1. Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-E 1.8V FPGAs
- Part Number: XCV600E-6HQ240I
- Temperature Grade: Industrial (“I” suffix, -40°C to +100°C)
- System Gates: 985,882 gates
- Logic Gates: 186,624 gates
- Logic Cells: 15,552 cells
- Configurable Logic Blocks (CLBs): 3,456
- Maximum Internal Performance: 357MHz (-6 speed grade)
- Process Technology: 0.18μm CMOS, 6-layer metal
Memory and Storage Resources
- Total RAM Bits: 294,912 bits
- Block RAM: Multiple embedded memory blocks
- Distributed RAM: Flexible memory implementation using CLBs
- Configuration: SRAM-based for unlimited reprogrammability
- Memory Controllers: Built-in memory interface capabilities
Package Information
- Package Type: 240-pin Heat-Sink Quad Flat Package (HQFP)
- Package Designation: HQ240
- Package Dimensions: 40mm x 40mm body size
- Pin Pitch: 0.8mm lead spacing
- Lead Count: 240 leads
- User I/O Pins: 158 user I/O pins
- Thermal Enhancement: Heat-sink compatible for improved thermal management
Electrical Characteristics
- Core Voltage: 1.8V ±5% (1.71V to 1.89V)
- I/O Voltage Range: Multiple standards (1.5V to 3.3V)
- Operating Temperature: Industrial (-40°C to +100°C)
- Storage Temperature: -65°C to +150°C
- Speed Grade: -6 (357MHz maximum frequency)
- Junction Temperature: Up to +125°C
- Power Consumption: Optimized for cost-effective industrial applications
Industrial-Grade Features
- Extended Temperature Range: -40°C to +100°C operation
- Enhanced Reliability: Industrial qualification and screening
- Improved MTBF: Mean Time Between Failures for industrial environments
- Thermal Cycling: Resistant to temperature fluctuations
- Vibration Resistance: Qualified for mechanical stress environments
- Cost-Effective Design: Balanced performance and pricing for volume applications
Advanced FPGA Features
- Delay-Locked Loops (DLLs): 4 fully digital DLLs for clock management
- Clock Networks: Global and regional clock distribution
- Dedicated Carry Logic: High-speed arithmetic operations
- SelectI/O+ Technology: 16 high-performance I/O standards
- IEEE 1149.1 Boundary Scan: Complete test and debug support
- PCI Interface Support: Compatible with PCI bus standards
- On-Chip RAM: Configurable memory blocks for data storage
2. Pricing Information
Current Market Pricing (2025)
- Typical Market Range: $65 – $180 USD (varies by supplier and quantity)
- Cost-Effective Positioning: Most affordable industrial-grade option in XCV600E family
- Minimum Order Quantity: Usually 1 piece minimum
- Volume Pricing: Significant discounts for quantities >100 pieces
- Lead Time: 1-6 weeks depending on supplier and availability
Pricing Factors
- Industrial Grade Premium: 15-30% higher than commercial grade equivalents
- Speed Grade Value: -6 speed grade offers best price/performance ratio
- Package Cost: HQFP package more cost-effective than BGA alternatives
- Market Position: Positioned as budget-friendly industrial solution
- Volume Discounts: Attractive pricing for mid to high-volume production
Current Availability Status
- Strong Stock Levels: 2,754 pieces available from Xilinx-ADM
- Multiple Sources: 572 pieces available from IC-Components
- Quality Assurance: Industrial-grade testing and screening
- Warranty Options: 365-day warranty available from select suppliers
- Global Distribution: Worldwide availability through multiple distributors
Cost-Performance Analysis
- Best Value Proposition: Optimal balance of performance, features, and cost
- Industrial Qualification: Extended temperature capability at competitive pricing
- Lower Total Cost: Reduced system costs through high integration
- Volume Economics: Attractive for cost-sensitive high-volume applications
Note: The XCV600E-6HQ240I offers the best price-to-performance ratio in the industrial-grade XCV600E family, making it ideal for applications requiring extended temperature operation without premium speed requirements. Current availability through multiple distributors ensures reliable supply for production planning.
