1. Product Specifications
Core Architecture
- Part Number: XCV600E-7BG432C
- Manufacturer: Xilinx (now AMD)
- Product Family: Virtex-E 1.8V FPGAs
- Speed Grade: -7 (High-performance grade)
- Temperature Grade: Commercial (C-temp: 0°C to +85°C)
- Logic Elements: 15,552 logic cells
- Configurable Logic Blocks (CLBs): 3,456 CLBs
- System Gates: 186.624K gates (985,882 equivalent gates)
Performance Specifications
- Maximum Clock Frequency: 400MHz
- Internal Performance: Up to 400MHz operation
- Process Technology: 0.18μm 6-layer metal CMOS
- Core Voltage: 1.71V to 1.89V (1.8V nominal)
- Supply Voltage Range: 1.71V ~ 1.89V
- Total RAM: 294,912 RAM bits
Package Information
- Package Type: 432-Pin Ball Grid Array (BGA)
- Package Designation: BG432C (Commercial)
- Package Case: 432-LBGA Exposed Pad, Metal
- I/O Count: 316 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
- Ball Pitch: 1.27mm standard BGA spacing
Compact Design Features
- Space-Efficient: Compact BGA432 package for board space optimization
- Cost-Effective: Balanced I/O count and performance for commercial applications
- High Integration: Maximum logic density in minimal footprint
- Proven Reliability: Commercial-grade qualification and testing
- Design Flexibility: 316 I/O pins supporting multiple interface standards
- Legacy Support: Mature development ecosystem and extensive documentation
2. Pricing Information
Current Market Pricing (2025)
Distributor Pricing:
- FPGAkey: $154.41 – $616.38 per unit (volume dependent)
- Price range varies significantly based on quantity
- Volume discounts available for larger orders
Stock Availability:
- Ovaga Technologies: 3,854 units available (new original)
- BOSER Technology: 35,060 units in stock
- Elcodis Sources: Multiple suppliers with 3,000-10,000 units
- eBay Marketplace: Engineering samples and new units available
Pricing Characteristics:
- Legacy Product: Discontinued status affects pricing structure
- Commercial Grade: Lower cost than industrial temperature variants
- Compact Package: Cost-effective alternative to higher pin-count packages
- Volume Sensitive: Significant price reduction for bulk orders
Market Positioning:
- Most economical option in XCV600E family for moderate I/O requirements
- Competitive pricing for space-constrained commercial applications
- 365-day warranty coverage from most distributors
- Global shipping via DHL, FedEx, UPS available
Supply Chain Information:
- New, original factory-sealed components guaranteed
- Pre-shipment inspection (PSI) available
- Multiple authorized and independent distributors
- Long-term availability planning support
Note: XCV600E-7BG432C pricing reflects legacy product status with significant volume discounts available. Contact multiple suppliers for competitive quotations.
3. Documents & Media
Technical Documentation
- Virtex-E Family Datasheet: Complete specifications for commercial operation
- BG432C Package Specifications: Mechanical drawings and thermal characteristics
- Pinout Documentation: Complete 432-pin assignment and 316 I/O mapping
- Speed Grade -7 Analysis: Timing specifications and performance characteristics
Design Resources
- Compact PCB Design Guidelines: BGA432 layout best practices for space optimization
- Signal Integrity Analysis: High-speed routing for 316 I/O pins
- Power Distribution: Efficient power supply design for compact packages
- Thermal Management: Heat dissipation strategies for BGA432 packages
Development Tools
- Xilinx ISE Design Suite: Primary development environment (legacy support)
- Place & Route Optimization: Floorplanning for compact package constraints
- Timing Analysis: Static timing analysis for 400MHz operation
- Programming Solutions: iMPACT configuration and bitstream generation
Application Documentation
- Space-Constrained Design Guidelines: Optimizing designs for compact packages
- Commercial Applications: Cost-effective implementation strategies
- Interface Design: Multiple I/O standard support and implementation
- Migration Planning: Upgrade paths and pin-compatible alternatives
Quality Documentation
- Commercial Qualification: Standard commercial-grade testing procedures
- Reliability Analysis: MTBF calculations and failure rate specifications
- Package Quality: BGA assembly and inspection guidelines
- Lifecycle Management: End-of-life planning and alternative options
4. Related Resources
Development Platforms
- Compact Evaluation Boards: Space-optimized development environments
- BG432 Breakout Boards: Access to all 316 I/O pins for prototyping
- Educational Platforms: Training and university program resources
- Reference Designs: Proven compact application implementations
Compatible Products & Alternatives
- Speed Grade Variants:
- XCV600E-6BG432C (357MHz, lower cost option)
- XCV600E-8BG432C (higher performance, limited availability)
- XCV600E-7BG432I (Industrial temperature: -40°C to +100°C)
- Package Alternatives:
- XCV600E-7BG560C (560-pin, higher I/O count)
- XCV600E-7FG676C (676-pin, maximum I/O)
- XCV600E-7FG680C (680-pin, highest I/O count)
- Capacity Options:
- XCV400E-7BG432C (Lower logic capacity, same package)
- XCV800E-7BG432C (Higher logic capacity, same package)
- XCV1000E-7BG432C (Maximum logic capacity, same package)
Design Tools & Software
- Primary Development:
- Xilinx ISE Design Suite (versions 10.1-14.7)
- ISE WebPACK (free development environment)
- Floorplanning tools for compact package optimization
- Specialized Tools:
- Compact design constraint methodologies
- Pin assignment optimization tools
- Thermal analysis for BGA packages
- IP Core Libraries:
- CORE Generator optimized cores
- Space-efficient IP implementations
- Interface IP for multiple standards
Technical Support Resources
- Compact Design Consultancy: Space-optimization design services
- Legacy Product Support: AMD/Xilinx archived documentation
- Migration Planning: Upgrade paths to modern FPGA families
- Community Resources: Virtex-E user forums and knowledge sharing
Supply Chain Support
- Multiple Source Suppliers: Extensive distributor network
