100°C)
- System Gates: 985,882 gates
- Logic Gates: 186,624 gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456
- Maximum Internal Performance: 400MHz (-7 speed grade)
- Process Technology: 0.18μm CMOS, 6-layer metal
Memory and Storage Resources
- Total RAM Bits: 294,912 bits
- Block RAM: Multiple embedded memory blocks for data storage
- Distributed RAM: Flexible memory implementation using CLB resources
- Configuration: SRAM-based for unlimited reprogrammability
- Memory Controllers: Built-in memory interface capabilities
Package and I/O Specifications
- Package Type: 432-pin Ball Grid Array (BGA)
- Package Designation: BG432
- Package Dimensions: 40mm x 40mm footprint
- Ball Pitch: 1.7mm spacing for reliable assembly
- Ball Count: 432 balls
- User I/O Pins: 316 user I/O pins
- Mounting Type: Surface mount technology
Industrial Temperature Specifications
- Operating Temperature Range: -40°C to +100°C (industrial grade)
- Storage Temperature: -65°C to +150°C
- Junction Temperature: Up to +125°C maximum
- Temperature Cycling: Qualified for extreme temperature fluctuations
- Thermal Shock Resistance: Enhanced for industrial environments
- Temperature Stability: Specified performance across full temperature range
Electrical Characteristics
- Core Voltage: 1.8V ±5% (1.71V to 1.89V)
- I/O Voltage Range: Multiple standards (1.5V to 3.3V)
- Speed Grade: -7 (400MHz maximum frequency across temperature range)
- Power Consumption: Optimized for industrial applications
- Industrial Derating: Performance specifications maintained across temperature range
Industrial-Grade Features
- Enhanced Reliability: Industrial qualification and screening processes
- Extended MTBF: Mean Time Between Failures optimized for harsh environments
- Vibration Resistance: Qualified for mechanical stress and shock
- Humidity Tolerance: Enhanced moisture resistance specifications
- ESD Protection: Robust electrostatic discharge protection
- Latch-up Immunity: Enhanced immunity to single-event effects
Advanced FPGA Capabilities
- Delay-Locked Loops (DLLs): 4 fully digital DLLs for clock management
- Clock Networks: Global and regional clock distribution
- Dedicated Carry Logic: High-speed arithmetic operations
- SelectI/O+ Technology: 16 high-performance I/O standards
- IEEE 1149.1 Boundary Scan: Complete test and debug support
- PCI Interface Support: Full PCI bus compliance
- Multi-Voltage I/O: Flexible interface voltage requirements
2. Pricing Information
Current Market Pricing (2025)
- Typical Market Range: $150 – $400 USD (varies by supplier and quantity)
- Industrial Premium: 40-60% higher than commercial grade equivalents
- Minimum Order Quantity: Usually 1 piece minimum
- Volume Pricing: Significant discounts for quantities >25 pieces
- Lead Time: 3-8 weeks depending on supplier and availability
Pricing Factors
- Industrial Qualification: Premium pricing for extended temperature range
- Speed Grade: -7 speed grade commands higher pricing than slower variants
- Compact Package: BG432 package balances cost and functionality
- Supply Constraints: Limited availability affects market pricing
- Supplier Type: Authorized distributors vs. secondary market pricing
Current Availability Status
- Stock Levels: 2,742 pieces available from Xilinx-ADM
- Multiple Sources: 950 pieces available from IC-Components
- Quality Assurance: Industrial-grade screening and testing available
- Warranty Options: Enhanced warranty for industrial applications
- Global Distribution: Worldwide shipping through specialized distributors
Cost-Performance Analysis
- Industrial Value: Optimal cost-per-gate ratio for harsh environment applications
- Space Efficiency: Compact package reduces system cost and complexity
- Reliability Investment: Higher upfront cost offset by enhanced reliability
- Total Cost of Ownership: Lower long-term costs due to reduced failure rates
Note: The XCV600E-7BG432I is classified as obsolete by AMD (formerly Xilinx) but remains available through specialized industrial component distributors. Industrial-grade variants typically maintain higher availability due to long-term support requirements in critical applications.