3. Documents & Media
Official Technical Documentation
- Primary Datasheet: Virtex-E 1.8V Field Programmable Gate Arrays (DS022-1 v2.3)
- Industrial Specifications: Extended temperature qualification data
- Package Documentation: HQ240 package mechanical drawings and specifications
- Pinout Information: Complete 240-pin assignment and signal descriptions
- Thermal Characteristics: Junction-to-ambient thermal resistance data
Cost-Effective Design Resources
- PCB Design Guidelines: Cost-optimized layout practices for HQFP packages
- Thermal Design Guidelines: Heat-sink selection for budget-conscious designs
- Power Management: Techniques for minimizing power consumption and costs
- Design Optimization: Best practices for achieving performance targets economically
- Industrial Application Notes: Cost-effective design practices for harsh environments
Software and Development Tools
- ISE Design Suite: Legacy development environment with full HQ240 support
- PACE Pinout Tool: Pin assignment and constraints editor
- Cost Optimization Tools: Design tools for achieving target costs
- Timing Analysis: Industrial temperature timing analysis
- Power Estimation: Power consumption optimization for cost reduction
Value Engineering Resources
- Cost Reduction Techniques: Methods for optimizing design costs
- Performance Tuning: Achieving maximum performance from -6 speed grade
- Industrial Design Methodology: Cost-effective practices for extended temperature designs
- Migration Guides: Cost-effective upgrade paths from older FPGAs
- Reference Designs: Cost-optimized example implementations
Quality and Compliance Documentation
- Industrial Qualification: Temperature cycling and environmental testing
- Cost-Quality Balance: Documentation on industrial-grade value proposition
- Reliability Data: Industrial temperature reliability analysis
- RoHS Compliance: Environmental compliance for cost-conscious designs
- Supply Chain: Cost-effective sourcing and availability documentation
4. Related Resources
Speed Grade Alternatives (HQ240 Package, Industrial Temperature)
- XCV600E-4HQ240I: -4 speed grade (lower cost, reduced performance)
- XCV600E-5HQ240I: -5 speed grade (intermediate cost/performance)
- XCV600E-7HQ240I: -7 speed grade (higher performance, premium pricing)
- XCV600E-8HQ240I: -8 speed grade (maximum performance, if available)
Temperature Grade Variants (Same Speed and Package)
- XCV600E-6HQ240C: Commercial grade (0°C to +85°C, lower cost)
- XCV600E-6HQ240M: Military grade (-55°C to +125°C, premium pricing)
Package Alternatives (Same Die, Industrial Grade)
- XCV600E-6BG432I: 432-pin BGA industrial package (more I/O)
- XCV600E-6BG560I: 560-pin BGA industrial package (maximum I/O)
- XCV600E-6FG680I: 680-pin FBGA industrial package (highest I/O count)
- XCV600E-6FG676I: 676-pin FBGA industrial package alternative
Cost-Optimized Modern Alternatives
- Spartan-7 Industrial: XC7S25I, XC7S50I series (modern cost-effective options)
- Artix-7 Industrial: XC7A35TI, XC7A50TI (higher performance industrial FPGAs)
- Automotive-Grade FPGAs: AEC-Q100 qualified for automotive cost targets
- Commercial-Grade Options: Consider temperature requirements vs. cost savings
Industrial Development Platforms
- Cost-Effective Evaluation Boards: Budget-friendly development platforms
- Industrial Prototyping: Cost-optimized development and testing solutions
- Thermal Testing Equipment: Temperature cycling for industrial validation
- Industrial Connectors: Cost-effective harsh environment connection systems
Target Applications and Markets
- Industrial Automation: Process control, motor drives, monitoring systems
- Automotive Electronics: Body control, engine management, safety systems
- Cost-Sensitive Telecom: Base station controllers, small cell equipment
- Medical Equipment: Patient monitoring, diagnostic instruments
- Transportation: Rail systems, fleet management, navigation equipment
- HVAC Systems: Building automation, climate control, energy management
Technical Support Networks
- Cost-Effective Design Consultants: Specialists in budget-conscious FPGA designs
- Industrial Design Services: Experts in extended temperature applications
- Volume Manufacturing Support: Services for high-volume cost-sensitive production
- Thermal Management Consultants: Cost-effective cooling solutions
- Supply Chain Partners: Distributors specializing in industrial components
5. Environmental & Export Classifications
Industrial Environmental Compliance
- Operating Temperature Range: -40°C to +100°C (industrial grade)
- Storage Temperature: -65°C to +150°C
