1. Product Specifications
Core Architecture
- Part Number: XCV600E-7BG432C0773
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Logic Capacity: 186.624K system gates
- Logic Cells: 15,552 cells
- Operating Frequency: 400MHz maximum
- I/O Count: 316 user I/O pins
Process Technology
- Manufacturing Process: 0.18μm CMOS technology
- Metal Layers: 6-layer metal process for enhanced routing
- Core Voltage: 1.8V operation
- I/O Voltage: Supports multiple I/O standards
Package Information
- Package Type: 432-Pin Ball Grid Array (BGA)
- Package Designation: BG432
- Speed Grade: -7 (High-performance grade)
- Temperature Grade: Commercial (C-temp: 0°C to +85°C)
- Pin Configuration: 432-pin array with exposed pad
Key Features
- Compact BGA432 package for space-constrained designs
- High-speed programmable logic optimized for place-and-route efficiency
- Rich interconnect hierarchy with fast, flexible routing resources
- Advanced 6-layer metal CMOS process for superior performance
- 316 I/O pins supporting various signaling standards
- Excellent silicon efficiency compared to mask-programmed alternatives
2. Pricing Information
Current Market Pricing (2025)
Volume Pricing Tiers:
- 1+ units: $682.21 – $684.86
- 10+ units: $672.03 – $684.25
- 30+ units: $661.84 – $683.57
- 50+ units: $651.66 – $682.89
- 100+ units: $641.48 – $682.21
Supplier Options:
- Xilinx Authorized Distributors: Starting at $682.21/unit
- Rochester Electronics LLC: $684.86 per unit
- Alternative Sources: Contact for volume pricing
Stock Availability:
- Multiple suppliers report 2,600+ units in stock
- New, original factory-sealed components
- Immediate availability for most quantities
Note: Pricing varies by supplier and market conditions. Contact authorized distributors for current quotations and bulk discounts. Minimum order quantities may apply.
3. Documents & Media
Technical Documentation
- Product Datasheet: XCV600E Virtex-E FPGA Family Complete Datasheet (PDF)
- BGA432 Package Specifications: Mechanical drawings and dimensions
- Pinout Documentation: Complete pin assignment and signal mapping
- Speed Grade Analysis: Timing specifications and performance characteristics
Design Resources
- Reference Designs: Proven implementation examples and templates
- Application Notes: BGA432 PCB layout guidelines and best practices
- Thermal Management: Heat dissipation guidelines for BGA432 package
- Signal Integrity: High-speed design considerations and recommendations
Development Tools
- ISE Design Suite: Legacy design environment compatibility
- Programming Solutions: Configuration and bitstream generation tools
- Simulation Models: Behavioral and timing models for verification
- IP Core Library: Pre-optimized intellectual property blocks
Quality Documentation
- Test Reports: Electrical and functional test specifications
- Reliability Data: MTBF calculations and failure analysis
- Manufacturing Information: Assembly and quality control procedures
- Compliance Certificates: RoHS and environmental compliance documentation
4. Related Resources
Development Platforms
- Evaluation Boards: Virtex-E development and prototyping platforms
- BGA432 Breakout Boards: PCB solutions for prototyping and testing
- Reference Platforms: Complete system-level development environments
- Third-Party Boards: Compatible development solutions from partners
Compatible Products
- Pin-Compatible Alternatives: XCV600E-6BG432C (lower speed grade)
- Package Variants: XCV600E-7FG676C0773 (higher I/O count)
- Capacity Options: XCV400E and XCV800E series alternatives
- Temperature Grades: Industrial and extended temperature variants
Design Tools & Software
- Xilinx ISE WebPACK: Free development environment
- Place & Route Tools: Optimized implementation software
- Timing Analysis: Static timing analysis and constraint tools
- Debug Solutions: ChipScope Pro embedded logic analyzer support
Technical Support Resources
- AMD/Xilinx Documentation Portal: Complete technical library
- Community Forums: Design support and troubleshooting resources
- Application Engineering: Expert consultation for complex implementations
- Training Materials: Design methodology and best practices guides
PCB Design Support
- Layout Guidelines: BGA432 PCB design recommendations
- Via-in-Pad Technology: Advanced routing techniques for dense designs
- Thermal Vias: Heat management strategies for BGA packages
- Assembly Guidelines: Manufacturing and soldering best practices
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature Range: 0°C to +85°C (Commercial grade)
- Junction Temperature: Up to +125°C maximum
- Storage Temperature Range: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Thermal Resistance (θJA): Package-dependent specifications
Physical Characteristics
- Package Dimensions: 27mm x 27mm x 2.8mm (typical BGA432)
- Ball Pitch: 1.27mm standard BGA spacing
- Weight: Approximately 2.5 grams
- Moisture Sensitivity Level: MSL-3 classification
Compliance & Certifications
- RoHS Compliance: Variable by manufacturing date and supplier
- REACH Regulation: Compliant with EU chemical regulations
- Lead-Free Options: Available in lead-free solder ball configurations
- Halogen-Free: Select variants available upon request
Export Control Information
- ECCN Classification: Subject to U.S. Export Administration Regulations (EAR)
- Export License Requirements: May require approval for certain destinations
- Country of Origin: Manufacturing facilities in Asia-Pacific region
- Dual-Use Technology: Subject to technology transfer restrictions
Quality & Reliability Standards
- Quality Grade: Commercial/Industrial grade device
- Qualification Standards: Full Xilinx qualification testing procedures
- Reliability Testing: Temperature cycling, thermal shock, and life testing
- Failure Rate: Low FIT (Failures in Time) specifications available
- Package Quality: Industry-standard BGA assembly and test procedures
Environmental Impact
- Material Composition: Silicon die with standard packaging materials
- Recycling Information: Electronic waste disposal guidelines
- Energy Efficiency: Low-power CMOS technology implementation
- Sustainable Manufacturing: Adherence to environmental manufacturing standards
Applications
The XCV600E-7BG432C0773 excels in applications requiring:
Embedded Systems:
- Industrial automation and control systems
- Medical device instrumentation
- Automotive electronics (non-safety-critical)
- Portable and battery-powered devices
Communications Infrastructure:
- Wireless base station equipment
- Network interface cards
- Protocol processing engines
- Data acquisition systems
Signal Processing:
- Digital signal processing applications
- Real-time data filtering and analysis
- High-speed data conversion interfaces
- Audio/video processing systems
Prototyping & Development:
- ASIC/ASSP prototyping and validation
- Algorithm development and testing
- Educational and research platforms
- Legacy system upgrades and maintenance
Design Considerations
BGA432 Package Advantages:
- Reduced PCB footprint compared to larger packages
- Cost-effective solution for moderate I/O requirements
- Suitable for single-layer escape routing strategies
- Good thermal performance with proper via placement
Implementation Benefits:
- Proven Virtex-E architecture with extensive design support
- Compatible with existing ISE design flows
- Comprehensive IP core library availability
- Strong community support and documentation
Conclusion
The XCV600E-7BG432C0773 delivers exceptional value for applications requiring high-performance FPGA capabilities in a compact form factor. With its robust 432-pin BGA package, 400MHz operation, and comprehensive development ecosystem, this Virtex-E device provides designers with a reliable, cost-effective solution for demanding embedded applications. The extensive supplier network ensures consistent availability, while the proven architecture guarantees long-term design stability and support.