3. Documents & Media
Official Technical Documentation
- Primary Datasheet: Virtex-E 1.8V Field Programmable Gate Arrays (DS022-1 v2.3)
- Industrial Qualifications: Extended temperature qualification data and test reports
- Package Documentation: BG432 package mechanical drawings and thermal specifications
- Pinout Information: Complete pin assignment and industrial-grade signal descriptions
- Thermal Characteristics: Junction-to-case thermal resistance for industrial applications
Industrial Design Resources
- Thermal Design Guidelines: Heat dissipation strategies for -40°C to +100°C operation
- PCB Layout Recommendations: Industrial-grade layout practices for BG432 package
- Environmental Testing: Temperature cycling, vibration, and humidity test procedures
- Reliability Analysis: MTBF calculations and failure mode analysis for industrial use
- Derating Guidelines: Performance characteristics across full temperature range
Software and Development Tools
- ISE Design Suite: Legacy development environment with industrial temperature support
- PACE Pinout Tool: Pin assignment with industrial application considerations
- Timing Analysis: Industrial temperature timing analysis and derating
- Power Estimation: Industrial-grade power consumption calculations
- Configuration Tools: Programming procedures for harsh environment applications
Industrial Application Resources
- Automotive Guidelines: Design practices for automotive electronics applications
- Aerospace Standards: Compliance information for aerospace and defense systems
- Industrial Automation: Application notes for process control and monitoring
- Environmental Compliance: RoHS and environmental safety documentation
- Quality Certifications: ISO 9001 and industrial quality standards compliance
Technical Support Materials
- Migration Guides: Upgrade paths to modern industrial FPGA alternatives
- Troubleshooting: Industrial application specific issues and solutions
- Thermal Simulation: Junction temperature calculation for extreme environments
- Reliability Engineering: Industrial qualification and testing methodologies
4. Related Resources
Temperature Grade Alternatives
- XCV600E-7BG432C: Commercial grade (0°C to +85°C) lower-cost option
- XCV600E-7BG432M: Military grade (-55°C to +125°C) if available
- XCV600E-6BG432I: Industrial grade with -6 speed grade (357MHz)
- XCV600E-8BG432I: Industrial grade with -8 speed grade (416MHz) if available
Speed Grade Variants (BG432 Industrial)
- XCV600E-6BG432I: -6 speed grade (357MHz, industrial temperature)
- XCV600E-5BG432I: -5 speed grade (lower performance, better availability)
- XCV600E-4BG432I: -4 speed grade (cost-optimized industrial option)
Package Alternatives (Same Die, Industrial Grade)
- XCV600E-7BG560I: 560-pin BGA industrial package (404 I/O pins)
- XCV600E-7FG680I: 680-pin FBGA industrial package (512 I/O pins)
- XCV600E-7FG676I: 676-pin FBGA industrial package (444 I/O pins)
- XCV600E-7HQ240I: 240-pin HQFP industrial package (158 I/O pins)
Modern Industrial FPGA Alternatives
- Artix-7 Industrial: XC7A100T-I, XC7A200T-I series (-40°C to +100°C)
- Kintex-7 Industrial: XC7K325T-I, XC7K410T-I for higher performance
- Spartan-7 Industrial: XC7S25-I, XC7S50-I for cost-optimized designs
- Automotive FPGAs: AEC-Q100 qualified for automotive applications
Industrial Development Resources
- Environmental Test Equipment: Temperature chambers and cycling equipment
- Industrial Evaluation Boards: Ruggedized development platforms
- Thermal Analysis Tools: Temperature monitoring and management systems
- Industrial Connectors: Harsh environment connector systems and cabling
Application Markets and Industries
- Automotive Electronics: Engine control units, safety systems, ADAS
- Aerospace and Defense: Avionics, radar systems, communications equipment
- Industrial Automation: Process control, robotics, machine vision systems
- Energy and Utilities: Smart grid equipment, power generation control
- Transportation: Railway systems, marine electronics, traffic control
- Medical Equipment: Industrial-grade imaging systems, patient monitoring
Technical Expertise Networks
- Industrial FPGA Specialists: Engineers experienced with harsh environment designs
- Automotive Electronics Consultants: AEC-Q100 and automotive qualification experts
- Aerospace Design Engineers: DO-254 and aerospace qualification specialists
- Thermal Management Experts: Industrial cooling and thermal design consultants
- Reliability Engineers: Industrial qualification and lifecycle management specialists
5. Environmental & Export Classifications
Industrial Environmental Compliance
- Operating Temperature Range: -40°C to +100°C (industrial qualification)
- Storage Temperature: -65°C to +150°C
- Junction Temperature: Up to +125°C maximum rated
- Thermal Cycling: Qualified for -40°C to +100°C temperature cycling