- Junction Temperature: Up to +125°C maximum
- Thermal Cycling: Qualified for -40°C to +100°C cycling
- Humidity Range: 5% to 95% relative humidity, non-condensing
- Vibration Resistance: Industrial-grade mechanical stress qualification
- Shock Resistance: Industrial environmental stress qualification
Chemical and Material Compliance
- RoHS Compliance: Available in both lead-free and tin/lead variants
- Lead-Free Status: Pb-free options for environmental requirements
- REACH Compliance: European chemical safety regulation compliance
- Conflict Minerals: Full supply chain traceability and reporting
- Halogen-Free: Available in halogen-free package variants
- Material Composition: Complete material declaration for industrial use
Export Control and Trade Classifications
- ECCN: 3A991.d (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Integrated Tariff)
- Country of Origin: Varies by manufacturing location and date code
- Export Licensing: May require export permits for certain destinations
- Dual-Use Technology: Subject to international trade regulations
Industrial Quality and Reliability Standards
- Quality Level: Industrial grade with enhanced qualification
- Qualification Standards: JEDEC, MIL-STD-883, and Xilinx industrial standards
- Reliability Testing: Extended temperature cycling, HTOL, and stress testing
- MTBF Calculations: Industrial-grade Mean Time Between Failures data
- Lot Traceability: Complete manufacturing history and test data
- Quality Certifications: ISO 9001, ISO 14001 manufacturing compliance
Package and Handling Requirements
- ESD Sensitivity: Class 1 (≤1000V Human Body Model)
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3)
- Baking Requirements: 125°C for 24 hours if MSL exceeded
- Anti-Static Protection: ESD protection required throughout handling
- Storage Conditions: Controlled temperature and humidity environment
- Shipping Requirements: Anti-static packaging and environmental protection
Industrial Assembly and Manufacturing
- Solder Process Compatibility: Lead-free and eutectic solder processes
- Reflow Temperature Profile: Industrial-grade temperature cycling
- Assembly Cost: HQFP package reduces assembly costs vs. BGA
- Quality Inspection: AOI and functional testing for industrial applications
- Heat-Sink Mounting: Compatible with standard heat-sink attachment methods
- Thermal Interface Materials: TIM compatibility for enhanced thermal management
Key Benefits of XCV600E-6HQ240I
Cost-Effective Industrial Solution
- Best Price/Performance: Optimal balance of industrial features and competitive pricing
- Extended Temperature Operation: -40°C to +100°C for industrial environments
- Cost-Conscious Design: Lower-cost alternative to higher speed grades
- Volume Pricing: Attractive economics for medium to high-volume applications
Practical Performance Features
- 357MHz Performance: Sufficient speed for most industrial applications
- Substantial Logic Capacity: Nearly 1 million system gates for complex designs
- Adequate I/O Count: 158 user I/O pins for typical system interfaces
- Proven Reliability: Mature industrial-grade qualification and testing
Assembly and Manufacturing Advantages
- HQFP Package Benefits: Lower assembly costs compared to BGA packages
- Heat-Sink Compatibility: Enhanced thermal management at reasonable cost
- Standard Assembly: Compatible with standard SMT assembly equipment
- Inspection Friendly: Visual inspection possible with HQFP package
Design and Development Benefits
- Mature Technology: Proven platform with extensive design resources
- Legacy Support: Maintains compatibility with existing industrial designs
- Cost-Effective Migration: Affordable upgrade path from older FPGAs
- Industrial Design Support: Specialized expertise available for harsh environment applications
Market Positioning Advantages
- Budget-Friendly Industrial: Lower cost than premium speed grades
- Competitive Alternative: Cost-effective option vs. competitor industrial FPGAs
- Volume Production: Ideal for cost-sensitive high-volume industrial applications
- Supply Security: Multiple distributor sources ensure reliable availability
For detailed specifications, current pricing, or availability information regarding the XCV600E-6HQ240I cost-effective industrial-grade FPGA, please contact electronic component distributors or specialized FPGA suppliers. This component offers the best value proposition in the industrial XCV600E family for applications requiring extended temperature operation with balanced performance and cost requirements.