- Inventory Management: Stock monitoring and availability tracking
- Quality Verification: Counterfeit detection and authentication services
- Lifecycle Support: Long-term availability planning and alternatives
5. Environmental & Export Classifications
Environmental Specifications
- Commercial Temperature Grade (C-temp):
- Operating Temperature: 0°C to +85°C
- Junction Temperature: Up to +125°C maximum
- Optimized for standard commercial environments
- Storage Conditions:
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Standard commercial packaging and storage
- Operational Environment:
- Altitude: Up to 3,000 meters operational
- Standard atmospheric pressure operation
- Commercial-grade environmental qualification
Physical Characteristics
- Package Specifications:
- Package Type: 432-LBGA Exposed Pad, Metal
- Ball Count: 432 solder balls
- Ball Pitch: 1.27mm standard spacing
- Package Height: Standard BGA profile
- Thermal Performance:
- Thermal Resistance: Package-dependent characteristics
- Enhanced thermal performance with exposed pad
- Commercial temperature optimization
- Standard thermal interface requirements
Power Requirements
- Supply Specifications:
- Core Voltage: 1.71V to 1.89V (1.8V nominal)
- I/O Voltages: Variable by bank (1.2V to 3.3V)
- Commercial power supply tolerance
- Standard power sequencing requirements
- Power Consumption:
- Optimized for commercial applications
- CMOS technology for efficient operation
- Dynamic power management capabilities
- Thermal-aware power optimization
Compliance & Certifications
- Commercial Standards:
- FCC Part 15 electromagnetic compatibility
- CE marking for European commercial markets
- Commercial electronics safety standards
- Standard commercial qualification testing
- Environmental Compliance:
- Lead Free Status: Contains lead / RoHS non-compliant
- REACH Regulation: EU chemical safety compliance
- WEEE Directive: Electronic waste disposal guidelines
- Standard commercial packaging requirements
Export Control Information
- Standard Export Classification:
- ECCN: Subject to U.S. Export Administration Regulations
- Commercial Use: Standard export procedures
- Technology Transfer: Commercial licensing requirements
- Geographic Restrictions: Limited sensitive destination controls
- Documentation Requirements:
- Standard commercial export documentation
- End-use certification for specific applications
- Compliance with international trade regulations
- Commercial supply chain verification procedures
Quality & Reliability Standards
- Commercial Qualification:
- Standard temperature cycling: 0°C to +85°C
- Commercial reliability testing procedures
- Quality assurance for commercial applications
- Standard screening and burn-in processes
- Reliability Metrics:
- MTBF: Commercial environment calculations
- FIT Rate: Standard commercial specifications
- Quality Standards: Commercial electronics industry compliance
- Failure Analysis: Standard commercial procedures
Environmental Impact
- Sustainable Design:
- Commercial lifecycle optimization
- Standard recycling and disposal procedures
- Energy-efficient CMOS technology implementation
- Commercial packaging material standards
Moisture Sensitivity
- MSL Rating: Standard Moisture Sensitivity Level classification
- Commercial handling and storage requirements
- Standard moisture barrier packaging
- Baking procedures if moisture limits exceeded
- Commercial assembly guidelines and procedures
Applications
The XCV600E-7BG432C excels in space-constrained commercial applications:
Embedded Systems & IoT:
- Compact embedded control systems and smart devices
- IoT gateway and edge computing applications
- Portable instrumentation and handheld devices
- Battery-powered and space-limited designs
Consumer Electronics:
- Set-top boxes and multimedia entertainment systems
- Gaming consoles and interactive entertainment devices
- Smart home automation and control systems
- Audio/video processing in compact form factors
Industrial Control:
- Compact process control and monitoring systems
- Sensor interface and data acquisition modules
- Motor control drives in space-limited enclosures
- Human-machine interface (HMI) implementations
Communications:
- Small form factor communication modules
- Protocol processing in compact equipment
- Network interface and switching applications
- Telecommunications infrastructure components
Test & Measurement:
- Portable test equipment and instrumentation
- Data acquisition systems in compact packages
- Laboratory equipment with space constraints
- Educational and research platform implementations
Design Considerations
Compact Package Advantages:
- Optimal balance of I/O count (316) and board space efficiency
- Cost-effective solution for moderate connectivity requirements
- Proven BGA432 package with established design guidelines
- Suitable for automated assembly and high-volume manufacturing
Implementation Guidelines:
- Standard commercial PCB design practices
- Efficient routing strategies for 316 I/O pins
- Thermal management appropriate for commercial environments
- Power supply design optimized for compact packages
Space Optimization:
- Careful pin assignment planning for compact layouts
- Layer stack optimization for signal integrity
- Component placement strategies for thermal management
- Design rule verification for manufacturing constraints
Conclusion
The XCV600E-7BG432C delivers exceptional value for commercial applications requiring high-performance programmable logic in a compact form factor. With its proven 400MHz operation, 316 I/O pins, and space-efficient BGA432 package, this Virtex-E FPGA provides designers with an optimal solution for space-constrained commercial applications in embedded systems, consumer electronics, and industrial control. The extensive supplier network, mature development ecosystem, and proven commercial reliability ensure continued viability for cost-sensitive designs requiring the perfect balance of performance, connectivity, and board space efficiency.