- Humidity Range: 5% to 95% relative humidity, non-condensing
- Vibration Resistance: Enhanced mechanical stress qualification
- Shock Resistance: Industrial-grade mechanical shock tolerance
Chemical and Material Compliance
- RoHS Compliance: Available in both lead-free and tin/lead variants
- Lead-Free Status: Pb-free options for environmental compliance
- REACH Compliance: European chemical safety regulation compliance
- Conflict Minerals: Complete supply chain traceability and reporting
- Halogen-Free: Available in halogen-free package variants
- Material Declarations: Full material composition for industrial compliance
Export Control and Trade Classifications
- ECCN: 3A991.d (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Integrated Tariff)
- Country of Origin: Varies by manufacturing facility and qualification
- Export Licensing: May require export permits for certain military/aerospace applications
- Dual-Use Technology: Subject to international trade control regulations
Industrial Quality and Reliability Standards
- Quality Level: Industrial grade with enhanced qualification testing
- Qualification Standards: MIL-STD-883, JEDEC, and Xilinx industrial standards
- Reliability Testing: Extended temperature cycling, HTOL, and accelerated stress testing
- MTBF Calculations: Industrial-grade Mean Time Between Failures data
- Lot Traceability: Complete manufacturing history and industrial test data
- Quality Certifications: ISO 9001, TS 16949 automotive quality compliance
Package and Handling Requirements
- ESD Sensitivity: Class 1 (≤1000V Human Body Model)
- Moisture Sensitivity Level: MSL-3 (Moisture Sensitivity Level 3)
- Baking Requirements: 125°C for 24 hours if MSL exceeded
- Anti-Static Protection: ESD protection required throughout handling and storage
- Storage Conditions: Controlled temperature and humidity environment
- Shipping Requirements: Anti-static packaging with environmental protection
Industrial Assembly and Manufacturing
- Solder Process Compatibility: Lead-free and eutectic solder processes
- Reflow Temperature Profile: Industrial-grade temperature cycling requirements
- Assembly Qualification: Enhanced assembly process qualification for industrial use
- Quality Inspection: X-ray and functional testing for industrial applications
- Rework Capability: Supports standard BGA rework procedures
- Thermal Interface: Compatible with industrial thermal management solutions
Key Benefits of XCV600E-7BG432I
Industrial-Grade Environmental Capability
- Extended Temperature Operation: -40°C to +100°C for harsh environment applications
- Enhanced Reliability: Industrial qualification ensures robust long-term operation
- Vibration and Shock Tolerance: Suitable for mobile and mechanically stressed environments
- Thermal Cycling Resistance: Qualified for extreme temperature fluctuation applications
Compact High-Performance Design
- Space-Efficient Package: 432-pin BGA maximizes functionality in constrained designs
- High-Speed Operation: 400MHz performance maintained across full temperature range
- Substantial Logic Capacity: Nearly 1 million system gates for complex industrial applications
- Flexible I/O: 316 user I/O pins with industrial-grade drive capability
Industrial Application Advantages
- Automotive Suitability: Appropriate for engine control, safety, and ADAS applications
- Aerospace Qualification: Suitable for avionics and defense system applications
- Industrial Control: Process automation and monitoring system compatibility
- Energy Applications: Smart grid and power generation control implementations
Design and Development Benefits
- Proven Industrial Technology: Mature platform with extensive harsh environment experience
- Legacy System Support: Maintains compatibility with existing industrial designs
- Cost-Effective Solution: Optimal price-performance for space-constrained industrial applications
- Migration Path: Clear upgrade options to modern industrial FPGA alternatives
Long-Term Value Proposition
- Extended Lifecycle: Industrial qualification supports long product lifecycles
- Reduced Maintenance: Enhanced reliability reduces field service requirements
- Supply Chain Stability: Industrial component channels provide better long-term availability
- Total Cost Optimization: Higher reliability reduces total cost of ownership
For detailed specifications, current availability, or pricing information regarding the XCV600E-7BG432I industrial-grade FPGA, please contact specialized industrial component distributors or certified Xilinx industrial suppliers. This component’s combination of compact packaging and industrial temperature qualification makes it ideal for space-constrained applications in automotive, aerospace, and industrial automation systems requiring reliable operation in harsh environments.
